Curing kinetics and thermal stability of diglycidyl ether of bisphenol

2008 ◽  
Vol 91 (1) ◽  
pp. 231-236 ◽  
Author(s):  
P. Sharma ◽  
V. Choudhary ◽  
A. K. Narula
Keyword(s):  
Thermal Stability ◽  
Curing Kinetics ◽  
Diglycidyl Ether ◽  
Thermal Stability Of

Curing kinetics and thermal stability of novel siloxane-containing benzoxazines

2019 ◽  
Vol 671 ◽  
pp. 119-126 ◽  
Author(s):  
Jilei Xu ◽  
Hui Li ◽  
Kai Zeng ◽  
Gaoxu Li ◽  
Xuhong Zhao ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Curing Kinetics ◽  
Thermal Stability Of

Epoxy Cured with Anhydride Terminated Polydimethylsiloxane: Cure Kinetics and Thermal Properties

2011 ◽  
Vol 415-417 ◽  
pp. 261-264
Author(s):  
Yuan Ren ◽  
Zheng Xi ◽  
Wen Jun Gan ◽  
Liang Zhang ◽  
Jing Zhang ◽  
...  
Keyword(s):  
Activation Energy ◽  
Thermal Stability ◽  
Thermal Properties ◽  
Succinic Anhydride ◽  
Cure Kinetics ◽  
Diglycidyl Ether ◽  
Scanning Calorimetry ◽  
Thermogravimetric Analyses ◽  
Isothermal Measurements ◽  
Thermal Stability Of

A siloxane-containing dianhydride, succinic anhydride terminated polydimethylsiloxane (DMS-Z21) was selected to cure diglycidyl ether of bisphenol-A based epoxy resin (DGEBA). The cure kinetics and thermal properties were investigated by nonisothermal and isothermal differential scanning calorimetry (DSC) and thermogravimetric analyses (TGA), respectively. The activation energy (Ea) of the curing reaction was obtained based on the methods of Kissinger and isothermal measurements. The results of the thermogravimetric analyses of the DGEBA/DMS-Z21 system showed that the thermal stability of the DGEBA/DMS-Z21 system was slightly higher than the DGEBA/MeTHPA system.

scholarly journals Thermal and Mechanical Interfacial Behaviors of Graphene Oxide-Reinforced Epoxy Composites Cured by Thermal Latent Catalyst

Materials ◽  
2019 ◽  
Vol 12 (8) ◽  
pp. 1354 ◽  
Author(s):  
Shahina Riaz ◽  
Soo-Jin Park
Keyword(s):  
Thermal Stability ◽  
Fracture Toughness ◽  
Graphene Oxide ◽  
Mechanical Performance ◽  
Gradual Increase ◽  
Diglycidyl Ether ◽  
Crack Deflection ◽  
Epoxy Composites ◽  
Curing Agent ◽  
Thermal Stability Of

A series of composites was prepared from a diglycidyl ether of bisphenol A (DGEBA) with different graphene filler contents to improve their mechanical performance and thermal stability. Graphene oxide (GO) and GO modified with hexamethylene tetraamine (HMTA) were selected as reinforcing agents. As a latent cationic initiator and curing agent, N-benzylepyrizinium hexafluoroantimonate (N-BPH) was used. The effect of fillers and their contents on the mechanical properties and thermal stability of the composites were studied. Fracture toughness improved by 23% and 40%, and fracture energy was enhanced by 1.94- and 2.27-fold, for the composites containing 0.04 wt.% GO and HMTA-GO, respectively. The gradual increase in fracture toughness at higher filler contents was attributed to both crack deflection and pinning mechanisms. Maximum thermal stability in the composites was achieved by using up to 0.1 wt.% graphene fillers.

The Synthesis of Silicon-Containing Epoxy Resin and its Application in Environmentally-Friendship Epoxy Molding Compound for IC Packaging

2011 ◽  
Vol 211-212 ◽  
pp. 638-642 ◽  
Author(s):  
Ming Shan Yang ◽  
Jian Wei Liu ◽  
Lin Kai Li
Keyword(s):  
Thermal Stability ◽  
Epoxy Resin ◽  
Curing Kinetics ◽  
Curing Temperature ◽  
Molding Compound ◽  
Ic Packaging ◽  
Ortho Cresol ◽  
Novolac Epoxy ◽  
Kinetics Of ◽  
Thermal Stability Of

Silicon-containing epoxy resin (CNE-Si) was synthesized from diphenylsilandiol (DPSD) and ortho-cresol novolac epoxy resin using SnCl2 as catalyst. The chemical structure of CNE-Si prepared in this paper was characterized by 1H-NMR and FTIR. The thermal stability was analyzed by TGA. The result showed that the –Si- group enhanced the thermal stability of the epoxy resin. The curing kinetics of the system was studied by non-isothermal DSC. The kinetic parameters of the curing reaction including the activation energy were calculated using Kissinger and Ozawa method. The results showed that the system containing CNE-Si has lower curing temperature and more quick curing speed compared to CNE, which can be used for manufacturing the quick-curing EMCs or afterward-curing-free EMCs.

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