Rapid Ag/Sn/Ag transient liquid phase bonding for high-temperature power devices packaging by the assistance of ultrasound
2017 ◽
Vol 37
◽
pp. 561-570
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Keyword(s):
2017 ◽
Vol 36
◽
pp. 420-426
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2018 ◽
Vol 724
◽
pp. 231-238
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Ag–Sn Transient Liquid Phase Bonding for High Temperature Electronic Packaging: Effect of Ag Content
2020 ◽
Vol 10
(10)
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pp. 1604-1610
2013 ◽
Vol 28
(5)
◽
pp. 2448-2456
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2017 ◽
Vol 32
(1)
◽
pp. 441-451
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2010 ◽
Vol 33
(3)
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pp. 563-570
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Keyword(s):
2017 ◽
Vol 46
(7)
◽
pp. 4152-4159
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