scholarly journals Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process

2017 ◽  
Vol 36 ◽  
pp. 420-426 ◽  
Author(s):  
Z.L. Li ◽  
H.J. Dong ◽  
X.G. Song ◽  
H.Y. Zhao ◽  
J.C. Feng ◽  
...  
Keyword(s):  
High Temperature ◽  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Bonding Process ◽  
Transient Liquid Phase Bonding ◽  
Power Devices ◽  
Die Attachment ◽  
Rapid Formation

scholarly journals Simulation of Transient Liquid Phase Bonding Process and the Influence of Interlayer Thickness

2020 ◽  
Vol 923 ◽  
pp. 012006
Author(s):  
B. Benita ◽  
D.S. Samuvel Prem Kumar ◽  
R. Pravin ◽  
N.Samuel Dinesh Hynes ◽  
J.Angela Jennifa Sujana
Keyword(s):  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Bonding Process ◽  
Transient Liquid Phase Bonding ◽  
Interlayer Thickness

The transient liquid phase bonding process of a γ-TiAl alloy with brazing solders containing Fe or Ni

2019 ◽  
Vol 106 ◽  
pp. 48-58 ◽  
Author(s):  
Katja Hauschildt ◽  
Andreas Stark ◽  
Norbert Schell ◽  
Martin Müller ◽  
Florian Pyczak
Keyword(s):  
Liquid Phase ◽  
Tial Alloy ◽  
Transient Liquid Phase ◽  
Bonding Process ◽  
Transient Liquid Phase Bonding

scholarly journals Transient Liquid Phase Bonding Process in SiC Fiber Reinforced Ti-6Al-4V Composites.

1995 ◽  
Vol 35 (10) ◽  
pp. 1307-1314 ◽  
Author(s):  
Shinji Fukumoto ◽  
Kenichi Imamura ◽  
Akio Hirose ◽  
Kojiro F. Kobayashi
Keyword(s):  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Bonding Process ◽  
Transient Liquid Phase Bonding ◽  
Fiber Reinforced ◽  
Sic Fiber
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