Thermal Stability of Building Structures with Phase-Change Materials

2010 ◽  
Author(s):  
Stanislav Št’astník ◽  
Theodore E. Simos ◽  
George Psihoyios ◽  
Ch. Tsitouras
2016 ◽  
Vol 644 ◽  
pp. 61-68 ◽  
Author(s):  
Latchmi Raghunanan ◽  
Michael C. Floros ◽  
Suresh S. Narine

2013 ◽  
Vol 291-294 ◽  
pp. 1159-1163
Author(s):  
Quan Ying Yan ◽  
Li Hang Yue ◽  
Li Li Jin ◽  
Ran Huo ◽  
Lin Zhang

This paper investigated the thermal performance of shape stabilized phase change paraffin and shape-stabilized phase change fatty acid. And the PCMs are mixtures of 60% 46# paraffin and 40% liquid paraffin, 65 % 48# paraffin and 35% liquid paraffin,30%capric acid and 70% lauric acid, 30%capric acid and 70% myristic acid. Support material is high-density polyethylene. The results in this paper show that: Thermal stability of both of the two types of phase change materials are good, thermal stability of shape stabilized phase change fatty acid is better than that of paraffin. Results in this paper can provide references and basis for the application of phase change material walls in the practice building.


2013 ◽  
Vol 649 ◽  
pp. 175-178
Author(s):  
David Bečkovský ◽  
Milan Ostrý ◽  
Tereza Kalábová ◽  
Vladimír Tichomirov

This paper deals with the impact of using phase change materials (PCM) in light building constructions. It describes how these materials react during the whole year, how they impact the summer temperature stability of a room and how they react in the transition period and in the heating period. Measuring was carried out in the experimental and reference room in the attic of the Institute of Building Structures. The layout of these identical rooms enables to compare the measured values. The measuring of the indoor climate, which had been carried out during the whole year in the reference and experimental room, was analyzed. The analysis was used to create the basic methodological procedure for using PCM in light building constructions. These materials proved to be efficient in the summer time. During the heating period the power consumption was monitored in relation to the application of the phase change materials.


2012 ◽  
Vol 590 ◽  
pp. 252-257 ◽  
Author(s):  
Francesco Aggogeri ◽  
Alberto Borboni ◽  
Angelo Merlo ◽  
Nicola Pellegrini

The aim of this study is to investigate passive control strategies using Phase Change Materials in Machine Tools (MTs) thermostabilization. By considering the main issues related to the thermal stability, authors presented the application of novel multifunctional materials to Machine Tools structures. A set of advanced materials are considered: aluminium foams, corrugate-core sandwich panels and polymeric concrete beds. The adopted solutions have been infiltrated by phase change materials (PCMs) in order to maintain the thermal stability of MTs when the environmental temperature is perturbed. The paper shows the results of simulative and experimental tests.


2014 ◽  
Vol 15 (5) ◽  
pp. 470-478 ◽  
Author(s):  
Adriana Bernardi ◽  
Francesca Becherini ◽  
Maria Dolores Romero-Sanchez ◽  
Angel Lopez-Buendia ◽  
Arianna Vivarelli ◽  
...  

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Nishant Saxena ◽  
Christoph Persch ◽  
Matthias Wuttig ◽  
Anbarasu Manivannan

AbstractPhase change memory (PCM) offers remarkable features such as high-speed and non-volatility for universal memory. Yet, simultaneously achieving better thermal stability and fast switching remains a key challenge. Thus, exploring novel materials with improved characteristics is of utmost importance. We report here, a unique property-portfolio of high thermal stability and picosecond threshold switching characteristics in In3SbTe2 (IST) PCM devices. Our experimental findings reveal an improved thermal stability of amorphous IST compared to most other phase change materials. Furthermore, voltage dependent threshold switching and current-voltage characteristics corroborate an extremely fast, yet low electric field threshold switching operation within an exceptionally small delay time of less than 50 picoseconds. The combination of low electric field and high speed switching with improved thermal stability of IST makes the material attractive for next-generation high-speed, non-volatile memory applications.


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