Failure Analysis of Electronic and Microelectronic Components with a New Automatic Target Preparation System

2005 ◽  
Author(s):  
Katja Reiter ◽  
Hans Bundgaard
Keyword(s):  
Failure Analysis ◽  
Automatic System ◽  
Material Removal ◽  
Electronics Packaging ◽  
Target Preparation ◽  
Packaging Industry ◽  
Short Time ◽  
Microelectronic Components ◽  
Automatic Preparation ◽  
Excellent Reproducibility

Abstract Based on the requirements regarding target, reproducibility, and specimen surface quality, an automatic system for controlled material removal and target preparation has been developed. The tool is for metallographic failure analysis of electric and microelectronic components, and provides an accuracy of 5 micrometer. This article presents details of sample preparation and device evaluation methods. The images presented show typical objects of examination in the analysis of microstructures and materials in the electronics packaging industry with brief comments. For automatically controlled material removal and preparation, the tool offers alignment and measuring of the sample prior to the preparation. The desired preparation layers were achieved precisely and reproducibly with several specimens of the same kind. The automatic preparation system allowed the preparation of critical samples within a short time, with high precision and with excellent reproducibility.

Failure Analysis on Power Trench MOSFET Devices with Copper Wire Bonds

2011 ◽  
Author(s):  
Huixian Wu ◽  
Arthur Chiang ◽  
David Le ◽  
Win Pratchayakun
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
New Technology ◽  
Analytical Techniques ◽  
Wire Bonding ◽  
Bonding Process ◽  
Wire Bonds ◽  
Copper Wire Bonding ◽  
Wet Chemical ◽  
Microelectronic Components

Abstract With gold prices steadily going up in recent years, copper wire has gained popularity as a means to reduce cost of manufacturing microelectronic components. Performance tradeoff aside, there is an urgent need to thoroughly study the new technology to allay any fear of reliability compromise. Evaluation and optimization of copper wire bonding process is critical. In this paper, novel failure analysis and analytical techniques are applied to the evaluation of copper wire bonding process. Several FA/analytical techniques and FA procedures will be discussed in detail, including novel laser/chemical/plasma decapsulation, FIB, wet chemical etching, reactive ion etching (RIE), cross-section, CSAM, SEM, EDS, and a combination of these techniques. Two case studies will be given to demonstrate the use of these techniques in copper wire bonded devices.

Grinding Acoustic Emission Classification in Terms of Mechanical Behaviours

2007 ◽  
Vol 329 ◽  
pp. 15-20 ◽  
Author(s):  
Xun Chen ◽  
James Griffin
Keyword(s):  
Neural Network ◽  
Acoustic Emission ◽  
Material Removal ◽  
Grinding Process ◽  
Short Time Fourier Transform ◽  
Fundamental Investigation ◽  
Mechanical Behaviours ◽  
Wavelets Transform ◽  
Short Time ◽  
Ae Signals

The material removal in grinding involves rubbing, ploughing and cutting. For grinding process monitoring, it is important to identify the effects of these different phenomena experienced during grinding. A fundamental investigation has been made with single grit cutting tests. Acoustic Emission (AE) signals would give the information relating to the groove profile in terms of material removal and deformation. A combination of filters, Short-Time Fourier Transform (STFT), Wavelets Transform (WT), statistical windowing of the WT with the kurtosis, variance, skew, mean and time constant measurements provided the principle components for classifying the different grinding phenomena. Identification of different grinding phenomena was achieved from the principle components being trained and tested against a Neural Network (NN) representation.

Comparison of Processing Features between Semi Bonded Abrasive Lapping and Loose Abrasive Lapping

2009 ◽  
Vol 416 ◽  
pp. 439-442
Author(s):  
Xun Lv ◽  
Ju Long Yuan ◽  
Dong Hui Wen
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Processing Parameters ◽  
Good Surface ◽  
Ultra Precision ◽  
New Processing ◽  
Short Time

Semi bonded abrasive lapping is an effective ultra-precision lapping method. It can obtain good surface quality of workpiece in short time. This paper focused on the differences of processing features by comparing semi bonded abrasive lapping and loose abrasive lapping in several groups processing parameters. The results showed that the surface roughness of workpiece in semi bonded abrasive lapping was far superior to that of loose abrasive lapping in same processing parameters. And the MRR (material removal rate) of semi bonded abrasive lapping was slightly lower than that of loose abrasive lapping. For these features of semi bonded abrasive, a new processing flow would also be proposed in this paper.

scholarly journals A Fast-Result Method of Planar Polishing for Optical Microscopy

1997 ◽  
Vol 5 (9) ◽  
pp. 8-11
Author(s):  
Joseph Rubin ◽  
Tim Hazeldine
Keyword(s):  
Quality Control ◽  
Failure Analysis ◽  
Optical Microscopy ◽  
Material Removal ◽  
Novel Approach ◽  
Analysis Quality

The planarizing technique of materials lapping and polishing shows many benefits in providing samples for optical microscopy in failure analysis, quality control and related fields. A method is described below which provides both rapid and accurate micro-sections of pcb's, wafers, packaged components and other processed materials, with the use of a novel approach involving a 'calibrated' polishing base and a 'Micropositioner' head. Other benefits include the ability to halt material removal at a predetermined process endpoint and convenient sample mounting techniques.

