scholarly journals Group 6 Dioxydichlorides MO2Cl2(M = Cr, Mo, W, and Element 106, Sg):  The Electronic Structure and Thermochemical Stability

1996 ◽  
Vol 100 (43) ◽  
pp. 17434-17434 ◽  
Author(s):  
V. Pershina ◽  
B. Fricke
Keyword(s):  
Electronic Structure ◽  
Group 6 ◽  
Thermochemical Stability

Electronic structure of 20-electron bis-(cyclopentadienyl)-metal oxo compounds of Group 6: investigation by photoelectron spectroscopy

1995 ◽  
pp. 1023 ◽  
Author(s):  
Adam J. Bridgeman ◽  
Linda Davis ◽  
Steven J. Dixon ◽  
Jennifer C. Green ◽  
Ian N. Wright
Keyword(s):  
Electronic Structure ◽  
Photoelectron Spectroscopy ◽  
Group 6 ◽  
Oxo Compounds ◽  
Cyclopentadienyl Metal

A look at periodic trends in d-block molecular electrocatalysts for CO2 reduction

2019 ◽  
Vol 48 (26) ◽  
pp. 9454-9468 ◽  
Author(s):  
Changcheng Jiang ◽  
Asa W. Nichols ◽  
Charles W. Machan
Keyword(s):  
Electronic Structure ◽  
Transition Metal ◽  
Co2 Reduction ◽  
Metal Centers ◽  
Mononuclear Complexes ◽  
Research Activities ◽  
Group 6 ◽  
Group 10

Periodic trends in the electronic structure of the transition metal centers can be used to explain the observed CO2 reduction activities in molecular electrocatalysts for CO2 reductions. Research activities concerning both horizontal and vertical trends have been summarized with mononuclear complexes from Group 6 to Group 10.

The Electronic Structure and Photochemistry of Group 6 Bimetallic (Fischer) Carbene Complexes: Beyond the Photocarbonylation Reaction

2010 ◽  
Vol 16 (22) ◽  
pp. 6616-6624 ◽  
Author(s):  
Marta L. Lage ◽  
Israel Fernández ◽  
María J. Mancheño ◽  
Mar Gómez-Gallego ◽  
Miguel A. Sierra
Keyword(s):  
Electronic Structure ◽  
Fischer Carbene Complexes ◽  
Carbene Complexes ◽  
Fischer Carbene ◽  
Group 6

Use of EDS mapping to characterize thermochemical stability of fibers in intermetallic matrix composites

1992 ◽  
Vol 50 (1) ◽  
pp. 160-161
Author(s):  
John R. Porter
Keyword(s):  
Spatial Information ◽  
Beam Current ◽  
Fiber Types ◽  
Ceramic Fibers ◽  
Dye Transfer ◽  
Science Center ◽  
Commercial Development ◽  
Nih Image ◽  
Intermetallic Matrix Composites ◽  
Thermochemical Stability

New ceramic fibers, currently in various stages of commercial development, have been consolidated in intermetallic matrices such as γ-TiAl and FeAl. Fiber types include SiC, TiB2 and polycrystalline and single crystal Al2O3. This work required the development of techniques to characterize the thermochemical stability of these fibers in different matrices.SEM/EDS elemental mapping was used for this work. To obtain qualitative compositional/spatial information, the best realistically achievable counting statistics were required. We established that 128 × 128 maps, acquired with a 20 KeV accelerating voltage, 3 sec. live time per pixel (total mapping time, 18 h) and with beam current adjusted to give 30% dead time, provided adequate image quality at a magnification of 800X. The maps were acquired, with backgrounds subtracted, using a Noran TN 5500 EDS system. The images and maps were transferred to a Macintosh and converted into TIFF files using either TIFF Maker, or TNtolMAGE, a Microsoft QuickBASIC program developed at the Science Center. From TIFF files, images and maps were opened in either NIH Image or Adobe Photoshop for processing and analysis and printed from Microsoft Powerpoint on a Kodak XL7700 dye transfer image printer.

EELS Measurement of the Local Electronic Structure of Copper Atoms Segregated to Aluminum Grain Boundaries

1996 ◽  
Vol 54 ◽  
pp. 342-343
Author(s):  
S.J. Splinter ◽  
J. Bruley ◽  
P.E. Batson ◽  
D.A. Smith ◽  
R. Rosenberg
Keyword(s):  
Electronic Structure ◽  
Grain Boundaries ◽  
Boundary Segregation ◽  
Thin Layers ◽  
Nominal Composition ◽  
Spatially Resolved ◽  
Service Lifetime ◽  
Heat Treated ◽  
Probe Size ◽  
Local Electronic Structure

It has long been known that the addition of Cu to Al interconnects improves the resistance to electromigration failure. It is generally accepted that this improvement is the result of Cu segregation to Al grain boundaries. The exact mechanism by which segregated Cu increases service lifetime is not understood, although it has been suggested that the formation of thin layers of θ-CuA12 (or some metastable substoichiometric precursor, θ’ or θ”) at the boundaries may be necessary. This paper reports measurements of the local electronic structure of Cu atoms segregated to Al grain boundaries using spatially resolved EELS in a UHV STEM. It is shown that segregated Cu exists in a chemical environment similar to that of Cu atoms in bulk θ-phase precipitates.Films of 100 nm thickness and nominal composition Al-2.5wt%Cu were deposited by sputtering from alloy targets onto NaCl substrates. The samples were solution heat treated at 748K for 30 min and aged at 523K for 4 h to promote equilibrium grain boundary segregation. EELS measurements were made using a Gatan 666 PEELS spectrometer interfaced to a VG HB501 STEM operating at 100 keV. The probe size was estimated to be 1 nm FWHM. Grain boundaries with the narrowest projected width were chosen for analysis. EDX measurements of Cu segregation were made using a VG HB603 STEM.

Electronic structure studies of conducting polymers by electron energy-loss spectroscopy

1996 ◽  
Vol 54 ◽  
pp. 160-161
Author(s):  
J. Fink
Keyword(s):  
Electronic Structure ◽  
Conducting Polymers ◽  
Conjugated Polymers ◽  
Electron Acceptors ◽  
Electron Donors ◽  
Light Emitting ◽  
One Dimensional ◽  
New Class ◽  
Electrical Conductivities ◽  
Electron Energy Loss

Conducting polymers comprises a new class of materials achieving electrical conductivities which rival those of the best metals. The parent compounds (conjugated polymers) are quasi-one-dimensional semiconductors. These polymers can be doped by electron acceptors or electron donors. The prototype of these materials is polyacetylene (PA). There are various other conjugated polymers such as polyparaphenylene, polyphenylenevinylene, polypoyrrole or polythiophene. The doped systems, i.e. the conducting polymers, have intersting potential technological applications such as replacement of conventional metals in electronic shielding and antistatic equipment, rechargable batteries, and flexible light emitting diodes.Although these systems have been investigated almost 20 years, the electronic structure of the doped metallic systems is not clear and even the reason for the gap in undoped semiconducting systems is under discussion.

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