Fabrication of dual-side metal patterns onto textile substrates for wearable electronics by combining wax-dot printing with electroless plating

Electroless plating can be used to prepare metal particle/CaCO3 composite powder, but the use of noble metal as catalytic site would increase the cost. In this work, we adopt the combined 3-amino-propyltriethoxysilane (KH550) modification and NiCl2 activation to coat CaCO3 powder by a uniform layer of Ni particles/polymer brush which acts as non-noble metal catalyst, then, a low-cost electroless plating to prepare Cu particle/CaCO3 composite powder was developed. Results showed hydrolyzed KH550 coated on the CaCO3 surface in the form of polymer brush. The active group on the polymer brush surface could chemisorb Ni[Formula: see text] and then Ni particles/polymer brush was attached on its surface. The Ni particle/polymer brush structure acted as catalytic site and could catalyze electroless copper plating on its surface. The [Formula: see text] is 1%, its average diameter is about 100[Formula: see text]nm. This means that the dependable technology has great potential application in preparing metal inorganic powder at a low cost.

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Electroless Plating. Various Functional Applications of Formalin-Free Electroless Copper Plating.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.48.387 ◽

1997 ◽

Vol 48 (4) ◽

pp. 387-392

Author(s):

Tomoyuki FUJINAMI

Keyword(s):

Electroless Plating ◽

Copper Plating ◽

Electroless Copper Plating ◽

Functional Applications ◽

Electroless Copper

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Direct Electroless Copper Plating on Polyimide for FPCB Applications

Materials Science Forum ◽

10.4028/www.scientific.net/msf.544-545.709 ◽

2007 ◽

Vol 544-545 ◽

pp. 709-712 ◽

Cited By ~ 1

Author(s):

Jae Ho Lee

Keyword(s):

Electroless Plating ◽

Printed Circuit Board ◽

Circuit Board ◽

Copper Plating ◽

Optimum Conditions ◽

Electroless Copper Plating ◽

Additive Process ◽

Copper Line ◽

Electroless Copper ◽

Copper Seed Layer

As electronic devices are getting smaller and lighter, the density of copper lines on flexible printed circuit board (FPCB) is getting higher. Conventionally, subtractive method was used for copper line on a flexible films, however, as the line pitch is getting smaller, the lateral etching of copper cause serious problem. To replace the subtractive method, semi-additive method was used for fine pitch copper line fabrication. In semi additive process, sputtered layer for the electroplating copper was required. The feasibility of electroless plating to replace high cost sputtered copper seed layer was investigated. Electroless depositions of copper were conducted on different substrate to find optimum conditions of electroless copper plating. To find optimum conditions, the effects and selectivity of activation method on several substrates were also investigated. The adhesion strength between polyimide and copper was improved by treating the polyimide surface with butylamines. Pretreatment prior to electroless plating is very sensitive and surface dependent. Surface morphologies were investigated with FESEM.

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Selective metallization of alumina ceramics by inkjet printing combined with electroless copper plating

Journal of Materials Chemistry C ◽

10.1039/c6tc03315f ◽

2016 ◽

Vol 4 (43) ◽

pp. 10240-10245 ◽

Cited By ~ 10

Author(s):

Jin-ju Chen ◽

Yan-long Guo ◽

Yan Wang ◽

Jing Zhang ◽

Huo-jun Li ◽

...

Keyword(s):

Electroless Plating ◽

Inkjet Printing ◽

Copper Plating ◽

Alumina Ceramics ◽

Electroless Copper Plating ◽

Efficient Approach ◽

Electroless Copper

A convenient and efficient approach for selective metallization of alumina ceramics via inkjet printing followed by electroless plating was developed.

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Special Issue/The Present and Future Trends in the Electroless Plating. The Present and Future Trends in the Electroless Copper Plating.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.42.1068 ◽

1991 ◽

Vol 42 (11) ◽

pp. 1068-1076

Author(s):

Tomoyuki FUJINAMI

Keyword(s):

Electroless Plating ◽

Future Trends ◽

Copper Plating ◽

Special Issue ◽

Electroless Copper Plating ◽

Electroless Copper

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Enhancing the electrical properties of inkjet-printed silver ink by electrolyte sintering, photonic sintering, and electroless plating

Science of Sintering ◽

10.2298/sos2101119m ◽

2021 ◽

Vol 53 (1) ◽

pp. 119-126

Author(s):

Yusuke Mukai ◽

Minyoung Suh

Keyword(s):

Electrical Properties ◽

Inkjet Printing ◽

High Performance ◽

Electrical Performance ◽

Wearable Electronics ◽

Copper Plating ◽

Electroless Copper Plating ◽

Silver Ink ◽

Electroless Copper ◽

Photonic Sintering

Conductive inkjet printing is an emerging rapid manufacturing technology in the field of smart clothing and wearable electronics. The current challenge in conductive inkjet printing includes upgrading of electrical performance of printed inks to the equivalent level to traditional conductors such as bulk silver and copper, especially for high-performance electronic applications such as flexible antennas and circuits. Post-treatments are commonly employed to enhance the electrical conduction of inkjet-printed tracks. This research discusses the effects of electrolyte sintering, photonic sintering and electroless copper plating on the DC electrical resistance and resistivity of inkjet-printed silver nanoparticles. From experimental results and measurements, it was found that all the post-treatment methods effectively improved the electrical properties of printed silver ink, but in different ways. The lowest resistance of 4.5 ? (in 0.1 mm ? 10 mm) and thickest (4.5 ?m) conductor were achieved by electroless copper plating, whereas the lowest resistivity (7.5?10-8 ??m) and thinnest (1.0 ?m) conductor were obtained by photonic sintering.

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The effect of 2-mercaptobenzothiazole on laser-assisted electroless copper plating

RSC Advances ◽

10.1039/c6ra02227h ◽

2016 ◽

Vol 6 (45) ◽

pp. 38647-38652

Author(s):

Sisi Xiang ◽

Weiping Li ◽

Zhiyuan Qian ◽

Liqun Zhu ◽

Huicong Liu

Keyword(s):

Electroless Plating ◽

Copper Plating ◽

Electroless Copper Plating ◽

Plating Bath ◽

Copper Coatings ◽

Electroless Copper

Copper coatings on PET substrates (conductive treatment through laser direct structuring) were prepared from an electroless plating bath. The coatings' morphology and the plating rate were shown in the figure at various concentrations of 2-MBT.

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