Microstructural, thermal and mechanical behavior of co-sputtered binary Zr–Cu thin film metallic glasses

2014 ◽  
Vol 561 ◽  
pp. 53-59 ◽  
Author(s):  
M. Apreutesei ◽  
P. Steyer ◽  
L. Joly-Pottuz ◽  
A. Billard ◽  
J. Qiao ◽  
...  
Keyword(s):  
Thin Film ◽  
Mechanical Behavior ◽  
Metallic Glasses ◽  
Cu Thin Film

Effects of annealing on mechanical behavior of Zr–Ti–Ni thin film metallic glasses

2014 ◽  
Vol 608 ◽  
pp. 258-264 ◽  
Author(s):  
Chu-Shuan Chen ◽  
Pakman Yiu ◽  
Chia-Lin Li ◽  
Jinn P. Chu ◽  
Chan-Hung Shek ◽  
...  
Keyword(s):  
Thin Film ◽  
Mechanical Behavior ◽  
Metallic Glasses

Development of Cu-Clad Metallic Glass for Soldering

2012 ◽  
Vol 706-709 ◽  
pp. 1343-1347 ◽  
Author(s):  
Takeshi Terajima
Keyword(s):  
Thin Film ◽  
Metallic Glass ◽  
Oxide Film ◽  
Metallic Glasses ◽  
Direct Contact ◽  
Native Oxide ◽  
Surface Oxide Film ◽  
Clad Layer ◽  
Free Solder ◽  
Cu Thin Film

Soldering is a potential technique for joining metallic glasses. It can be performed at far below the crystallization temperature of various metallic glasses; thus, there is no possibility of crystallization. However, Cu-Zr-based metallic glass displays poor wettability to Pb-free solder, because a strong native oxide film prevents direct contact between the solder and the glass. To overcome this problem, Cu-Zr-based metallic glass clad with a thin film of Cu has been developed. This was produced by casting the melt of a Cu36Zr48Al8Ag8 pre-alloy into a Cu mold cavity, inside which a thin film of Cu with a thickness of 2 μm was placed. Cu36Zr48Al8Ag8 metallic glass was successfully formed and welded to the Cu thin film. From microstructure analysis, it was found that a reaction layer was formed at the interface between the Cu and the Cu36Zr48Al8Ag8 metallic glass. However, no oxide layer was observed in the Cu-clad layer. It was found that the Cu cladding played an important role in preventing the formation of the surface oxide film. Consequently, solderability to the Cu-Zr-based metallic glass was drastically improved.

Zr–Cu thin film metallic glasses: An assessment of the thermal stability and phases’ transformation mechanisms

2015 ◽  
Vol 619 ◽  
pp. 284-292 ◽  
Author(s):  
M. Apreutesei ◽  
P. Steyer ◽  
A. Billard ◽  
L. Joly-Pottuz ◽  
C. Esnouf
Keyword(s):  
Thin Film ◽  
Thermal Stability ◽  
Metallic Glasses ◽  
Transformation Mechanisms ◽  
Cu Thin Film

Effect of Strain Rates on the Mechanical Behavior of Cu Thin Films of Various Thicknesses

2013 ◽  
Vol 284-287 ◽  
pp. 94-97
Author(s):  
Kuan Jung Chung ◽  
Chi Feng Lin ◽  
W. C. Chiang
Keyword(s):  
Thin Film ◽  
Strain Rate ◽  
Mechanical Behavior ◽  
Strain Rate Sensitivity ◽  
Testing Machine ◽  
Rate Sensitivity ◽  
Strain Rates ◽  
Tensile Testing Machine ◽  
Cu Film ◽  
Cu Thin Film

The objective of this study is to investigate the mechanical behavior of copper thin film with different thicknesses subjected to varying strain rates. A micro-force tensile testing machine (MTS Tytron 250) was used to test the polyimide samples coated with different thicknesses of copper (500 nm, 750 nm, 1000 nm, and 1500 nm). The experiments were conducted by applying test vehicles to different strain rates (1.6×10-4s-1, 1.6×10-3s-1, and 1.6×10-2s-1). The experimental results showed the strain rate and the thickness have obvious influence upon the mechanical properties of Cu thin film. The yield stress increases as increasing the strain rate or decreasing the thickness of Cu film. For considering the strain rate sensitivity m, the strain rate sensitivity m is found that it increases as decreasing the thickness to imply that Cu film has high strain-rate response at low thickness.

scholarly journals Morphology of cracks and shear bands in polymer-supported thin film metallic glasses

2021 ◽  
pp. 102547
Author(s):  
Oleksandr Glushko ◽  
Christoph Gammer ◽  
Lisa-Marie Weniger ◽  
Huaping Sheng ◽  
Christian Mitterer ◽  
...  
Keyword(s):  
Thin Film ◽  
Metallic Glasses ◽  
Shear Bands ◽  
Polymer Supported

A New Specimen for Measuring the Interfacial Toughness of Al-0.5%Cu Thin Film on Si Substrate

2005 ◽  
Vol 297-300 ◽  
pp. 521-526
Author(s):  
Insu Jeon ◽  
Masaki Omiya ◽  
Hirotsugu Inoue ◽  
Kikuo Kishimoto ◽  
Tadashi Asahina
Keyword(s):  
Thin Film ◽  
The Finite Element Method ◽  
Si Substrate ◽  
Detailed Structure ◽  
Micro Fabrication ◽  
Interfacial Toughness ◽  
Linear Elastic ◽  
Elastic Fracture ◽  
Cu Thin Film ◽  
Research Show

A new specimen is proposed to measure the interfacial toughness between the Al-0.5%Cu thin film and the Si substrate. The plain and general micro-fabrication processes are sufficient to fabricate the specimen. With the help of the finite element method and the concepts of the linear elastic fracture mechanics, the detailed structure for this specimen is modeled and evaluated. The results obtained from this research show that the proposed specimen provides efficient and convenient method to measure the interfacial toughness between the Al-Cu thin film and the Si substrate.

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