Curing kinetics and thermal stability of novel siloxane-containing benzoxazines

2019 ◽  
Vol 671 ◽  
pp. 119-126 ◽  
Author(s):  
Jilei Xu ◽  
Hui Li ◽  
Kai Zeng ◽  
Gaoxu Li ◽  
Xuhong Zhao ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Curing Kinetics ◽  
Thermal Stability Of

The Synthesis of Silicon-Containing Epoxy Resin and its Application in Environmentally-Friendship Epoxy Molding Compound for IC Packaging

2011 ◽  
Vol 211-212 ◽  
pp. 638-642 ◽  
Author(s):  
Ming Shan Yang ◽  
Jian Wei Liu ◽  
Lin Kai Li
Keyword(s):  
Thermal Stability ◽  
Epoxy Resin ◽  
Curing Kinetics ◽  
Curing Temperature ◽  
Molding Compound ◽  
Ic Packaging ◽  
Ortho Cresol ◽  
Novolac Epoxy ◽  
Kinetics Of ◽  
Thermal Stability Of

Silicon-containing epoxy resin (CNE-Si) was synthesized from diphenylsilandiol (DPSD) and ortho-cresol novolac epoxy resin using SnCl2 as catalyst. The chemical structure of CNE-Si prepared in this paper was characterized by 1H-NMR and FTIR. The thermal stability was analyzed by TGA. The result showed that the –Si- group enhanced the thermal stability of the epoxy resin. The curing kinetics of the system was studied by non-isothermal DSC. The kinetic parameters of the curing reaction including the activation energy were calculated using Kissinger and Ozawa method. The results showed that the system containing CNE-Si has lower curing temperature and more quick curing speed compared to CNE, which can be used for manufacturing the quick-curing EMCs or afterward-curing-free EMCs.

Studies of the curing kinetics and thermal stability of epoxy resins using a mixture of amines and anhydrides

2006 ◽  
Vol 100 (5) ◽  
pp. 3919-3925 ◽  
Author(s):  
Ritu Jain ◽  
Parveen Kukreja ◽  
A. K. Narula ◽  
Veena Chaudhary
Keyword(s):  
Thermal Stability ◽  
Epoxy Resins ◽  
Curing Kinetics ◽  
Thermal Stability Of
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