Enhanced thermal conductivity interface by covalently bridging on cu-zn alloy with functionalized graphene through pulse electrodeposition

2020 ◽  
Vol 709 ◽  
pp. 138126
Author(s):  
Hongqiang Wang ◽  
Shaoyi Wang ◽  
Feiyan Lai ◽  
Xingcun He ◽  
Youguo Huang ◽  
...  
IEEE Access ◽  
2021 ◽  
Vol 9 ◽  
pp. 31575-31580
Author(s):  
Kaiyi Tian ◽  
Senyuan Yang ◽  
Jiaxuan Niu ◽  
Hanxiang Wang

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