Adhesion strength measurement of polymer dielectric interfaces using laser spallation technique

2008 ◽  
Vol 516 (21) ◽  
pp. 7627-7635 ◽  
Author(s):  
Soma Sekhar V. Kandula ◽  
Cheryl D. Hartfield ◽  
Philippe H. Geubelle ◽  
Nancy R. Sottos
Keyword(s):  
Adhesion Strength ◽  
Strength Measurement ◽  
Laser Spallation ◽  
Polymer Dielectric ◽  
Dielectric Interfaces

Hydrodynamically-Confined Microflows for Cell Adhesion Strength Measurement

2010 ◽  
Author(s):  
Kevin V. Christ ◽  
Kevin T. Turner
Keyword(s):  
Cell Adhesion ◽  
Adhesion Strength ◽  
Cell Biology ◽  
Microfluidic Devices ◽  
Cell Behavior ◽  
Shear Stresses ◽  
Strength Measurement ◽  
Coated Surfaces ◽  
Biology Research ◽  
Standard Techniques

Cell adhesion plays a fundamental role in numerous physiological and pathological processes, and measurements of the adhesion strength are important in fields ranging from basic cell biology research to the development of implantable biomaterials. Our group and others have recently demonstrated that microfluidic devices offer advantages for characterizing the adhesion of cells to protein-coated surfaces [1,2]. Microfluidic devices offer many advantages over conventional assays, including the ability to apply high shear stresses in the laminar regime and the opportunity to directly observe cell behavior during testing. However, a key disadvantage is that such assays require cells to be cultured inside closed microchannels. Assays based on closed channels restrict the types of surfaces that can be examined and are not compatible with many standard techniques in cell biology research. Furthermore, while techniques for cell culture in microchannels have become common, maintaining the viability of certain types of cells in channels remains a challenge.

Analysis of Adhesion Strength of Interfaces Between Thin Films Using Molecular Dynamics Technique

1999 ◽  
Vol 594 ◽  
Author(s):  
T. Iwasaki ◽  
H. Miura
Keyword(s):  
Molecular Dynamics ◽  
Fracture Energy ◽  
Adhesion Strength ◽  
Scratch Testing ◽  
Adhesive Fracture ◽  
Total Potential ◽  
Metal Metal ◽  
Dielectric Interfaces ◽  
The Difference ◽  
Type Potential

AbstractWe have developed a molecular-dynamics technique for determining the adhesion strength of the interfaces between different materials. In this technique the extended Tersoff-type potential is applied to calculate the adhesive fracture energy defined as the difference between the total potential energy of the material-connected state and that of the material-separated state. The adhesion strength of metal/dielectric interfaces as well as metal/metal interfaces is discussed based on this fracture energy. We used this technique to determine the adhesion strength of the interfaces between ULSI-interconnect materials (Al and Cu) and diffusionbarrier materials (TiN and W). The calculated adhesive fracture energy shows that the adhesion strength increases in the order: Cu/TiN, Cu/W, Al/W, and Al/TiN. Because this result was confirmed by scratch testing on the film-laminated structure, this technique is considered to be effective for determining the adhesion strength.

Molecular dynamics analysis of adhesion strength of interfaces between thin films

2001 ◽  
Vol 16 (6) ◽  
pp. 1789-1794 ◽  
Author(s):  
T. Iwasaki ◽  
H. Miura
Keyword(s):  
Molecular Dynamics ◽  
Fracture Energy ◽  
Adhesion Strength ◽  
Dielectric Material ◽  
Barrier Materials ◽  
Adhesive Fracture ◽  
Total Potential ◽  
Metal Metal ◽  
Dielectric Interfaces ◽  
The Difference

We have developed a molecular-dynamics technique for determining the adhesion strength of the interfaces between different materials. This technique evaluates the adhesion strength by calculating the adhesive fracture energy defined as the difference between the total potential energy of the material-connected state and that of the material-separated state. The extended Tersoff-type potential is applied to calculate the adhesive fracture energy of metal/dielectric interfaces as well as metal/metal interfaces. We used the technique to determine the adhesion strength of the interfaces between ULSI-interconnect materials (Al and Cu) and diffusion-barrier materials (TiN and W). It was also applied to determine the adhesion strength of interfaces between the interconnect materials and a dielectric material (SiO2). Because the adhesion strength determined by this technique agrees well with that measured by scratch testing, this technique is considered to be effective for determining the adhesion strength.

Evaluation of laser spallation as a technique for measurement of cell adhesion strength

2007 ◽  
Vol 82A (4) ◽  
pp. 852-860 ◽  
Author(s):  
Elizabeth Hagerman ◽  
Jaewoo Shim ◽  
Vijay Gupta ◽  
Ben Wu
Keyword(s):  
Cell Adhesion ◽  
Adhesion Strength ◽  
Laser Spallation

Droplet freezing and ice adhesion strength measurement on super-cooled hydrophobic surfaces

2015 ◽  
Vol 93 (5) ◽  
pp. 375-388 ◽  
Author(s):  
Brendan McDonald ◽  
Poonam Patel ◽  
Boxin Zhao
Keyword(s):  
Adhesion Strength ◽  
Hydrophobic Surfaces ◽  
Strength Measurement ◽  
Ice Adhesion
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