Crack bifurcation in sharp V-notches

2020 ◽  
Vol 110 ◽  
pp. 102790 ◽  
Author(s):  
Majid R. Ayatollahi ◽  
Robab Bahadori ◽  
Bahador Bahrami ◽  
M. Yazid Yahya ◽  
Filippo Berto
Keyword(s):  
Crack Bifurcation

Thermoresponsive Toughening with Crack Bifurcation in Phase-Separated Hydrogels under Isochoric Conditions

2016 ◽  
Vol 28 (28) ◽  
pp. 5857-5864 ◽  
Author(s):  
Hui Guo ◽  
Nicolas Sanson ◽  
Dominique Hourdet ◽  
Alba Marcellan
Keyword(s):  
Crack Bifurcation

scholarly journals Thermoresponsive Toughening with Crack Bifurcation in Phase-Separated Hydrogels under Isochoric Conditions

2016 ◽  
Vol 28 (33) ◽  
pp. 7043-7043 ◽  
Author(s):  
Hui Guo ◽  
Nicolas Sanson ◽  
Dominique Hourdet ◽  
Alba Marcellan
Keyword(s):  
Crack Bifurcation

Method for successive photographing of rapid crack bifurcation by means of high-speed holographic microscopy

2001 ◽  
Author(s):  
Shinichi Suzuki ◽  
Kenichi Sakaue ◽  
Yasuyuki Morita ◽  
Taichi Mori
Keyword(s):  
High Speed ◽  
Holographic Microscopy ◽  
Crack Bifurcation

The Rapid Tearing of a Half Plane

1985 ◽  
Vol 52 (1) ◽  
pp. 51-56
Author(s):  
J. P. Dempsey ◽  
E. B. Smith
Keyword(s):  
Stress Intensity ◽  
Analytic Function ◽  
Conformal Mapping ◽  
Crack Propagation ◽  
Function Theory ◽  
Elastic Half Space ◽  
Intensity Factors ◽  
Crack Propagation Velocity ◽  
Crack Bifurcation ◽  
Mechanical Disturbances

The surface of an elastic half space is subjected to sudden antiplane mechanical disturbances. Crack initiation and subsequent crack instability are examined via two idealized problems; the first is concerned with instantaneous crack bifurcation and the second with instantaneous skew crack propagation. In either problem, crack propagation occurs at a constant subsonic velocity under an angle κπ with the normal to the surface. For the externally applied disturbances that are considered here, and for contstant crack-tip velocities, the particle velocity and τθz are functions of r/t and θ only, which allows Chaplygin’s transformation and conformal mapping to be used. The problems can then be solved using analytic function theory. For various values of the angle of crack propagation, the dependence of the elastodynamic stress intensity factors on the crack propagation velocity is investigated. For certain specific geometries, fully analytical solutions are derived to provide check cases.

Influence of temperature rise at the crack tip on crack bifurcation

1984 ◽  
Vol 24 (1) ◽  
pp. R23-R32 ◽  
Author(s):  
V. G. Ukadgaonker ◽  
S. K. Chadda ◽  
S. K. Maiti
Keyword(s):  
Temperature Rise ◽  
Crack Tip ◽  
Influence Of Temperature ◽  
Crack Bifurcation

Modelling of Crack Bifurcation in Laminar Ceramics with Large Compressive Stress

2011 ◽  
Vol 488-489 ◽  
pp. 130-133
Author(s):  
Michal Kotoul ◽  
Oldřich Ševeček ◽  
Tomáš Profant
Keyword(s):  
Crack Propagation ◽  
Compressive Stress ◽  
Expansion Method ◽  
Bimaterial Interface ◽  
Matched Asymptotic Expansion ◽  
Straight Crack ◽  
Crack Penetration ◽  
Micro Cracks ◽  
Finite Fracture Mechanics ◽  
Crack Bifurcation

Ceramic laminates designed with strong interfaces have shown crack growth resistance (R-curve) behaviour through microstructural design (e.g. grain size, layer composition) and/or due to the presence of compressive residual stresses, acting as a barrier to crack propagation. The goal of the contribution is to model the mechanism of crack bifurcation in laminar ceramics with large compressive stress which still have not been satisfactory explained. Experimental observations of the crack path in the multilayered ceramics tested under several kinds of loading showed crack penetration (i.e. crack propagating normal to the layers followed by crack bifurcation when the crack propagated from the tensile to the compressive layer. Numerical results [1] show that the initiation of crack bifurcation can be explained by the near-tip J-integral, provided that micro-cracks exist near the crack tip. We revisit the problem using the concept of Finite fracture mechanics and the matched asymptotic expansion method in order to evaluate the energy release rate criteria describing the competition of the crack bifurcation and straight crack propagation near behind the bimaterial interface.

Failure Behaviour of High Toughness Multi-Layer Si3N4 and Si3N4-TiN Based Laminates

2005 ◽  
Vol 290 ◽  
pp. 175-182 ◽  
Author(s):  
Gurdial Blugan ◽  
Richard Dobedoe ◽  
I. Gee ◽  
Nina Orlovskaya ◽  
Jakob Kübler
Keyword(s):  
Fracture Toughness ◽  
High Temperature ◽  
Residual Stresses ◽  
Crack Propagation ◽  
Failure Mechanisms ◽  
High Strength ◽  
Crack Deflection ◽  
High Toughness ◽  
Energy Absorbing ◽  
Crack Bifurcation

Multi-layer laminates were produced using alternating layers of Si3N4 and Si3N4+TiN. The differences in the coefficient of thermal expansions between the alternating layers lead to residual stresses after cooling. These are compressive in the Si3N4 layers and tensile in the Si3N4+TiN layers. The existence of these stresses in the laminates effect the crack propagation behaviour during failure. Different designs of laminates were produced with external layers under compression and tension exhibiting different failure mechanisms. Facture toughness was measured by SEVNB method. In systems with external layers under compression the measured fracture toughness was up to three times that of Si3N4, i.e. up to 17 MPa m1/2. In systems with external layers under tension during failure the energy absorbing effects of crack deflection and crack bifurcation were obtained. High temperature tests were performed to determine the onset temperature for residual stresses in these laminates. Micro-laminates with compressive layers of only 30 µm thickness with high strength and fracture toughness and were manufactured.

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