Sensors and Materials
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Published By Myu K.K.

0914-4935
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scholarly journals Repositioning Technique Based on 3D Model Using a Building Shape Registration Algorithm

2022 ◽  
Vol 34 (x) ◽  
pp. 1
Author(s):  
Jihun Kang ◽  
Jaehee Lee ◽  
Hongsik Yun ◽  
Seungjun Lee
Keyword(s):  
3D Model ◽  
Shape Registration ◽  
Registration Algorithm ◽  
Building Shape

scholarly journals Orthometric Corrections Using Gridded Gravity Data Derived from Digital Elevation Model

2022 ◽  
Vol 34 (x) ◽  
pp. 1
Author(s):  
Hong Sool Lee ◽  
Kwang Bae Kim ◽  
Chang Uk Woo ◽  
Hong Sik Yun
Keyword(s):  
Digital Elevation Model ◽  
Gravity Data ◽  
Digital Elevation ◽  
Elevation Model

scholarly journals High–Thick Thermal Reflow Process Using Vacuum-assisted Micromolding for Submillimeter Microvalves

2021 ◽  
Vol 33 (12) ◽  
pp. 4441
Author(s):  
Takaaki Abe ◽  
Shunya Okamoto ◽  
Yoshiaki Ukita
Keyword(s):  
Reflow Process ◽  
Thermal Reflow

scholarly journals Bandwidth Broadening of MEMS Vibration Energy Harvesters by Voltage-boost Rectifier Circuit

2021 ◽  
Vol 34 (x) ◽  
pp. 1
Author(s):  
Yukiya Tohyama ◽  
Hiroaki Honma ◽  
Hiroshi Toshiyoshi ◽  
Daisuke Yamane
Keyword(s):  
Vibration Energy ◽  
Rectifier Circuit ◽  
Energy Harvesters ◽  
Boost Rectifier ◽  
Bandwidth Broadening

scholarly journals Factors Facilitating Fusion between Dye-encapsulating Vesicles and Giant Unilamellar Vesicles

2021 ◽  
Vol 33 (12) ◽  
pp. 4361
Author(s):  
Daiya Mombayashi ◽  
Ami Yasuhara ◽  
Kai Hashino ◽  
Akira Heya ◽  
Koji Sumitomo
Keyword(s):  
Giant Unilamellar Vesicles ◽  
Unilamellar Vesicles
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