Cooling Curve Analysis of A356 Alloy by Conventional Casting and the Effect of Stirring

The present investigation attempted to explore the effect of stirring during solidification of Aluminum A356 alloy, mainly focusing on the change from dendrite to globular structure. For this purpose samples of A356 alloy were melted in the electrical resistance furnace and cooling curves were recorded for each level agitation. The experimental curves were numerically processed by calculating first and second derivatives. From these were determined temperatures and times of start nucleation of alpha solid and eutectic reaction.

Microstructure and Mechanical Properties of Ultrafine Quaternary Al-Cu-Si-Mg Eutectic Alloy

The microstructure evolution and mechanical properties of quaternary Al-Cu-Si-Mg eutectic alloy prepared via arc melting and suction casting were studied. This alloy exhibits a single endothermic DSC peak with a melting temperature of 509 °C upon heating, suggesting a eutectic reaction. The cast alloy microstructure consisted of four phases, α-Al, Al2Cu (), Si and Al4Cu2Mg8Si7 (Q), in the eutectic cells and also in the nano-scale anomalous eutectic in the intercellular regions. The eutectic cells show different morphologies in different parts of the sample. Well-defined orientation relationships between the α-Al, Al2Cu, and Q phases were found in the eutectic cell centres, while decoupled growth of Q phase occurred at the cell boundaries. The bimodal microstructure exhibits excellent compressive mechanical properties, including a yield strength of 835 ± 35 MPa, a fracture strength of ~1 GPa and a compressive fracture strain of 4.7 ± 1.1%. The high strength is attributed to a combination of a refined eutectic structure and strengthening from multiple hard phases.

Effect of CoCrMo Addition on Ti6Al4V/xCoCrMo Biomedical Composites Processed by Powder Metallurgy

A detailed experimental and numerical investigation was performed on a Ti6Al4V/xCoCrMo biomedical composite for bone implant applications. The aim was to understand the effect generated by the addition of different volume fractions of CoCrMo particles on a Ti6Al4V matrix composite processed by powder metallurgy. Distribution of CoCrMo particles inside a matrix was observed by computed microtomography. Three-dimensional image analysis allowed for the deduction that the mechanism that permitted percolation within the powder mixture was the cluster formation at 30 vol.% of CoCrMo and at a coordination number of Co–Co contacts of 2.8, which confirms existing models. Densification during powder compaction was driven by larger indentations at the Ti–Co contacts for lower quantities of CoCrMo than for those reaching percolation. Sintering was studied by dilatometry tests at 1130 °C, and results indicated that solid-state sintering generated the formation of a rigid skeleton. This endured the stress generated by the eutectic reaction liquid, which filled the interparticle porosity, resulting in relative densities above 90%. Microstructure was analyzed by SEM and X-ray diffraction, and results showed a Ti6Al4V matrix surrounded by a Ti2Co eutectic phase. In addition, the hardness of composites increased up to three times compared to the Ti6Al4V alloy. It was concluded that the best properties were obtained from 20 vol.% of CoCrMo.

Effect of Semi-Solid Processing on the Microstructure and Mechanical Properties of Aluminum Alloy Chips with Eutectic Mg2Si Intermetallics

This study reports the microstructural changes and mechanical properties of high-strength aluminum alloy chips prepared in the semi-solid state at different temperatures, pressures, and holding times. In semi-solid processes, these processing parameters must be optimized because they affect the microstructure and mechanical properties of the chips. In microstructural analysis, these parameters clearly influenced the spheroidization of the aluminum matrix. The aluminum matrix was uniformly spheroidized after semi-solid processing, and the densities of the final samples increased with the holding time. After 30 min holding time at a given temperature, the density approached the theoretical density, but the compressive strength of the samples seriously deteriorated. Meanwhile, fracture surface investigation revealed a deformed Mg2Si phase, which is formed through a eutectic reaction. The strength of this phase significantly decreased after increasing the holding time of the semi-solid processing from 10 to 30 min. Therefore, deformation of the Mg2Si phase caused by diffusion of aluminum into this phase can be a key factor for the decrease in the mechanical properties of samples fabricated with 30 min holding time.

Plastic and low-cost axial zero thermal expansion alloy by a natural dual-phase composite

Zero thermal expansion (ZTE) alloys possess unique dimensional stability, high thermal and electrical conductivities. Their practical application under heat and stress is however limited by their inherent brittleness because ZTE and plasticity are generally exclusive in a single-phase material. Besides, the performance of ZTE alloys is highly sensitive to change of compositions, so conventional synthesis methods such as alloying or the design of multiphase to improve its thermal and mechanical properties are usually inapplicable. In this study, by adopting a one-step eutectic reaction method, we overcome this challenge. A natural dual-phase composite with ZTE and plasticity was synthesized by melting 4 atom% holmium with pure iron. The dual-phase alloy shows moderate plasticity and strength, axial zero thermal expansion, and stable thermal cycling performance as well as low cost. By using synchrotron X-ray diffraction, in-situ neutron diffraction and microscopy, the critical mechanism of dual-phase synergy on both thermal expansion regulation and mechanical property enhancement is revealed. These results demonstrate that eutectic reaction is likely to be a universal and effective method for the design of high-performance intermetallic-compound-based ZTE alloys.

