RHEOLOGICAL PROPERTIES OF HOT-MELT PRESSURE-SENSITIVE ADHESIVE (HMPSAs) BASED ON STYRENE–ISOPRENE COPOLYMERS. PART 2: INNOVATIVE MOLECULAR DESIGN FROM PREDICTIVE FORMUlATION

2004 ◽  
Vol 80 (12) ◽  
pp. 1131-1151 ◽  
Author(s):  
C. Derail ◽  
M. N. Cazenave ◽  
F. X. Gibert ◽  
G. Marin ◽  
N. Kappes ◽  
...  
Keyword(s):  
Rheological Properties ◽  
Molecular Design ◽  
Pressure Sensitive Adhesive ◽  
Pressure Sensitive ◽  
Hot Melt

scholarly journals Design of pressure-sensitive adhesive suitable for the preparation of transdermal patches by hot-melt printing

2020 ◽  
Vol 586 ◽  
pp. 119607
Author(s):  
Umberto M. Musazzi ◽  
Marco A. Ortenzi ◽  
Chiara G.M. Gennari ◽  
Antonella Casiraghi ◽  
Paola Minghetti ◽  
...  
Keyword(s):  
Pressure Sensitive Adhesive ◽  
Pressure Sensitive ◽  
Transdermal Patches ◽  
Hot Melt

Preparation and properties of polyisobutene/organic montmorillonite hot melt pressure-sensitive adhesive (HMPSA)

2019 ◽  
Vol 95 (13-14) ◽  
pp. 1134-1145
Author(s):  
Xing Peng ◽  
Yu Wang ◽  
Hui Chen ◽  
Jie Ying ◽  
Jikui Wang
Keyword(s):  
Pressure Sensitive Adhesive ◽  
Organic Montmorillonite ◽  
Pressure Sensitive ◽  
Hot Melt

Molecular design for silane-terminated polyurethane applied to moisture-curable pressure-sensitive adhesive

2017 ◽  
Vol 134 (37) ◽  
pp. 45292 ◽  
Author(s):  
Ye Yuan ◽  
Yanyan Zhang ◽  
Xiaowei Fu ◽  
Weibo Kong ◽  
Zhimeng Liu ◽  
...  
Keyword(s):  
Molecular Design ◽  
Pressure Sensitive Adhesive ◽  
Pressure Sensitive

scholarly journals Feasibility of Processing Hot-Melt Pressure-Sensitive Adhesive (HMPSA) with Solvent in the Lab

Processes ◽  
2021 ◽  
Vol 9 (9) ◽  
pp. 1608
Author(s):  
Jing Xue ◽  
Jing Wang ◽  
Haofei Huang ◽  
Ming Wang ◽  
Yali Zhang ◽  
...  
Keyword(s):  
Bond Strength ◽  
Compositional Analysis ◽  
Weight Percent ◽  
Environmentally Benign ◽  
Pressure Sensitive Adhesive ◽  
Holding Power ◽  
Pressure Sensitive ◽  
Different Types ◽  
Physical Reasons ◽  
Hot Melt

Hot-melt pressure-sensitive adhesive (HMPSA) is an environmentally benign adhesive which is typically processed without solvent in industries. However, casting solution method is commonly used for experimental purposes in the lab for convenience. Therefore, seven types of solvent with different polarities, including toluene as the most commonly used solvent, were investigated in this work to study the feasibilities. Quick bond strength and holding power were tested with different types of solvents and different adhesive weight percent in the prepared solutions. Through viscosity measurement, thermal analysis, and compositional analysis, the correlation between the chosen solvents and adhesive performance was further explored. It was found that the differences in the obtained bond strength of HMPSA treated with a variety of solvents were due to physical reasons instead of chemical reactions, and a solvent with similar polarity to toluene (e.g., tetrachloride, octane) should be considered as an option because a similar polymer chain relaxation could be maintained as the original HMPSA without solvent treatment. In this study, the mechanism of choosing toluene as common solvent for HMPSA testing was analyzed, and the feasibility of optional solvents was discussed.

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