THERMAL IMAGING ANALYSIS OF MATERIAL STRUCTURES AND DEFECTS

2008 ◽  
Author(s):  
J. G. Sun ◽  
Donald O. Thompson ◽  
Dale E. Chimenti
Keyword(s):  
Thermal Imaging ◽  
Imaging Analysis

Dynamic thermal imaging analysis in the effectiveness evaluation of warming and cooling formulations

2014 ◽  
Vol 54 ◽  
pp. 129-136 ◽  
Author(s):  
Robert Koprowski ◽  
Sławomir Wilczyński ◽  
Zygmunt Wróbel ◽  
Barbara Błońska-Fajfrowska
Keyword(s):  
Thermal Imaging ◽  
Effectiveness Evaluation ◽  
Imaging Analysis

Optimization of the Au Stud Bump Number for the Flip-Chip Packaged InGaN LEDs

2013 ◽  
Vol 753-755 ◽  
pp. 2515-2520
Author(s):  
Yun Yun Zhang ◽  
Xiao Wei Sun ◽  
Wen Yu Kuo ◽  
Liann Be Chang ◽  
Bohr Ran Huang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Imaging ◽  
Flip Chip ◽  
Heat Dissipation ◽  
Optical Performance ◽  
Imaging Analysis ◽  
The Poor ◽  
Au Stud Bump ◽  
Heat Spreading ◽  
Good Heat

Au stud bump can provide a good heat spreading path for the flip-chip LED due to its high thermal conductivity (300 W/mK) . In this paper, we compared four flip-chip LED devices with four different numbers of Au stud bumps. The thermal imaging analysis indicates that the heat dissipation is proportional to the number of Au stud bump. However, when the number of Au stud bumps was larger than 24, the heat dissipation performance will become deteriorated due to the poor bonding between grain and substrate. Therefore, the number of Au stud bumps was optimized to be 20 to 24, which can be employed to develop flip-chip LEDs with optimum electrical and optical performance.

scholarly journals Age dependence of thermal imaging analysis of body surface temperature in women after cryostimulation

2013 ◽  
Vol 14 (4) ◽  
Author(s):  
Agnieszka Dębiec-Bąk ◽  
Katarzyna Gruszka ◽  
Krzysztof A. Sobiech ◽  
Anna Skrzek
Keyword(s):  
Surface Temperature ◽  
Body Surface ◽  
Thermal Imaging ◽  
Imaging Analysis ◽  
Age Dependence ◽  
Body Surface Temperature

ELECTRONIC MODULE DESIGN EVALUATION BY THERMAL IMAGING ANALYSIS

1986 ◽  
Vol 98 (3) ◽  
pp. 151-156 ◽  
Author(s):  
KIP O. HOFFER ◽  
THOMAS W. SHAW ◽  
LARRY D. ROBERTSON
Keyword(s):  
Thermal Imaging ◽  
Design Evaluation ◽  
Imaging Analysis ◽  
Module Design

scholarly journals Novel Thermal Imaging Analysis Technique for Detecting Inflammation in Thyroid Eye Disease

2014 ◽  
Vol 99 (12) ◽  
pp. 4600-4606 ◽  
Author(s):  
Costanzo Di Maria ◽  
John Allen ◽  
Jane Dickinson ◽  
Christopher Neoh ◽  
Petros Perros
Keyword(s):  
Thermal Imaging ◽  
Thyroid Eye Disease ◽  
Eye Disease ◽  
Imaging Analysis ◽  
Analysis Technique

Quantitative thermal imaging analysis of aircraft materials: through skin sensing

2005 ◽  
Author(s):  
Nicolas P. Avdelidis ◽  
L. J. Nelson ◽  
D. P. Almond
Keyword(s):  
Thermal Imaging ◽  
Imaging Analysis

Thermal imaging analysis of 3D biological agarose matrices

2011 ◽  
Vol 3 (2) ◽  
pp. 167
Author(s):  
P.S. Maher ◽  
Jan Bend Vorstius ◽  
Kenneth Donnelly ◽  
Robert P. Keatch
Keyword(s):  
Thermal Imaging ◽  
Imaging Analysis
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