Correlation Between Ion Gel Characteristics and Performance of Ionic Pressure Sensors

Author(s):  
Woo Young Lee ◽  
Yong Min Kim ◽  
Jin Han Kwon ◽  
Hong Chul Moon

In this study, a convenient approach is proposed to tune the properties of ion gels by utilizing mixed ionic liquid (IL) systems. Herein, a binary IL system consisting of 1-butyl-3-methylimidazolium...

Soft Matter ◽  
2020 ◽  
Vol 16 (6) ◽  
pp. 1572-1581 ◽  
Author(s):  
Takaichi Watanabe ◽  
Ruri Takahashi ◽  
Tsutomu Ono

A tough, thermally stable, and water-resistant silica nanoparticles/poly(ionic liquid) double-network ion gel was developed.


RSC Advances ◽  
2019 ◽  
Vol 9 (21) ◽  
pp. 11870-11876 ◽  
Author(s):  
Tomoki Yasui ◽  
Eiji Kamio ◽  
Hideto Matsuyama

The extensibility and toughness of inorganic/organic double-network ion gels were dramatically increased using gemini-type ionic liquids as a hydrogen bonding-based weak cross-linker.


Proceedings ◽  
2021 ◽  
Vol 68 (1) ◽  
pp. 2
Author(s):  
Arash M. Shahidi ◽  
Theodore Hughes-Riley ◽  
Carlos Oliveira ◽  
Tilak Dias

Knitted electrodes are a key component to many electronic textiles including sensing devices, such as pressure sensors and heart rate monitors; therefore, it is essential to assess the electrical performance of these knitted electrodes under different mechanical loads to understand their performance during use. The electrical properties of the electrodes could change while deforming, due to an applied load, which could occur in the uniaxial direction (while stretched) or multiaxial direction (while compressed). The properties and performance of the electrodes could also change over time when rubbed against another surface due to the frictional force and generated heat. This work investigates the behavior of a knitted electrode under different loading conditions and after multiple abrasion cycles.


2020 ◽  
Vol 175 ◽  
pp. 115395 ◽  
Author(s):  
Xiaoli Liu ◽  
Ming Qu ◽  
Xiaobing Liu ◽  
Lingshi Wang ◽  
Joseph Warner

2020 ◽  
Vol 53 (1) ◽  
pp. 137-147 ◽  
Author(s):  
Eiji Kamio ◽  
Masayuki Minakata ◽  
Yu Iida ◽  
Tomoki Yasui ◽  
Atsushi Matsuoka ◽  
...  

Author(s):  
Daniel Schurz ◽  
Warren W. Flack

Advances in micromachining (MEMS) applications such as optical components, inertial and pressure sensors, fluidic pumps and radio frequency (RF) devices are driving lithographic requirements for tighter registration, improved pattern resolution and improved process control on both sides of the substrate. Consequently, there is a similar increase in demand for advanced metrology tools capable of measuring the Dual Side Alignment (DSA) performance of the lithography systems. There are a number of requirements for an advanced DSA metrology tool. First, the system should be capable of measuring points over the entire area of the wafer rather than a narrow area near the lithography alignment targets. Secondly, the system should be capable of measuring a variety of different substrate types and thicknesses. Finally, it should be able to measure substrates containing opaque deposited films such as metals. In this paper, the operation and performance of a new DSA metrology tool is discussed. The UltraMet 100 offers DSA registration measurement at greater than 90% of a wafer’s surface area, providing a true picture of a lithography tool’s alignment performance and registration yield across the wafer. The system architecture is discussed including the use of top and bottom cameras and the pattern recognition system. Experimental data is shown for tool performance in terms of repeatability and reproducibility over time. The requirements for tool accuracy and methods to establish accuracy to a NIST traceable standard are also discussed.


2020 ◽  
Vol 123 ◽  
pp. 109446
Author(s):  
Xiaofeng Ma ◽  
Xiaoyu Lan ◽  
Linlin Wu ◽  
Lei Wang ◽  
Qun Gu ◽  
...  
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