Optimization of the Au Stud Bump Number for the Flip-Chip Packaged InGaN LEDs

2013 ◽  
Vol 753-755 ◽  
pp. 2515-2520
Author(s):  
Yun Yun Zhang ◽  
Xiao Wei Sun ◽  
Wen Yu Kuo ◽  
Liann Be Chang ◽  
Bohr Ran Huang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Imaging ◽  
Flip Chip ◽  
Heat Dissipation ◽  
Optical Performance ◽  
Imaging Analysis ◽  
The Poor ◽  
Au Stud Bump ◽  
Heat Spreading ◽  
Good Heat

Au stud bump can provide a good heat spreading path for the flip-chip LED due to its high thermal conductivity (300 W/mK) . In this paper, we compared four flip-chip LED devices with four different numbers of Au stud bumps. The thermal imaging analysis indicates that the heat dissipation is proportional to the number of Au stud bump. However, when the number of Au stud bumps was larger than 24, the heat dissipation performance will become deteriorated due to the poor bonding between grain and substrate. Therefore, the number of Au stud bumps was optimized to be 20 to 24, which can be employed to develop flip-chip LEDs with optimum electrical and optical performance.

Magnetic Current Imaging Power Short Localization

2015 ◽  
Author(s):  
J. Gaudestad ◽  
F. Rusli ◽  
A. Orozco ◽  
M.C. Pun
Keyword(s):  
Thermal Imaging ◽  
Flip Chip ◽  
Optical Microscope ◽  
Fault Isolation ◽  
Magnetic Current ◽  
Multiple Fault ◽  
Defect Location ◽  
Isolation Techniques ◽  
Chip Sample

Abstract A Flip Chip sample failed short between power and ground. The reference unit had 418Ω and the failed unit with the short had 16.4Ω. Multiple fault isolation techniques were used in an attempt to find the failure with thermal imaging and Magnetic Current Imaging being the only techniques capable of localizing the defect. To physically verify the defect location, the die was detached from the substrate and a die cracked was seen using a visible optical microscope.

scholarly journals Estimations on Properties of Redox Reactions to Electrical Energy and Storage Device of Thermoelectric Pipe (TEP) Using Polymeric Nanofluids

Polymers ◽  
2021 ◽  
Vol 13 (11) ◽  
pp. 1812
Author(s):  
Qin Gang ◽  
Rong-Tsu Wang ◽  
Jung-Chang Wang
Keyword(s):  
Thermal Conductivity ◽  
Power Density ◽  
Heat Dissipation ◽  
Electrical Energy ◽  
Steel Tube ◽  
Storage Device ◽  
Stainless Steel Tube ◽  
The Novel ◽  
Empirical Formulas ◽  
Dissipative Heat

A thermoelectric pipe (TEP) is constructed by tubular graphite electrodes, Teflon material, and stainless-steel tube containing polymeric nanofluids as electrolytes in this study. Heat dissipation and power generation (generating capacity) are both fulfilled with temperature difference via the thermal-electrochemistry and redox reaction effects of polymeric nanofluids. The notion of TEP is to recover the dissipative heat from the heat capacity generated by the relevant machine systems. The thermal conductivity and power density empirical formulas of the novel TEP were derived through the intelligent dimensional analysis with thermoelectric experiments and evaluated at temperatures between 25 and 100 °C and vacuum pressures between 400 and 760 torr. The results revealed that the polymeric nanofluids composed of titanium dioxide (TiO2) nanoparticles with 0.2 wt.% sodium hydroxide (NaOH) of the novel TEP have the best thermoelectric performance among these electrolytes, including TiO2 nanofluid, TiO2 nanofluid with 0.2 wt.% NaOH, deionized water, and seawater. Furthermore, the thermal conductivity and power density of the novel TEP are 203.1 W/(m·K) and 21.16 W/m3, respectively.

scholarly journals Study of Thermometry in Two-Dimensional Sb2Te3 from Temperature-Dependent Raman Spectroscopy