Solidification Pattern of Si-Alloyed, Inoculated Ductile Cast Irons, Evaluated by Thermal Analysis

The solidification cooling curve itself as well as its first derivative, and related temperatures, reported to the calculated equilibrium temperatures in stable and metastable solidification systems, are used to predict the solidification characteristics of the cast iron. Silicon, as the most representative cast iron element, and inoculation, as graphitizing metallurgical treatment, have a major influence on the transition from the liquid to the solid state. Six experimental programs are performed, with Si content typically for non-alloyed (<3.0% Si), low (3.0–3.5% Si) and medium alloyed (4.5–5.5% Si) ductile cast irons, as Si-content increasing, and inoculation simultaneous effects. Silicon is an important influencing factor, but the base and minor elements also affect the equilibrium eutectic temperatures, much more in the Fe-C-Si-Xi stable system (15–20 °C) than in the metastable system (5–10 °C), comparing with their calculation based only on a Si effect (Fe-C-Si system). The highest positive effect of inoculation is visible in non-Si alloyed cast irons (2.5% Si): 9–15 °C for the eutectic reaction and 3 to 4 times increased at the end of solidification (37–47 °C). Increased Si content decreases inoculation power to 7–9 °C for low alloying grade (up to 3.5% Si), with the lowest contribution at more than 4.5% Si (0.3–2.0 °C). 2.5–3.5% Si ductile cast irons are more sensitive to high solidification undercooling, especially at the end of solidification (but with a higher efficiency of inoculation), compared to 4.5–5.5% Si ductile cast irons, at a lower undercooling level, and at lower inoculation contribution, as well.

Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper

The aim of the research work was to characterize the soldering alloy type Bi-Ag-Ti and to study the direct soldering of silicon and copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on the content of silver and titanium. The solder begins to melt at the temperature of 262.5 ∘C and full melting is completed at 405 ∘C. The solder microstructure consists of a bismuth matrix with local eutectics. The silver crystals and titanium phases as BiTi2 and Bi9Ti8 are segregated in the matrix. The average tensile strength of the solder varies around 42 MPa. The bond with silicon is formed due to interaction of active titanium with the silicon surface at the formation of a reaction layer, composed of a new product, TiSi2. In the boundary of the Cu/solder an interaction between the liquid bismuth solder and the copper substrate occurs, supported by the eutectic reaction. The mutual solubility between the liquid bismuth solder is very limited, on both the Bi and the Cu side. The average shear strength in the case of a combined joint of Si/Cu fabricated with Bi11Ag1.5Ti solder is 43 MPa.

Mechanochemical synthesis of Li2OHI with enhanced lithium ionic conductivity

Lithium hydroxide halides, as a family of lithium-ion conductive materials, have a promising potential on the application of solid state electrolytes. In this work, we have synthesized orthohombic Li2OHI through a facile mechanochemical method. The obtained sample exhibits a higher lithium-ion conductivity than solid sintering, which can be attributed to the high purity and crystallinity obtained from ball milling. Ball milling can avoid the phase segregation of Li2OHI at high temperature and promote the sufficient eutectic reaction of binary system, which can be widely used in the synthesis of other materials with low melting points.

Microstructural Analysis of Solder Bump Fabricated by Sn Electroplating on a PCB Substrate

To manufacture finer solder bumps, the SR and DFR patterns were filled using a Sn electroplating process instead of the microball process currently used in BGA technology, and the solder bump shape was fabricated through a reflow process. The microstructure of the solder bump was investigated by EBSD and TEM measurements. The EBSD results showed that the grain size of the Sn structure became finer after the reflow treatment and a scallop shape of Cu₆Sn₅ was formed on the Cu UBM. However, the Cu₃Sn phase was difficult to measure in the EBSD measurement. The Cu₃Sn compound could be investigated with TEM analysis. The Cu₃Sn phase also existed in the Sn region, with a size of several tens of nanometers, due to the eutectic reaction. The volume fraction of the Cu₆Sn₅ phase in the Sn region could be calculated from the TEM image, and the concentration of copper dissolved in the liquid tin during the reflow process could be estimated from the volume fraction. It was possible to observe the Cu₃Sn and Cu₆Sn₅ lattice images through high resolution TEM analysis, but it was difficult to observe the lattice coherency between the two phases because both were polycrystalline. Based on the results of this study, it is expected that solder bumps with a diameter of less than 100 µm can be robustly manufactured through the Sn electroplating process.