Aluminum Atom Activation of C–S Bonds: An EPR Study of the Intermediates Formed in the Reaction Between Aluminum Atoms and Dialkyl Sulfides

2017 ◽  
Vol 122 (1) ◽  
pp. 72-80 ◽  
Author(s):  
Helen A. Joly ◽  
Chad Orsini

1961 ◽  
Vol 26 (4) ◽  
pp. 1331-1333 ◽  
Author(s):  
David Goheen ◽  
Clifton Bennett
Keyword(s):  


2016 ◽  
Vol 78 (6) ◽  
Author(s):  
Djoko Hartanto ◽  
Lai Sin Yuan ◽  
Sestriana Mutia Sari ◽  
Djarot Sugiarso ◽  
Irmina Kris Murwarni ◽  
...  

Lewis and Brönsted acidity were studied on ZSM-5 with combination of pyridine adsorption and FTIR vibration, ZSM-5 synthesized using kaolin Bangka Indonesia with an increase in the molar ratio of Si/Al 30-60 without pre-treatment and without organic templates and with seeds silicalite. Interestingly, the intensity of the infrared showed an increase of band vibration pyridine as absorbed Brönsted and Lewis acid sites in a molar ratio increase of Si/Al in ZSM-5, indicating an increase in the number of silanol (Brönsted acid) and deformed silica (Lewis acid) because the amount of Aluminum in ZSM-5 decrease with increase Si/Al but amount acidity increase. 29Si and 27Al MAS NMR analysis was supported by the results of infrared to indicate that all of the aluminum atom is coordinated with their neighbors are the same in ordering the ZSM-5 framework and 27Al MAS NMR showed a sharp peak of all the variations of Si/Al except the Si/Al 30 shows a low peak area. XRD analysis supported that the ZSM-5 structure formed is pure and crystal and a decrease in crystallinity proven for more than Si/Al 50, that defects silica occurs in ZSM-5, this corresponds to the growing number of Lewis acid sites caused by defects silica described the infrared results.



Metals ◽  
2018 ◽  
Vol 8 (10) ◽  
pp. 770 ◽  
Author(s):  
Qinghua Chang ◽  
Jingpei Xie ◽  
Aixia Mao ◽  
Wenyan Wang

Large scale Atomic/Molecular dynamic Parallel Simulator (LAMMPS) molecular dynamics simulation software was used to simulate the copper and aluminum atom diffusion and changes of interface during heating and cooling process of copper and aluminum composite panels. The structures of the interface were characterized through scanning electron microscope (SEM), X-ray diffraction (XRD), and transmission electron microscope (TEM), and the mechanical properties were also tested. The simulation results show that the diffusion rate of copper atom is higher than that of aluminum atom, and that the CuAl2 radial distribution function of the interface at 300 K is consistent with that of pure CuAl2 at room temperature. At 930 K, t = 50 ps Cu atoms spread at a distance of approximately four Al lattice constants around the Al layer, and Al atoms spread to about half a lattice constant distance to the Cu layer. The experimental results show that the thickness of the interface in copper–aluminum composite plate is about 1 μm, and only one kind of CuAl2 with tetragonal phase structure is generated in the interface, which corresponds with the result of molecular dynamics simulation.



Author(s):  
J. Drabowicz ◽  
J. Lewkowski ◽  
W. Kudelska ◽  
T. Girek
Keyword(s):  


1976 ◽  
Vol 7 (48) ◽  
pp. no-no
Author(s):  
N. K. GUSAROVA ◽  
G. G. EFREMOVA ◽  
S. V. AMOSOVA ◽  
V. A. BABKIN ◽  
B. A. TROFIMOV


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