Deflection of a cantilever rectangular plate induced by surface stress with applications to surface stress measurement

2012 ◽  
Vol 111 (8) ◽  
pp. 083531 ◽  
Author(s):  
Xianwei Zeng ◽  
Jiaquan Deng ◽  
Xi Luo
Keyword(s):  
Rectangular Plate ◽  
Surface Stress ◽  
Stress Measurement ◽  
Cantilever Rectangular Plate

Development of a Bridge-Microcantilever by CMOS Process for Surface Stress Measurement

2009 ◽  
Author(s):  
Shih-Ming Yang ◽  
Chun Chang ◽  
Tsung-I Yin
Keyword(s):  
Scanning Probe Microscopy ◽  
Dna Hybridization ◽  
Surface Stress ◽  
Stress Measurement ◽  
Optical Element ◽  
Cmos Process ◽  
Functional Layer ◽  
Transparent Liquid ◽  
Optical Lever ◽  
Layer Coating

Microcantilever based biosensor have been the recent research interests for its versatility in data acquisition and interpretation. A microcantilever can measure the surface stress generated on any specific functional layer coating on a biochemical sensor. Berger et al. [1] showed the surface stress change by the alkanethiols on a probe. Fritz et al. [2] measured the DNA hybridization and receptor-ligand binding by a microcantilever. The surface stress measurement in the above works is mainly by measuring the microcantilever deflection based on the optical lever technique in scanning probe microscopy; however, alignment and calibration of the optical element for different testing species are by no means trivial. The technique may be futile when operating in non-transparent liquid.

Influence of Preparing of Specimen on Internal Stress Measurement of Aluminum Alloy Thick Plate

2010 ◽  
Vol 97-101 ◽  
pp. 2658-2663
Author(s):  
Kai Liao ◽  
Yun Xin Wu ◽  
Hai Gong
Keyword(s):  
Stress Distribution ◽  
Internal Stress ◽  
Surface Stress ◽  
Thick Plate ◽  
Stress Measurement ◽  
Stress Gradient ◽  
Real Surface ◽  
Measurement Results ◽  
Layer Removal Method ◽  
Internal Stress Measurement

The cut, a main preparing means of specimen, will cause a difference in stress distribution between thick plate and the specimen, so this article focuses on the topic of evaluating impact of the cut on stress measurement results. Firstly, the real surface stress distribution of the plate and specimen were determined by X-ray diffraction (XRD) and FEM. Secondly, according to the specimen dimension and machining procedure, the influence of the cut on internal stress measurement is obtained and compared with the FEM results. The conclusions are as follows: (1) the normal stress of cut plane steeply decreases and the stress gradient descends along with distance away from the cut. The range of distance is approximately one-thickness of specimen. (2) In order to obtain stable and reliable results, the plane size of specimen is taken three times larger than the thickness. (3) The milling processing of layer removal method (LRM) can change the surface stress state of specimen, but the machining effects on residual stresses can be removed by properly choosing milling parameters.

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