Prediction of primary intermetallic compound formation during interfacial reaction between Sn-based solder and Ni substrate
2002 ◽
Vol 46
(11)
◽
pp. 777-781
◽
2015 ◽
Vol 627
◽
pp. 276-280
◽
2010 ◽
Vol 39
(12)
◽
pp. 2504-2512
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Keyword(s):
2009 ◽
Vol 209
(2)
◽
pp. 937-943
◽
1998 ◽
Vol 13
(1)
◽
pp. 37-44
◽
2017 ◽
2003 ◽
Vol 319
(3-4)
◽
pp. 424-428
◽
Study on the reaction mechanism and intermetallic compound formation in tri-metal Ti/Al/Nb composite
2018 ◽
Vol 741
◽
pp. 1030-1039
◽
2018 ◽
Vol 46
◽
pp. 79-88
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