Elastic moduli, strength, and fracture initiation at sharp notches in etched single crystal silicon microstructures

1999 ◽  
Vol 85 (7) ◽  
pp. 3519-3534 ◽  
Author(s):  
Wan Suwito ◽  
Martin L. Dunn ◽  
Shawn J. Cunningham ◽  
David T. Read
Keyword(s):  
Single Crystal ◽  
Elastic Moduli ◽  
Single Crystal Silicon ◽  
Fracture Initiation ◽  
Crystal Silicon ◽  
Silicon Microstructures

scholarly journals Surface exfoliation analysis on single-crystal silicon under compressed plasma flow action

2018 ◽  
Vol 36 (1) ◽  
pp. 129-135
Author(s):  
J. Shen ◽  
I. Shahid ◽  
X. Yu ◽  
J. Zhang ◽  
H.W. Zhong ◽  
...  
Keyword(s):  
Thermal Stress ◽  
Single Crystal ◽  
Plasma Flow ◽  
Crack Depth ◽  
Single Crystal Silicon ◽  
Fracture Initiation ◽  
Scale Model ◽  
Integral Parameter ◽  
Crystal Silicon ◽  
Specific Material

AbstractSurface exfoliation was observed on single-crystal silicon surface under the action of compressed plasma flow (CPF). This phenomenon is mainly attributed to the strong transient thermal stress impact induced by CPF. To gain a better understanding of the mechanism, a micro scale model combined with thermal conduction and linear elastic fracture mechanics was built to analyze the thermal stress distribution after energy deposition. After computation with finite element method, J integral parameter was applied as the criterion for fracture initiation evaluation. It was demonstrated that the formation of surface exfoliation calls for specific material, crack depth, and CPF parameter. The results are potentially valuable for plasma/matter interaction understanding and CPF parameter optimization.

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