Methods for latent image simulations in photolithography with a polychromatic light attenuation equation for fabricating VIAs in 2.5D and 3D advanced packaging architectures

AbstractAs demand accelerates for multifunctional devices with a small footprint and minimal power consumption, 2.5D and 3D advanced packaging architectures have emerged as an essential solution that use through-substrate vias (TSVs) as vertical interconnects. Vertical stacking enables chip packages with increased functionality, enhanced design versatility, minimal power loss, reduced footprint and high bandwidth. Unlocking the potential of photolithography for vertical interconnect access (VIA) fabrication requires fast and accurate predictive modeling of diffraction effects and resist film photochemistry. This procedure is especially challenging for broad-spectrum exposure systems that use, for example, Hg bulbs with g-, h-, and i-line UV radiation. In this paper, we present new methods and equations for VIA latent image determination in photolithography that are suitable for broad-spectrum exposure and negate the need for complex and time-consuming in situ metrology. Our technique is accurate, converges quickly on the average modern PC and could be readily integrated into photolithography simulation software. We derive a polychromatic light attenuation equation from the Beer-Lambert law, which can be used in a critical exposure dose model to determine the photochemical reaction state. We integrate this equation with an exact scalar diffraction formula to produce a succinct equation comprising a complete coupling between light propagation phenomena and photochemical behavior. We then perform a comparative study between 2D/3D photoresist latent image simulation geometries and directly corresponding experimental data, which demonstrates a highly positive correlation. We anticipate that this technique will be a valuable asset to photolithography, micro- and nano-optical systems and advanced packaging/system integration with applications in technology domains ranging from space to automotive to the Internet of Things (IoT).

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Different modulation schemes for direct and external modulators based on various laser sources

Journal of Optical Communications ◽

10.1515/joc-2020-0029 ◽

2020 ◽

Vol 0 (0) ◽

Author(s):

Hazem M. El-Hageen ◽

P.G. Kuppusamy ◽

Aadel M. Alatwi ◽

M. Sivaram ◽

Z. Ahamed Yasar ◽

...

Keyword(s):

Rate Equation ◽

Simulation Software ◽

Optical Systems ◽

Laser Source ◽

Optical Link ◽

Input And Output ◽

Modulation Techniques ◽

Different Types ◽

Laser Sources ◽

Modulation Schemes

AbstractDifferent types of laser source modulation techniques have been used in various applications depending on the objective. As optical systems extract the laws and the best solutions from experiments and simulations, the present study uses simulation software with different modulation types so the output signals can be compared. The modulators used are Mach-Zehnder, which is an external modulator, and electro-absorption modulator and laser rate equation modulator, which are direct modulators. All these types have an optical link multimode (MM) fiber with a photodiode in the receiver end that can be modeled. The input and output signals are analyzed using different types of modulations.

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Jolab: A free software to simulate light propagation in optical systems

2020 IEEE Photonics Conference (IPC) ◽

10.1109/ipc47351.2020.9252275 ◽

2020 ◽

Author(s):

Dylan M. Marques ◽

James A. Guggenheim ◽

Peter R. T. Munro

Keyword(s):

Light Propagation ◽

Free Software ◽

Optical Systems

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Efficient Robust Design Optimization of Optical Systems

EPJ Web of Conferences ◽

10.1051/epjconf/201921502001 ◽

2019 ◽

Vol 215 ◽

pp. 02001

Author(s):

Stephanie Kunath

Keyword(s):

Design Optimization ◽

Robust Design ◽

Optical Design ◽

Simulation Software ◽

Robust Design Optimization ◽

Optical Systems ◽

Optical Simulation ◽

Optimization Approach ◽

Trade Off ◽

Virtual Product Development

To accelerate the virtual product development of using optical simulation software, the Robust Design Optimization approach is very promising. Optical designs can be explored thoroughly by means of sensitivity analysis. This includes the identification of relevant input parameters and the modelling of inputs vs. outputs to understand their dependencies and interactions. Furthermore, the intelligent definition of objective functions for an efficient subsequent optimization is of high importance for multi-objective optimization tasks. To find the best trade-off between two or more merit functions, a Pareto optimization is the best choice. As a result, not only one design, but a front of best designs is obtained and the most appropriate design can be selected by the decision maker. Additionally, the best trade-off between output variation of the robustness (tolerance) and optimization targets can be found to secure the manufacturability of the optical design by several advanced approaches. The benefit of this Robust Design Optimization approach will be demonstrated.

