Modifying the electrochemical performance of vertically-oriented few-layered graphene through rotary plasma processing

2018 ◽  
Vol 6 (3) ◽  
pp. 908-917 ◽  
Author(s):  
Jinghuang Lin ◽  
Henan Jia ◽  
Yifei Cai ◽  
Shulin Chen ◽  
Haoyan Liang ◽  
...  

We strategically created defects on the side surfaces of VFG via defect engineering using rotary plasma etching, which not only improves the wettability with electrolyte, but also provides more electroactive sites.

2017 ◽  
Vol 19 (19) ◽  
pp. 12255-12268 ◽  
Author(s):  
Jan Kegel ◽  
Fathima Laffir ◽  
Ian M. Povey ◽  
Martyn E. Pemble

Defect engineering in ZnO: origin of strong orange-luminescent defects in solution-grown nanorod-arrays and their enhanced photo-electrochemical performance.


2014 ◽  
Vol 3 (11) ◽  
pp. Q215-Q220 ◽  
Author(s):  
Sung-Woon Cho ◽  
Jun-Hyun Kim ◽  
Doo Won Kang ◽  
Kangtaek Lee ◽  
Chang-Koo Kim

2019 ◽  
Vol 10 (32) ◽  
pp. 7600-7609 ◽  
Author(s):  
Chunlin Teng ◽  
Fan Yang ◽  
Minghui Sun ◽  
Keshu Yin ◽  
Qintong Huang ◽  
...  

Ordered mesoporous and oxygen-vacancy are demonstrated to significantly improve the electrochemical performance of Co3O4. Capitalizing on the optimized M-Co3O4−x cathode, the ZBB exhibits ultrahigh energy density and extraordinary cycling stability.


2020 ◽  
Vol 46 (4) ◽  
pp. 5387-5393
Author(s):  
Zhitong Hu ◽  
Ju Rong ◽  
Zhaolin Zhan ◽  
Xiaohua Yu

2021 ◽  
Vol 314 ◽  
pp. 312-317
Author(s):  
Rogier Evertsen ◽  
Nicolle Beckers ◽  
Shao Ying Wang ◽  
Richard van der Stam

This paper describes a study on the remote plasma etching of silicon-based semiconductor wafers after laser separation. Several process parameters having impact on the chip reliability, expressed as changes in die material strength, have been studied and optimized. The results show the potential of fluorine-based plasma processing for cleaning dies and improving die performance and thus have a role as a process enabling advanced packaging technologies.


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