Thermodynamic understanding of Sn whisker growth on the Cu surface in Cu(top)-Sn(bottom) bilayer system upon room temperature aging

2015 ◽  
Vol 117 (21) ◽  
pp. 215308 ◽  
Author(s):  
Lin Huang ◽  
Wei Jian ◽  
Bing Lin ◽  
Yuren Wen ◽  
Lin Gu ◽  
...  
Keyword(s):  
Room Temperature ◽  
Whisker Growth ◽  
Sn Whisker ◽  
Bilayer System ◽  
Room Temperature Aging ◽  
Temperature Aging

Sn Whisker Growth in Cu(Top)-Sn(Bottom) Bilayer System upon Room Temperature Aging

2013 ◽  
Vol 785-786 ◽  
pp. 918-923 ◽  
Author(s):  
Lin Huang ◽  
Xue Nian Lin ◽  
Ren Wu Chen ◽  
Jiang Yong Wang
Keyword(s):  
Room Temperature ◽  
Whisker Growth ◽  
X Ray Diffraction ◽  
Sn Whisker ◽  
X Ray ◽  
Bilayer System ◽  
Room Temperature Aging ◽  
Sublayer Thickness ◽  
Temperature Aging ◽  
Scanning Electron

The Sn whisker growth in Cu(top)-Sn(bottom) bilayer system upon room temperature aging was investigated by scanning electron microscope and X-ray diffraction techniques. The experimental observations indicate that the Sn whisker growth on the Cu surface in Cu-Sn bilayer system is different from that on the Sn surface in Sn-Cu bilayer system. When the Sn sublayer thickness is less than 0.5μm, the Sn whisker growth can take place in Cu-Sn system but not in Sn-Cu system. An explanation for Sn whisker growth in Cu-Sn bilayer system is given.

scholarly journals Effects of Room Temperature Aging on Adhesion of Electroless Plating Film on Silicon Using Gold Nanoparticle Catalysts

2019 ◽  
Vol 70 (3) ◽  
pp. 174-176
Author(s):  
Yuichi TAKASAKA ◽  
Ryo FUJII ◽  
Naoki YAMADA ◽  
Naoki FUKUMURO ◽  
Susumu SAKAMOTO ◽  
...  
Keyword(s):  
Gold Nanoparticle ◽  
Electroless Plating ◽  
Room Temperature ◽  
Nanoparticle Catalysts ◽  
Room Temperature Aging ◽  
Temperature Aging

scholarly journals Effects of various pre-treatments and cold rolling on room temperature aging of 6000 series aluminum alloys

2009 ◽  
Vol 59 (5) ◽  
pp. 254-260
Author(s):  
Takahiko Nakamura ◽  
Kenji Muramatsu ◽  
Masanori Nagai ◽  
Ryouhei Otsu ◽  
Shin-ya Komatsu
Keyword(s):  
Aluminum Alloys ◽  
Cold Rolling ◽  
Room Temperature ◽  
Room Temperature Aging ◽  
Temperature Aging

scholarly journals On the room-temperature aging effects in YBa 2 Cu 3 O 6+δ

2015 ◽  
Vol 515 ◽  
pp. 54-61 ◽  
Author(s):  
А.V. Fetisov ◽  
G.А. Kozhina ◽  
S.Kh. Estemirova ◽  
V.Ya. Mitrofanov
Keyword(s):  
Room Temperature ◽  
Aging Effects ◽  
Room Temperature Aging ◽  
Temperature Aging

Preliminary Study on Deformation and Recrystallization Behavior of Pure Tin for Mitigation of Whisker Growth

2018 ◽  
Vol 273 ◽  
pp. 107-111 ◽  
Author(s):  
Noriyuki Kuwano ◽  
Marina Binti Lias ◽  
Nur Azmah Binti Nordin ◽  
Youhei Soejima ◽  
Ahmad Rafiqan bin Nayan
Keyword(s):  
Growth Process ◽  
Room Temperature ◽  
Whisker Growth ◽  
Recrystallization Behavior ◽  
Sn Whisker ◽  
Continuous Growth ◽  
Stable Boundary ◽  
The Matrix ◽  
Small Grains ◽  
Preliminary Study

Since the mechanism of Sn-whisker growth is closely related with the behavior of deformation and recrystallization, understanding of the behavior is very important to establish the measure for mitigation of whisker growth. In this work, microstructural changes after heavy deformation by scratching were characterized by EBSD for a single crystal of β-Sn, and the following results were obtained. Three types of crystal grains appear immediately after the deformation; small grains in aggregation, large serrated grains and rim-grains. The small grains are considered to be formed by dynamic recrystallization. They continue to grow at a room temperature over a lengthy period of time. The large grain has a certain crystallographic relationship with the matrix where <100> axes of the large grain and the matrix are almost parallel to each other. The serrated boundaries of large grain are so stable that the large grain does not show a grain growth process. The stable boundary is considered to promote a continuous growth of whiskers.

Atomic Force Microscope Manifestation of Heat-Resistant Polymer Thermal Stability

2014 ◽  
Vol 1073-1076 ◽  
pp. 2267-2271
Author(s):  
Tao Ping Chen ◽  
Biao Qiu ◽  
Na Wang ◽  
Ru He
Keyword(s):  
Thermal Stability ◽  
Atomic Force Microscope ◽  
Polymer Solution ◽  
Room Temperature ◽  
Branch Length ◽  
Status Change ◽  
Heat Resistant ◽  
Atomic Force ◽  
Room Temperature Aging ◽  
Temperature Aging

Aimed at BH heat-resistant polymer, 4500mg/L solution is compounded by oilfield sewage, and then diluted into 1500mg/L solution by oilfield sewage again under room temperature, aging in the constant temperature box of 95°C finally. Test slides are made of different aging time BH heat-resistance polymer solution, whose thermal stability is manifested by atomic force microscope. Results show the aggregation degree of BH heat-resistant polymer solution are different after aging for 30d, 60d, 90d under 95°C. They gather largely before aging, are into a loose branch distribution. After aging for 30d, their aggregation degree declines, branch length becomes shorter. After aging for 60d, their aggregation status change greatly, are into "╫╫" shape comb distribution. After aging for 90d, they gather into about 10μm in diameter short fat wafer, and are not easy to expand.

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