2021 ◽  
Vol 16 (1) ◽  
Author(s):  
Manavendra P. Singh ◽  
Manab Mandal ◽  
K. Sethupathi ◽  
M. S. Ramachandra Rao ◽  
Pramoda K. Nayak
Keyword(s):  
Thermal Conductivity ◽  
Raman Spectroscopy ◽  
Temperature Coefficient ◽  
Heat Dissipation ◽  
Peak Position ◽  
Two Dimensional ◽  
Phonon Modes ◽  
Temperature Dependent ◽  
Excellent Candidate ◽  
High Figure

AbstractDiscovery of two-dimensional (2D) topological insulators (TIs) demonstrates tremendous potential in the field of thermoelectric since the last decade. Here, we have synthesized 2D TI, Sb2Te3 of various thicknesses in the range 65–400 nm using mechanical exfoliation and studied temperature coefficient in the range 100–300 K using micro-Raman spectroscopy. The temperature dependence of the peak position and line width of phonon modes have been analyzed to determine the temperature coefficient, which is found to be in the order of 10–2 cm−1/K, and it decreases with a decrease in Sb2Te3 thickness. Such low-temperature coefficient would favor to achieve a high figure of merit (ZT) and pave the way to use this material as an excellent candidate for thermoelectric materials. We have estimated the thermal conductivity of Sb2Te3 flake with the thickness of 115 nm supported on 300-nm SiO2/Si substrate which is found to be ~ 10 W/m–K. The slightly higher thermal conductivity value suggests that the supporting substrate significantly affects the heat dissipation of the Sb2Te3 flake.

Scanning Thermal Microscopy of Carbon Nanotubes

2000 ◽  
Author(s):  
Li Shi ◽  
Sergei Plyasunov ◽  
Adrian Bachtold ◽  
Paul L. McEuen ◽  
Arunava Majumdar
Keyword(s):  
Carbon Nanotubes ◽  
Thermal Imaging ◽  
Heat Dissipation ◽  
Energy Transport ◽  
Imaging Technique ◽  
Mechanical Deformation ◽  
Phonon Transport ◽  
Scanning Thermal Microscopy ◽  
Thermal Microscopy ◽  
Nanoelectronic Circuits

Abstract This paper reports the use of scanning thermal microscopy (SThM) for studying heat dissipation and phonon transport in nanoelectronic circuits consisting of carbon nanotubes (CNs). Thermally designed and batch fabricated SThM probes were used to resolve the phonon temperature distribution in the CN circuits with a spatial resolution of 50 nm. Heat dissipation at poor metal-CN contacts could be readily found by the thermal imaging technique. Important questions regarding energy transport in nanoelectronic circuits, such as where is heat dissipated, whether the electrons and phonons are in equilibrium, how phonons are transported, and what are the effects of mechanical deformation on the transport and dissipation properties, are addressed in this work.

scholarly journals Experimental Investigation of Metal-Diamond Thermal Interface Conductance With Different Diamond Surface Terminations

2010 ◽  
Author(s):  
Kimberlee C. Collins ◽  
Gang Chen
Keyword(s):  
Thermal Conductivity ◽  
Heat Transport ◽  
Synthetic Diamond ◽  
Diamond Surface ◽  
Small Scale ◽  
Device Performance ◽  
Thermal Interface ◽  
Single Crystal Diamond ◽  
Heat Spreading ◽  
Resistance To Heat

Synthetic diamond has potential as a heat spreading material due to its uniquely high thermal conductivity. In small-scale devices, interfaces can dominate the resistance to heat transport, and thus play an important role in determining device performance. Here we use transient thermoreflectance techniques to measure the thermal interface conductance at metal-diamond interfaces. We study single crystal diamond samples with various surface terminations. We measure thermal interface conductance values over a range of temperatures from 88 K to 300 K, and find roughly 60 percent higher thermal interface conductance between Al and oxygenated diamond samples as compared to hydrogen terminated samples. The results reported here will be useful for device design and for advancing models of interfacial heat transport.

