scholarly journals Thermal performance optimization of microchannels with smoothed corners assuming laminar flow and non-negligible viscous heating

2019 ◽  
Author(s):  
Marco Lorenzini ◽  
Nicola Suzzi
Keyword(s):  
Laminar Flow ◽  
Thermal Performance ◽  
Performance Optimization ◽  
Viscous Heating

Comparative Thermal Performance Analysis on Helical Screw Insert in Tube With Number of Strips With Nanofluid at Laminar Flow Regime

2020 ◽  
Vol 13 (1) ◽  
Author(s):  
Shashank Ranjan Chaurasia ◽  
R. M. Sarviya
Keyword(s):  
Reynolds Number ◽  
Nusselt Number ◽  
Laminar Flow ◽  
Flow Regime ◽  
Thermal Performance ◽  
Power Plants ◽  
Nanofluid Flow ◽  
Laminar Flow Regime ◽  
Twist Ratio ◽  
Single Strip

Abstract The experimental analysis is arranged to evaluate the thermal hydraulic performance on nanofluid flow in helical screw insert with tube at a number of strips and different twist ratios in laminar flow regime. The single strip (SS) helical screw inserts are also compared with the double strip (DS) helical screw inserts. The heat transfer enhancement is achieved with nanofluid flow in double strip as compared with single strip helical screw insert at decreased values of twist ratio and increased values of Reynolds number. A maximum enhancement of 421% is found in the value of Nusselt number with double strip helical screw insert at twist ratio of 1.5 and low value of Reynolds number in the flow of nanofluid than water in plain tube. The common correlations of Nusselt number and friction factor are generated. The thermal performance factor (TPF) is achieved at a maximum value of 2.42 with double strip than single strip helical screw inserts at twist ratio of 2.5 and low value of Reynolds number. The present analysis shows suitability of the double strip helical screw insert to enable miniaturization of the heat exchangers. A compact heat exchanger decreases the size of thermal application such as solar water heater, solar power plants, electronic cooling systems, radiator, etc., which could save environment by pollution reduction with utilization of energy.

scholarly journals Thermal Performance Optimization and Experimental Evaluation of Vacuum-Glazed Windows Manufactured via the In-Vacuum Method

Energies ◽  
2019 ◽  
Vol 12 (19) ◽  
pp. 3634
Author(s):  
Jaesung Park ◽  
Myunghwan Oh ◽  
Chul-sung Lee
Keyword(s):  
Energy Efficiency ◽  
Heat Flow ◽  
Thermal Performance ◽  
Performance Optimization ◽  
Residential Building ◽  
Vacuum Method ◽  
The Difference ◽  
Insulation Performance ◽  
Manufacturing Time ◽  
Indoor And Outdoor

Windows are essential in buildings; however, they have poor thermal performance, so extensive research has been conducted on improving their performance. In this study, we developed vacuum-glazed windows with excellent insulation via the in-vacuum method, which shortens the manufacturing time and vacuuming degree considerably. In addition, the configuration of the pillars, low-emissivity (low-e) coating, and frame from a thermal performance perspective was experimentally optimized. The results revealed that the optimal pillar placement spacing is 40 mm and that the low-e coating surface must be located inside the vacuum layer to maximize insulation performance. The vacuum-glazed window produced by the in-vacuum method was applied to an actual residential building to investigate its thermal performance, which was compared with that of a triple-glazed window. The results showed that the center-of-glazing heat flow of the vacuum-glazed window was approximately 0.8 W/m2K lower than that of the triple-glazed window. The difference between the average indoor and outdoor surface temperatures during the nighttime was found to be up to 35.1 °C for the vacuum-glazed window and 23.1 °C for the triple-glazed window. Therefore, the energy efficiency of the building can be greatly improved by applying vacuum windows manufactured via the in-vacuum method and optimized for the best thermal performance.

System-Level Transient Thermal Analysis for Performance Optimization of High Power Microelectronics

2003 ◽  
Author(s):  
Victor Adrian Chiriac ◽  
Tien-Yu Tom Lee ◽  
H. S. Chen
Keyword(s):  
Thermal Performance ◽  
Performance Optimization ◽  
Numerical Study ◽  
Optimal Operation ◽  
System Level ◽  
Main Concern ◽  
Efficient Operation ◽  
Normal Test ◽  
Transient Thermal ◽  
Short Time

The increasing trend in power levels and densities leads to the need of design thermal optimization, at either module or system level. A numerical study using finite-volume software was conducted to model the transient thermal behavior of a system including a package dissipating large amounts of power over short time durations. The system is evaluated by choosing the appropriate heat sink for the efficient operation of the device under 100W of constant powering, also to enhance the thermal performance of the enclosure/box containing the test stack-up. The intent of the study is to provide a meaningful understanding and prediction of the high transient powering scenarios. The study focuses on several powering and system design scenarios, identifying the main issues encountered during a normal device operation. The power source dissipates 100W for 2 seconds then is cooled for another 2 seconds. This thermal cycle is likely to occur several times during a normal test-up, and it is the main concern of the manufacturers not to exceed a limit temperature during the device testing operation. The transient trend is further extrapolated analytically to extract the steady state peak temperature values, in order to maintain the device peak temperatures below 120°C. The benefit of the study is related to the possibility to extract the maximum/minimum temperatures for a real test involving a large number of heating-cooling cycles, yet maintaining the initial and peak temperatures within a certain range, for the optimal operation of the device. The flow and heat transfer fields are thoroughly investigated. By using a combination of numerical and analytical study, the thermal performance of the device undergoing infinity of periodic thermal cycles is further predicted.

Sign in / Sign up

Export Citation Format

Share Document