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Presentation of the first PLM integrated optical simulation software for the design and engineering of optical systems

10.1117/12.512833 ◽

2004 ◽

Cited By ~ 1

Author(s):

Jacques F. Delacour ◽

Jean-Luc Cuinier

Keyword(s):

Simulation Software ◽

Optical Systems ◽

Optical Simulation ◽

Integrated Optical

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Faraday Rotation of Broad-Spectrum Polychromatic Light and Its Quantum Description

IEEE Translation Journal on Magnetics in Japan ◽

10.1109/tjmj.1992.4565466 ◽

1992 ◽

Vol 7 (8) ◽

pp. 626-632 ◽

Cited By ~ 1

Author(s):

M. Abe ◽

H. Matsumura ◽

T. Itoh ◽

M. Gomi

Keyword(s):

Faraday Rotation ◽

Broad Spectrum ◽

Quantum Description ◽

Polychromatic Light

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Infrared control of slow light in a slab doped by InGaN/GaN quantum dot nanostructure

Modern Physics Letters B ◽

10.1142/s0217984915500128 ◽

2015 ◽

Vol 29 (05) ◽

pp. 1550012

Author(s):

Hossein Jafarzadeh ◽

Elnaz Ahmadi Sangachin ◽

Seyyed Hossein Asadpour

Keyword(s):

Quantum Dot ◽

Communication Systems ◽

Light Propagation ◽

Slow Light ◽

Optical Systems ◽

Proposed Model ◽

Ultrahigh Density ◽

Fast Light ◽

Slow And Fast Light ◽

Signal Field

In this paper, we proposed a model for controlling the group velocity of the transmitted and reflected pulses in a slab medium doped by four-level quantum dot nanostructure. Here, an infrared signal field interacted by quantum dot nanostructure can affect the behavior of reflected and transmitted pulses. We show that in the presence and absence of infrared pulses, the other controllable parameters have essential roles for controlling the slow and fast light propagation through the medium. Moreover, we found that the simultaneous slow and fast light can be obtained for the transmitted and reflected pulses by infrared signal field. Our proposed model may be useful for ultrahigh density optical memories in quantum communication systems or in various fields of all-optical systems.

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Photolithography Alignment Mark Transfer System for Low Cost, Advanced Packaging, and Bonded Wafer Applications

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2016dpc-wp16 ◽

2016 ◽

Vol 2016 (DPC) ◽

pp. 001302-001327 ◽

Cited By ~ 1

Author(s):

Tom Swarbrick ◽

Keith Best ◽

Casey Donaher ◽

Steve Gardner

Keyword(s):

Integrated Circuit ◽

High Performance ◽

Semiconductor Industry ◽

Final Analysis ◽

System Throughput ◽

Latent Image ◽

Moore’S Law ◽

Moore's Law ◽

Advanced Packaging ◽

Alignment Mark

Advanced packaging technologies continue to enable the semiconductor industry to meet the needs for ever thinner, smaller and faster components required in mobile devices and other high performance applications. However, the increase in chip I/O count, driven by Moore's law, and the ability to produce FinFETs below 10nm has presented numerous additional challenges to the existing advanced packaging processes. Furthermore, unlike Moore's law, which predicted the number of transistors in a dense integrated circuit to double approximately every two years, advanced packaging is experiencing an alternate “law”; where instead of the number of transistors increasing, it is the number of functions increasing, within the ever decreasing volume constraints of the final product that drives the technology roadmap. Inevitably, as functionality increases, so does the process complexity and cost. And in the very cost sensitive advanced packaging arena, Outsourced Semiconductor Assembly and Test suppliers (OSATs) need to compensate by reducing their manufacturing costs. This requires the OSAT to reduce material costs, increase throughput, yield, and look for new ways to reduce the number of process steps. One of the ways in which the OSATs have reduced the cost of materials is by removing the silicon wafer from the backend processing altogether; using epoxy mold compound (EMC) to create reconstituted wafers, or by using glass carriers. In the case of glass carriers, it is often the case, where the dice are attached face down on the carrier and subsequent processing prevents the front side patterns from being visible from the top side of the composite stack, even with Infrared (IR) imaging. In this particular case, an additional lithography “clear out” window is defined in photoresist over the alignment mark so the opaque film can be etched away from the alignment mark, the resist is then stripped and cleaned. This additional processing is obviously costly and time consuming. This paper specifically focuses on the concepts, methodology, and performance of a stepper based photolithography solution that utilizes a photoresist latent image to provide temporary alignment marks for the lithography process, removing the need for the additional patterning and etching steps. This revolutionary system employs a backside camera, to align to die through the carrier. A separate exposure unit, calibrated to the alignment camera center, exposes temporary latent image targets which are then detected by the system's regular alignment system during the normal stepper lithography operation. The performance data for the alignment, overlay, and latent image depth control are discussed in detail. The final analysis proves that overlay of < 2um is readily achievable, with no impact on system throughput.

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Distributed Virtual Control and Simulation Based on VNC and RFB Protocols

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.148-149.721 ◽

2011 ◽

Vol 148-149 ◽

pp. 721-724

Author(s):

Xiao Lin Lu

Keyword(s):

System Integration ◽

Telecommunication Network ◽

Simulation Software ◽

Simulation Environment ◽

Network Management System ◽

Great Flexibility ◽

Thin Client ◽

Virtual Control ◽

Computing Model ◽

Simulation Based

The distributed virtual control and simulation has been investigated collaborative compute environment. The VNC and RFB protocol is a thin-client computing model for setting up a cooperative environment. This paper proposed a WSRFB Protocol to construct a distributed virtual control and simulation environment with shared remote program. The distributed virtual control can simulate the window generated by the distributed virtual control and simulation software. The algorithm successfully applied it in the telecommunication network management system integration. The results and experiments demonstrated that the WSRFB protocol could offer a great flexibility simulation environment.

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