scholarly journals A new method on diagnostics of muons produced by a short pulse laser

Author(s):  
Feng Zhang ◽  
Boyuan Li ◽  
Lianqiang Shan ◽  
Bo Zhang ◽  
Wei Hong ◽  
...  

Muons produced by a short pulse laser can serve as a new type of muon source having potential advantages of high intensity, small source emittance, short pulse duration and low cost. To validate it in experiments, a suitable muon diagnostics system is needed since high muon flux generated by a short pulse laser shot is always accompanied by high radiation background, which is quite different from cases in general muon researches. A detection system is proposed to distinguish muon signals from radiation background by measuring the muon lifetime. It is based on the scintillator detector with water and lead shields, in which water is used to adjust energies of muons stopped in the scintillator and lead to against radiation background. A Geant4 simulation on the performance of the detection system shows that efficiency up to 52% could be arrived for low-energy muons around 200 MeV and this efficiency decreases to 14% for high-energy muons above 1000 MeV. The simulation also shows that the muon lifetime can be derived properly by measuring attenuation of the scintilla light of electrons from muon decays inside the scintillator detector.

2018 ◽  
Vol 89 (11) ◽  
pp. 115106 ◽  
Author(s):  
Genbai Chu ◽  
Tao Xi ◽  
Minghai Yu ◽  
Wei Fan ◽  
Yongqiang Zhao ◽  
...  

Author(s):  
L. J. Waxer ◽  
M. J. Guardalben ◽  
J. H. Kelly ◽  
B. E. Kruschwitz ◽  
J. Qiao ◽  
...  

Author(s):  
Naoki Iwatani ◽  
Hong Duc Doan ◽  
Kazuyoshi Fushinobu

Laser drilling of silicon carbide (SiC) wafer in air (dry ablation) and underwater by using ns pulsed infrared (1064 nm) Nd: YAG laser is investigated. In order to suggest optimal parameters of via processing in SiC wafer, the effects of pulse number, laser fluence, water film thickness, and focus position are evaluated. As compared with dry ablation vias, decreasing etching rate, increasing via diameter, and generation of cracks in high-energy regime are observed in liquid-assisted processing. However, it is found that it can create vias without debris, HAZ, cracks. Also, optimal parameter set for infrared pulse laser processing under water is found to be the laser fluence of less than 10 J/cm2 and water thickness of 1mm.


Author(s):  
L. J. Waxer ◽  
J. H. Kelly ◽  
B. E. Kruschwitz ◽  
J. Qiao ◽  
M. J. Guardalben ◽  
...  

Author(s):  
Quanwei Jin ◽  
Yu Pang ◽  
Liang Tan ◽  
Yinhong Sun ◽  
JianFeng Jiang ◽  
...  

Author(s):  
Andreas Kohl ◽  
Celine Canal ◽  
Arnaud Laugustin ◽  
Olivier Rabot

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