Performance and failure mechanisms of TiN diffusion barrier layers in submicron devices

1989 ◽  
Vol 65 (6) ◽  
pp. 2464-2469 ◽  
Author(s):  
A. Kohlhase ◽  
M. Mändl ◽  
W. Pamler
Keyword(s):  
Diffusion Barrier ◽  
Failure Mechanisms ◽  
Barrier Layers ◽  
Submicron Devices ◽  
Tin Diffusion Barrier

Rapid evaluation degradation activation energy of n-GaAs ohmic contacts with and without TiN diffusion barrier layers

2001 ◽  
Vol 45 (7) ◽  
pp. 1183-1187
Author(s):  
Wan-rong Zhang ◽  
Zhi-guo Li ◽  
Fu-chen Mu ◽  
Ying-hua Sun ◽  
Yao-hai Cheng ◽  
...  
Keyword(s):  
Activation Energy ◽  
Diffusion Barrier ◽  
Ohmic Contacts ◽  
Rapid Evaluation ◽  
Barrier Layers ◽  
Degradation Activation Energy ◽  
Tin Diffusion Barrier

Electrical characterization of reactively sputtered TiN diffusion barrier layers for copper metallization

1995 ◽  
Vol 91 (1-4) ◽  
pp. 291-294 ◽  
Author(s):  
C. Kaufmann ◽  
J. Baumann ◽  
T. Gessner ◽  
T. Raschke ◽  
M. Rennau ◽  
...  
Keyword(s):  
Diffusion Barrier ◽  
Electrical Characterization ◽  
Copper Metallization ◽  
Barrier Layers ◽  
Tin Diffusion Barrier

Limitation of Ti/TiN diffusion barrier layers in silicon technology

Vacuum ◽  
1985 ◽  
Vol 35 (12) ◽  
pp. 547-553 ◽  
Author(s):  
H. Norström ◽  
S. Nygren ◽  
P. Wiklund ◽  
M. Östling ◽  
R. Buchta ◽  
...  
Keyword(s):  
Diffusion Barrier ◽  
Barrier Layers ◽  
Silicon Technology ◽  
Tin Diffusion Barrier

Failure mechanisms of PVD Ta and ALD TaN barrier layers for Cu contact applications

2007 ◽  
Vol 84 (11) ◽  
pp. 2669-2674 ◽  
Author(s):  
C. Zhao ◽  
Zs. Tőkei ◽  
A. Haider ◽  
S. Demuynck
Keyword(s):  
Failure Mechanisms ◽  
Barrier Layers

Preferentially oriented and amorphous Ti, TiN and Ti/TiN diffusion barrier for Cu prepared by ion beam assisted deposition (IBAD)

2002 ◽  
Vol 151-152 ◽  
pp. 434-439 ◽  
Author(s):  
Kewei Chen ◽  
Yuhui Yu ◽  
Haichuan Mu ◽  
E.Z. Luo ◽  
B. Sundaravel ◽  
...  
Keyword(s):  
Diffusion Barrier ◽  
Ion Beam ◽  
Ion Beam Assisted Deposition ◽  
Tin Diffusion Barrier

scholarly journals Influence of Ni Catalyst Layer and TiN Diffusion Barrier on Carbon Nanotube Growth Rate

2010 ◽  
Vol 5 (3) ◽  
pp. 539-544 ◽  
Author(s):  
Jean-Baptiste A. Kpetsu ◽  
Pawel Jedrzejowski ◽  
Claude Côté ◽  
Andranik Sarkissian ◽  
Philippe Mérel ◽  
...  
Keyword(s):  
Growth Rate ◽  
Carbon Nanotube ◽  
Diffusion Barrier ◽  
Catalyst Layer ◽  
Ni Catalyst ◽  
Carbon Nanotube Growth ◽  
Nanotube Growth ◽  
Tin Diffusion Barrier
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