Single- and Multi-Directional Slanted Plasma Etching of Silicon under Practical Plasma Processing Conditions

2014 ◽  
Vol 3 (11) ◽  
pp. Q215-Q220 ◽  
Author(s):  
Sung-Woon Cho ◽  
Jun-Hyun Kim ◽  
Doo Won Kang ◽  
Kangtaek Lee ◽  
Chang-Koo Kim
Author(s):  
Jennifer Lane ◽  
Edward A. Rietman ◽  
Nace Layadi ◽  
John T. C. Lee

2018 ◽  
Vol 6 (3) ◽  
pp. 908-917 ◽  
Author(s):  
Jinghuang Lin ◽  
Henan Jia ◽  
Yifei Cai ◽  
Shulin Chen ◽  
Haoyan Liang ◽  
...  

We strategically created defects on the side surfaces of VFG via defect engineering using rotary plasma etching, which not only improves the wettability with electrolyte, but also provides more electroactive sites.


2020 ◽  
Vol 980 ◽  
pp. 154-161
Author(s):  
Wei Yin ◽  
Yan Wang

Polyester fabric has the disadvantage of poor hydrophilicity which reduces its wearing comfort and limits its usage in clothing industry. Chitosan especially that of low molecular weight is effective in hydrophilic finishing for polyester fabric, while using plasma processing can greatly improve the effect. This is a green and environmental protection process. Two sets of orthogonal experiments and analysis are done to research the factors that influence the plasma processing effect and the chitosan finishing effect which points out the variation tendency and the best processing conditions.


2016 ◽  
Vol 18 (48) ◽  
pp. 33152-33157 ◽  
Author(s):  
Ningli Zhu ◽  
Matthew T. Cole ◽  
William I. Milne ◽  
Jing Chen

Processing conditions are herein explored for the etching of bulk Mo by inductively coupled plasma towards nano tip arrays for field electron emission applications.


2021 ◽  
Vol 314 ◽  
pp. 312-317
Author(s):  
Rogier Evertsen ◽  
Nicolle Beckers ◽  
Shao Ying Wang ◽  
Richard van der Stam

This paper describes a study on the remote plasma etching of silicon-based semiconductor wafers after laser separation. Several process parameters having impact on the chip reliability, expressed as changes in die material strength, have been studied and optimized. The results show the potential of fluorine-based plasma processing for cleaning dies and improving die performance and thus have a role as a process enabling advanced packaging technologies.


2008 ◽  
Vol 103 (9) ◽  
pp. 093302 ◽  
Author(s):  
R. Murugesan ◽  
E. Hanley ◽  
R. M. Albrecht ◽  
J. A. Oliver ◽  
J. A. Heintz ◽  
...  

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