Chemical mechanical polishing characteristics in (Bi,La)Ti3O12 damascene process for high-density ferroelectric memories

Thin Solid Films ◽

10.1016/j.tsf.2006.11.176 ◽

2007 ◽

Vol 515 (16) ◽

pp. 6456-6459 ◽

Author(s):

Nam-Hoon Kim ◽

Sang-Hun Shin ◽

Pil-Ju Ko ◽

Woo-Sun Lee

Keyword(s):

Chemical Mechanical Polishing ◽

High Density ◽

Mechanical Polishing ◽

Damascene Process ◽

Ferroelectric Memories

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Submicron Ferroelectric Capacitors Fabricated by Chemical Mechanical Polishing Process for High-Density Ferroelectric Memories

Japanese Journal of Applied Physics ◽

10.1143/jjap.39.2083 ◽

2000 ◽

Vol 39 (Part 1, No. 4B) ◽

pp. 2083-2086 ◽

Author(s):

Yasushi Igarashi ◽

Kouichi Tani ◽

Masanori Kasai ◽

Kinya Ashikaga ◽

Toshio Ito

Keyword(s):

Chemical Mechanical Polishing ◽

High Density ◽

Mechanical Polishing ◽

Polishing Process ◽

Chemical Mechanical Polishing Process ◽

Ferroelectric Memories ◽

Ferroelectric Capacitors

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Electrical properties of Pb(Zr,Ti)O3/CeO2/Si MFIS structure fabricated by chemical mechanical polishing (CMP) damascene process

2008 17th IEEE International Symposium on the Applications of Ferroelectrics ◽

10.1109/isaf.2008.4693729 ◽

2008 ◽

Author(s):

Nam-Hoon Kim ◽

Pil-Ju Ko ◽

Woo-Sun Lee

Keyword(s):

Electrical Properties ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Damascene Process ◽

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Polishing damages to electrical properties of BLT thin film capacitors fabricated by damascene process of chemical mechanical polishing

2008 17th IEEE International Symposium on the Applications of Ferroelectrics ◽

10.1109/isaf.2008.4693730 ◽

2008 ◽

Author(s):

Nam-Hoon Kim ◽

Pan-Gum Jung ◽

Pil-Ju Ko ◽

Woo-Sun Lee

Keyword(s):

Thin Film ◽

Electrical Properties ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Damascene Process ◽

Thin Film Capacitors

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Aluminum-germanium-copper multilevel damascene process using low temperature reflow sputtering and chemical mechanical polishing

Proceedings of 1994 IEEE International Electron Devices Meeting ◽

10.1109/iedm.1994.383454 ◽

2002 ◽

Author(s):

K. Kikuta ◽

Y. Hayashi ◽

T. Nakajima ◽

K. Harashima ◽

T. Kikkawa

Keyword(s):

Low Temperature ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Damascene Process

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Chemical mechanical polishing of aluminum for the 0.18 μm dual damascene process

Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) ◽

10.1109/iitc.1998.704754 ◽

2002 ◽

Author(s):

S. Kordic ◽

C.A.H. Mutsaers ◽

H. Lifka ◽

M.N. Webster

Keyword(s):

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Dual Damascene ◽

Damascene Process

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Aluminum-germanium-copper multilevel damascene process using low-temperature reflow sputtering and chemical mechanical polishing

IEEE Transactions on Electron Devices ◽

10.1109/16.491250 ◽

1996 ◽

Vol 43 (5) ◽

pp. 739-745 ◽

Author(s):

K. Kikuta ◽

Y. Hayashi ◽

T. Nakajima ◽

K. Harashima ◽

T. Kikkawa

Keyword(s):

Low Temperature ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Damascene Process

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Platinum chemical mechanical polishing (CMP) characteristics for high density ferroelectric memory applications

Microelectronic Engineering ◽

10.1016/j.mee.2007.05.027 ◽

2007 ◽

Vol 84 (11) ◽

pp. 2702-2706 ◽

Author(s):

Nam-Hoon Kim ◽

Pil-Ju Ko ◽

Seock Koo Kang ◽

Woo-Sun Lee

Keyword(s):

Chemical Mechanical Polishing ◽

High Density ◽

Mechanical Polishing ◽

Ferroelectric Memory ◽

Memory Applications

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Influence of a post–chemical mechanical polishing cleaning process on the ferroelectric properties of a Pb(Zr,Ti)O3 thin film capacitor fabricated by the damascene process

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films ◽

10.1116/1.2900712 ◽

2008 ◽

Vol 26 (4) ◽

pp. 720-723

Author(s):

Nam-Hoon Kim ◽

Young-Kil Jun ◽

Pil-Ju Ko ◽

Woo-Sun Lee

Keyword(s):

Thin Film ◽

Chemical Mechanical Polishing ◽

Ferroelectric Properties ◽

Mechanical Polishing ◽

Cleaning Process ◽

Film Capacitor ◽

Thin Film Capacitor ◽

Damascene Process

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The Copper Damascene Process and Chemical Mechanical Polishing

Copper Interconnect Technology ◽

10.1007/978-1-4419-0076-0_6 ◽

2009 ◽

pp. 267-300 ◽

Author(s):

Tapan Gupta

Keyword(s):

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Damascene Process

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Chemical mechanical polishing of BTO thin film for vertical sidewall patterning of high-density memory capacitor

Thin Solid Films ◽

10.1016/j.tsf.2005.09.170 ◽

2006 ◽

Vol 504 (1-2) ◽

pp. 261-264 ◽

Author(s):

Nam-Hoon Kim ◽

Pil-Ju Ko ◽

Yong-Jin Seo ◽

Woo-Sun Lee

Keyword(s):

Thin Film ◽

Chemical Mechanical Polishing ◽

High Density ◽

Mechanical Polishing ◽

Vertical Sidewall

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