scholarly journals High-Power GaN-Based Vertical Light-Emitting Diodes on 4-Inch Silicon Substrate

Nanomaterials ◽  
2019 ◽  
Vol 9 (8) ◽  
pp. 1178 ◽  
Author(s):  
Qiang Zhao ◽  
Jiahao Miao ◽  
Shengjun Zhou ◽  
Chengqun Gui ◽  
Bin Tang ◽  
...  
Keyword(s):  
High Power ◽  
Silicon Substrate ◽  
Flip Chip ◽  
Heat Dissipation ◽  
Light Emitting Diodes ◽  
Light Output ◽  
Current Spreading ◽  
Light Emitting ◽  
Fabry Perot ◽  
Lift Off

We demonstrate high-power GaN-based vertical light-emitting diodes (LEDs) (VLEDs) on a 4-inch silicon substrate and flip-chip LEDs on a sapphire substrate. The GaN-based VLEDs were transferred onto the silicon substrate by using the Au–In eutectic bonding technique in combination with the laser lift-off (LLO) process. The silicon substrate with high thermal conductivity can provide a satisfactory path for heat dissipation of VLEDs. The nitrogen polar n-GaN surface was textured by KOH solution, which not only improved light extract efficiency (LEE) but also broke down Fabry–Pérot interference in VLEDs. As a result, a near Lambertian emission pattern was obtained in a VLED. To improve current spreading, the ring-shaped n-electrode was uniformly distributed over the entire VLED. Our combined numerical and experimental results revealed that the VLED exhibited superior heat dissipation and current spreading performance over a flip-chip LED (FCLED). As a result, under 350 mA injection current, the forward voltage of the VLED was 0.36 V lower than that of the FCLED, while the light output power (LOP) of the VLED was 3.7% higher than that of the FCLED. The LOP of the FCLED saturated at 1280 mA, but the light output saturation did not appear in the VLED.

Orientation Specific Thermal Properties of Polyimide Film

2000 ◽  
Vol 123 (3) ◽  
pp. 273-277 ◽  
Author(s):  
Robert J. Samuels ◽  
Nancy E. Mathis
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Polyimide Film ◽  
New Materials ◽  
Polyimide Films ◽  
Nondestructive Technique ◽  
Theoretical Understanding ◽  
First Time ◽  
The Relationship ◽  
Transfer Mechanisms

The present study examines the relationship between thermal conductivity and planarity in polyimide films. The samples tested were specially prepared to range in orientation from three dimensionally random to highly planar. The molecular structure and orientation of the polyimide film have been characterized by polarizing microscope techniques, while the thermal conductivity measurements were done using a new rapid nondestructive technique. This correlation represents the first time thermal conductivity has been measured by modified hot wire techniques and related to the internal structure of polyimide. This work contributes to a deeper theoretical understanding of thermal conductivity and heat transfer mechanisms as they relate to orientation. Thermal conductivity evaluation could provide a new tool in the arsenal of structural characterization techniques. This relationship between thermal conductivity and orientation is key for applications of directional heat dissipation in the passive layers of chip assemblies. Such a correlation has potential to speed the development cycles of new materials during formulation as well as assure properties during production.

Preparation and Properties of Heat-Dissipation Coating Filled with Carbon-Based Filler

2017 ◽  
Vol 898 ◽  
pp. 1532-1538
Author(s):  
Yue Gao ◽  
Qian Jin Mao ◽  
Hai Wang ◽  
Zi Ming Wang ◽  
Su Ping Cui
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Heat Dissipation ◽  
Filler Content ◽  
Simulated Data ◽  
Content Type ◽  
Element Simulation ◽  
Method Of Solution ◽  
High Emissivity ◽  
Pure Resin