Direct Imaging of Device Characteristics In a Focused ion Beam System

1998 ◽  
Vol 4 (S2) ◽  
pp. 652-653 ◽  
Author(s):  
A. N. Campbell ◽  
J. M. Soden
Keyword(s):  
Integrated Circuits ◽  
Failure Analysis ◽  
Cross Sections ◽  
Material Removal ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Yield Enhancement ◽  
The Past ◽  
Design Changes ◽  
Design Debugging

A great deal can be learned about integrated circuits (ICs) and microelectronic structures simply by imaging them in a focused ion beam (FIB) system. FIB systems have evolved during the past decade from something of a curiosity to absolutely essential tools for microelectronics design verification and failure analysis. FIB system capabilities include localized material removal, localized deposition of conductors and insulators, and imaging. A major commercial driver for FIB systems is their usefulness in the design debugging cycle by (1) rewiring ICs quickly to test design changes and (2) making connection to deep conductors to facilitate electrical probing of complex ICs. FIB milling is also used for making precision cross sections and for TEM sample preparation of microelectronic structures for failure analysis and yield enhancement applications.

Enhanced Failure Analysis on Open TSV Interconnects

2012 ◽  
Author(s):  
F. Altmann ◽  
C. Schmidt ◽  
J. Beyersdorfer ◽  
M. Simon-Najasek ◽  
C. Große ◽  
...  
Keyword(s):  
Electron Beam ◽  
High Resolution ◽  
Failure Analysis ◽  
Preparation Technique ◽  
Target Preparation ◽  
Material Analysis ◽  
Highly Efficient ◽  
Lock In

Abstract In this paper different methods and novel tools for failure localisation and high resolution material analysis for open TSV interconnects will be discussed. The paper shows the application of enhanced methods for the localisation of sidewall shorts in open TSV structures by adapted Photoemission Microscopy (PEM), Lock-in Thermography (LIT) and Electron Beam Absorbed Imaging (EBAC). In addition, a new highly efficient target preparation technique is presented, which allows the combination of Laser and FIB milling, in order to access TSV sidewall defects. Finally the use of this technique is demonstrated in a failure analysis case study.

Electronics Packaging Materials Research at NIST

1995 ◽  
Vol 390 ◽  
Author(s):  
Michael A. Schen ◽  
G. T. Davis ◽  
F. I. Mopsik ◽  
W. L. Wu ◽  
W. E. Wallace ◽  
...  
Keyword(s):  
Materials Science ◽  
Electronics Industry ◽  
Electronics Packaging ◽  
Government Agency ◽  
Science And Engineering ◽  
Materials Research ◽  
Materials Science And Engineering ◽  
Microelectronics Industry ◽  
Microelectronic Components

ABSTRACTThe Materials Science and Engineering Laboratory at NIST has augmented its laboratory-based research in support of the U.S. commercial microelectronics industry by expanding its efforts in electronics packaging, interconnection and assembly (P/I/A) materials technologies. In conjunction with industry, university and other government agency partners, these new NIST efforts target materials technology issues that underlie the priorities contained within the various electronics industry technology roadmaps. A dominant aspect of the laboratory P/I/A program focuses on the in-situ metrology and data needs associated with the materials and complex material assemblies which comprise today's microelectronic components and circuits.

The use of automated image analysis in coal petrology

1987 ◽  
Vol 24 (5) ◽  
pp. 1064-1069 ◽  
Author(s):  
Fariborz Goodarzi
Keyword(s):  
Image Analysis ◽  
Automatic System ◽  
Automated Image Analysis ◽  
Reflectance Measurement ◽  
Point Count ◽  
Large Numbers ◽  
Image Analyser ◽  
Conventional Methods ◽  
Coal Petrology ◽  
Short Time

A comparison was made between the data obtained using the Zeiss image analyser (IBAS) and those obtained by conventional methods, using polished, particulate and blocks of coal. The results obtained by using the two methods are in good agreement.IBAS is an automatic system and reduces the data (reflectance measurement and point count analysis) collecting time substantially, compared with conventional methods. Seam profiles, based on polished blocks, can be constructed rapidly using IBAS to determine the paleoenvironment of coal deposition or the position of macerals resistant to grinding. Also, evaluation and presentation of large numbers of coal samples can be performed in a short time by using polished, particulate blocks.

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