Printed Electrode for High-Performance Bow-Tie Antenna by Photonic Sintering Process

Recently, flexible electronic device technology has evolved beyond curved devices with the development of flexible/stretchable devices that can be crumpled or stretched. Both elasticity and durability are essential for these devices, which should have high-conductivity for antennas and repeatability for sensors. In addition, electronic-skins, which can have a direct impact on the human-body, should be harmless to the human-body and should not be deformed by contact with sweat or organic matter. In this study, PDMS substrates were used to satisfy the above conditions. PDMS is used to fabricate human-friendly, flexible/stretchable substrates, and it has excellent repeat durability characteristics. To improve the adhesion of these PDMS films and electrodes, conductive paste was produced based on PDMS resins of the same properties. In addition, two types of Ag particles were selected as conductive fillers because the electrode characteristics of the antenna application requires excellent conductivity, and conductive paste were produced using flake Ag, which could affect conductivity, and Ag nanoparticles that affect stretchability and repeatability. The paste was applied using a high-efficiency printing technique. The printed electrodes were cured in a thermal oven. For higher conductivity, photonic-sintering was carried out during post-processing. As a result, 1.1117×106 (S/m) had excellent conductivity, performed well in repeated tensile-durability experiments of 30% to 100 times, and produced a bow-tie antenna for the above electrodes. As a result of tensing up to 35% through a Network-Analyzer, there was no performance change in the resonance-frequency or return-loss values, and excellent electrodes were developed that would achieve excellent performance even if they are applied in the sub-frequency area of 5G-antennas in the future.

Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate

Printed electronics is a fastest growing and emerging technology that have shown much potential in several industries including automotive, wearables, healthcare, and aerospace. Its applications can be found not only in flexible but also in large area electronics. The technology provides an effective and convenient method to additively deposit conductive and insulating materials on any type of substrate. Comparing with traditional manufacturing processes, which involves chemical etching, this technology also comes to be relatively environmental friendly. Despite its status, it is not without its challenges. Starting from the material being compatible in the printer equipment to the point of achieving fine resolutions, and with excellent properties are some of the challenges that printed electronics face. Among the myriad of printing technologies such as Aerosol Jet, micro-dispensing, gravure printing, screen printing, Inkjet printing, Inkjet has gained much attention due to its low-cost, low material consumption, and roll-to-roll capability for mass manufacturing. The technology has been widely used in home and office, but recently gained interest in printed electronics in a research and development setting. Conductive materials used in Inkjet printing generally comprises of metal Nanoparticles that need to be thermally sintered for it to be conductive. The preferred metal of choice has been mostly silver due to its excellent electrical properties and ease in sintering. However, silver comes to be expensive than its counterpart copper. Since copper is prone to oxidation, much focus has been given towards photonic sintering that involves sudden burst of pulsed light at certain energy to sinter the copper Nanoparticles. With this technique, only the printed material gets sintered in a matter of seconds without having a great impact on its substrate, due to which it is also preferred in low temperature applications. With all the knowledge, there is still a large gap in the process side with copper where it is important to look how the print process affects the resolution of the print along with the effect of post-print processes on electrical and mechanical properties. In this paper, a copper Inkjet ink is utilized for understanding the effect of Inkjet print parameters on the ejected droplet and its resolution. Post-print process is also quantified using a photonic sintering equipment for excellent electrical and mechanical properties. To demonstrate the complete process, commercial-off-the-shelf components will also be mounted on the additively printed pads via Inkjet. Statistically, control charting technique will be utilized to understand the capability of the Inkjet process.

Millisecond photonic sintering of iron oxide doped alumina ceramic coatings

The sintering of alumina (Al2O3) traditionally occurs at high temperatures (up to ca. 1700 °C) and in significantly long times (up to several hours), which are required for the consolidation of the material by diffusion processes. Here we investigate the photonic sintering of alumina particles using millisecond flash lamp irradiation with extreme heating rates up to 108 K/min. The limitation of the low visible light absorption of alumina is resolved by adding colored α-Fe2O3 nanoparticles, which initiated the grain growth during sintering. After the millisecond-long light pulses from a xenon flash lamp, a bimodal mixture of α-Al2O3 precursor particles was sintered and iron segregation at the grain boundaries was observed. The proposed photonic sintering approach based on doping with colored centers may be extended to other refractory ceramics with low absorption in the visible light range once appropriate high-absorbing dopants are identified.

Enhancing the electrical properties of inkjet-printed silver ink by electrolyte sintering, photonic sintering, and electroless plating

Conductive inkjet printing is an emerging rapid manufacturing technology in the field of smart clothing and wearable electronics. The current challenge in conductive inkjet printing includes upgrading of electrical performance of printed inks to the equivalent level to traditional conductors such as bulk silver and copper, especially for high-performance electronic applications such as flexible antennas and circuits. Post-treatments are commonly employed to enhance the electrical conduction of inkjet-printed tracks. This research discusses the effects of electrolyte sintering, photonic sintering and electroless copper plating on the DC electrical resistance and resistivity of inkjet-printed silver nanoparticles. From experimental results and measurements, it was found that all the post-treatment methods effectively improved the electrical properties of printed silver ink, but in different ways. The lowest resistance of 4.5 ? (in 0.1 mm ? 10 mm) and thickest (4.5 ?m) conductor were achieved by electroless copper plating, whereas the lowest resistivity (7.5?10-8 ??m) and thinnest (1.0 ?m) conductor were obtained by photonic sintering.