Aiming at the heat dissipation of equipment, and based on ANSYS finite element simulation of thermal conductivity of coatings, the heat-dissipation coating filled with graphite and carbon nanotubes respectively, which integrates heat conduction (high thermal conductivity) and radiation (high emissivity), was successfully prepared by the method of solution mixing. Meanwhile, the effects of filler content, type and shape on thermal conductivity and emissivity of the coating were also investigated. The results indicate that the rising tendency between the simulated data by FEM and experimental value is consistent, which has a certain directive significance. In addition, graphite can improve the thermal conductivity and emissivity of the coating effectively; however, the emissivity decreases when the content exceeds 23.08%. The carbon nanotubes can improve the thermal conductivity and emissivity simultaneously, the thermal conductivity is 2.3 times that of pure resin, and the emissivity is up to 0.91 at the 2.0% mass fraction of carbon nanotubes.

scholarly journals The Kirchhoff Transformation for Convective-radiative Thermal Problemsin Fins

2021 ◽  
Vol 15 ◽  
pp. 12-21
Author(s):  
Jonatas Motta Quirino ◽  
Eduardo Dias Correa ◽  
Rodolfo do Lago Sobral
Keyword(s):  
Thermal Conductivity ◽  
Boundary Conditions ◽  
Thermal Radiation ◽  
Heat Dissipation ◽  
Variable Thermal Conductivity ◽  
Dirichlet Boundary Conditions ◽  
Heat Transfer Analysis ◽  
Temperature Function ◽  
Kirchhoff Transformation ◽  
Comparison Of The Results

- The present work describes the thermal profile of a single dissipation fin, where their surfaces reject heat to the environment. The problem happens in steady state, which is, all the analysis occurs after the thermal distribution reach heat balance considering that the fin dissipates heat by conduction, convection and thermal radiation. Neumann and Dirichlet boundary conditions are established, characterizing that heat dissipation occurs only on the fin faces, in addition to predicting that the ambient temperature is homogeneous. Heat transfer analysis is performed by computational simulations using appropriate numerical methods. The most of solutions in the literature consider some simplifications as constant thermal conductivity and linear boundary conditions, this work addresses this subject. The method applied is the Kirchhoff Transformation, that uses the thermal conductivity variation to define the temperatures values, once the thermal conductivity variate as a temperature function. For the real situation approximation, this work appropriated the silicon as the fin material to consider the temperature function at each point, which makes the equation that governs the non-linear problem. Finally, the comparison of the results obtained with typical results proves that the assumptions of variable thermal conductivity and heat dissipation by thermal radiation are crucial to obtain results that are closer to reality.

scholarly journals Core-Shell Sr2CeO4@SiO2 Filled COC‑Based Composites with Low Dielectric Loss for High-Frequency Substrates

Polymers ◽  
2021 ◽  
Vol 13 (22) ◽  
pp. 4006
Author(s):  
Qinlong Wang ◽  
Hao Wang ◽  
Caixia Zhang ◽  
Qilong Zhang ◽  
Hui Yang
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Loss ◽  
High Frequency ◽  
High Speed ◽  
Heat Dissipation ◽  
Coefficient Of Thermal Expansion ◽  
Signal Transmission ◽  
Sol Gel ◽  
Normal Operation ◽  
Core Shell

High-frequency communication equipment urgently needs substrate materials with lower dielectric loss, better heat dissipation, and higher stability, to ensure real-time low-loss and high-speed signal transmission. The core-shell structure of Sr2CeO4@SiO2 was prepared by the sol-gel method, and the modified powders with different volume contents were introduced into the cyclic olefin copolymer (COC) to prepare hydrocarbon resin-based composites. Due to the protective effect of the SiO2 shell, the stability of the powders is significantly improved, and the moisture barrier and corrosion resistance of the composites are enhanced, which is conducive to the normal operation of electronic equipment in harsh and complex environments. When the filler content is 20 vol%, the composite has a dielectric loss of 0.0023 at 10 GHz, a dielectric constant of 3.5, a thermal conductivity of 0.9 W·m−1·K−1, a water absorption of 0.32% and a coefficient of thermal expansion of 37.7 ppm/℃. The COC/Sr2CeO4@SiO2 composites exhibit excellent dielectric properties and thermal conductivity, while maintaining good moisture resistance and dimensional stability, which shows potential application prospects in the field of high-frequency substrates.

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