Multiscale mechanics of the lateral pressure effect on enhancing the load transfer between polymer coated CNTs

Nanoscale ◽  
2017 ◽  
Vol 9 (17) ◽  
pp. 5565-5576 ◽  
Author(s):  
Fatemeh Yazdandoost ◽  
Reza Mirzaeifar ◽  
Zhao Qin ◽  
Markus J. Buehler
Author(s):  
M. R. Pinnel ◽  
A. Lawley

Numerous phenomenological descriptions of the mechanical behavior of composite materials have been developed. There is now an urgent need to study and interpret deformation behavior, load transfer, and strain distribution, in terms of micromechanisms at the atomic level. One approach is to characterize dislocation substructure resulting from specific test conditions by the various techniques of transmission electron microscopy. The present paper describes a technique for the preparation of electron transparent composites of aluminum-stainless steel, such that examination of the matrix-fiber (wire), or interfacial region is possible. Dislocation substructures are currently under examination following tensile, compressive, and creep loading. The technique complements and extends the one other study in this area by Hancock.The composite examined was hot-pressed (argon atmosphere) 99.99% aluminum reinforced with 15% volume fraction stainless steel wire (0.006″ dia.).Foils were prepared so that the stainless steel wires run longitudinally in the plane of the specimen i.e. the electron beam is perpendicular to the axes of the wires. The initial step involves cutting slices ∼0.040″ in thickness on a diamond slitting wheel.


Author(s):  
Warren J. Moberly ◽  
Daniel B. Miracle ◽  
S. Krishnamurthy

Titanium-aluminum alloy metal matrix composites (MMC) and Ti-Al intermetallic matrix composites (IMC), reinforced with continuous SCS6 SiC fibers are leading candidates for high temperature aerospace applications such as the National Aerospace Plane (NASP). The nature of deformation at fiber / matrix interfaces is characterized in this ongoing research. One major concern is the mismatch in coefficient of thermal expansion (CTE) between the Ti-based matrix and the SiC fiber. This can lead to thermal stresses upon cooling down from the temperature incurred during hot isostatic pressing (HIP), which are sufficient to cause yielding in the matrix, and/or lead to fatigue from the thermal cycling that will be incurred during application, A second concern is the load transfer, from fiber to matrix, that is required if/when fiber fracture occurs. In both cases the stresses in the matrix are most severe at the interlace.


1995 ◽  
Vol 05 (C8) ◽  
pp. C8-729-C8-734
Author(s):  
A.I. Lotkov ◽  
V.P. Lapshin ◽  
V.A. Goncharova ◽  
H.V Chernysheva ◽  
V.N. Grishkov ◽  
...  

1988 ◽  
Vol 49 (C8) ◽  
pp. C8-275-C8-276
Author(s):  
H. Yoshida ◽  
T. Komatsu ◽  
T. Kaneko ◽  
S. Abe ◽  
K. Kamigaki

1988 ◽  
Vol 49 (C8) ◽  
pp. C8-1281-C8-1282
Author(s):  
H. Tange ◽  
Y. Tanaka ◽  
K. Shirakawa

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