NON-FOURIER HEAT CONDUCTION EFFECT ON PREDICTION OF TEMPERATURE TRANSIENTS AND THERMAL STRESS IN SKIN CRYOPRESERVATION

2003 ◽  
Vol 26 (8) ◽  
pp. 779-798 ◽  
Author(s):  
Zhong-Shan Deng ◽  
Jing Liu
Keyword(s):  
Heat Conduction ◽  
Thermal Stress ◽  
Fourier Heat Conduction

Non-Fourier Heat Conduction in IC Chip

1995 ◽  
Vol 117 (3) ◽  
pp. 174-177 ◽  
Author(s):  
Zeng-Yuan Guo ◽  
Yun-Sheng Xu
Keyword(s):  
Heat Conduction ◽  
Thermal Stress ◽  
Thermal Noise ◽  
Wave Model ◽  
Transient Heat Conduction ◽  
Peak Temperature ◽  
Spatial Difference ◽  
Thermal Reliability ◽  
Fourier Heat Conduction ◽  
Fourier Equation

Instead of the classic Fourier equation based on diffusion, a hyperbolic equation based on a wave model has been used to predict the rapid transient heat conduction in IC chips. The peak temperature, spatial difference, and time variation of temperature, which are critical to thermal reliability of the chip, are given and compared with that obtained from the Fourier equation. Analytical and numerical results show that non-Fourier effects, including the higher peak temperature and thermal stress, greater temperature difference between components, and stronger thermal noise, are significant to IC chip reliability.

Thermal Stress Associated With Non-Fourier Heat Conduction in Femtosecond Laser Heating of Multilayer Metallic Films

2018 ◽  
Author(s):  
Swarup Bag ◽  
M. Ruhul Amin
Keyword(s):  
Thin Film ◽  
Heat Conduction ◽  
Thermal Stress ◽  
Temperature Distribution ◽  
Pulse Laser ◽  
Laser Heating ◽  
Laser Source ◽  
Phase Lag ◽  
Dual Phase ◽  
Fourier Heat Conduction

In the present work, the deformation behavior in metallic film subjected to ultra-short laser heating is investigated. Static thermo-elastic behavior is predicted for 100 nm thin film of either single layer or multiple layers. The temperature distribution is estimated from dual-phase lag non-Fourier heat conduction model. The maximum temperature after single pulse is achieved 730 K. The temperature profile for this pulse laser is used to compute elastic stress and distortion field following the minimization of potential energy of the system. In the present work, the simulation has been proposed by developing 3D finite element based coupled thermo-elastic model using dual phase lag effect. The experimental basis of transient temperature distribution in ultra-short pulse laser is extremely difficult or nearly impossible, the model results have been validated with literature reported thermal results. Since the temperature distribution due to pulse laser source varies with time, the stress analysis is performed in incremental mode. Hence, a sequentially coupled thermo-mechanical model is developed that is synchronized between thermal and mechanical analysis in each time steps of transient problem. The maximum equivalent stress is achieved 0.3 GPa. Numerical results show that the predicted thermal stress may exceeds the tensile strength of the material and may lead to crack or damage the thin film.

scholarly journals Thermal shock resistance of solids associated with hyperbolic heat conduction theory

2013 ◽  
Vol 469 (2153) ◽  
pp. 20120754 ◽  
Author(s):  
B. L. Wang ◽  
J. E. Li
Keyword(s):  
Heat Conduction ◽  
Thermal Stress ◽  
Stress Intensity ◽  
Thermal Shock ◽  
Thermal Shock Resistance ◽  
Closed Form Solution ◽  
Hyperbolic Heat Conduction ◽  
Conduction Model ◽  
Fourier Heat Conduction ◽  
Shock Resistance

The thermal shock resistance of solids is analysed for a plate subjected to a sudden temperature change under the framework of hyperbolic, non-Fourier heat conduction. The closed form solution for the temperature field and the associated thermal stress are obtained for the plate without cracking. The transient thermal stress intensity factors are obtained through a weight function method. The maximum thermal shock temperature that the plate can sustain without catastrophic failure is obtained according to the two distinct criteria: (i) maximum local tensile stress criterion and (ii) maximum stress intensity factor criterion. The difference between the non-Fourier solutions and the classical Fourier solution is discussed. The traditional Fourier heat conduction considerably overestimates the thermal shock resistance of the solid. This confirms the fact that introduction of the non-Fourier heat conduction model is essential in the evaluation of thermal shock resistance of solids.

scholarly journals Nonlinear Solution to a Non-Fourier Heat Conduction Problem in a Slab Heated by Laser Source

2016 ◽  
Vol 63 (1) ◽  
pp. 129-144
Author(s):  
Mohammad Javad Noroozi ◽  
Seyfolah Saedodin ◽  
Davood Domiri Ganji
Keyword(s):  
Heat Conduction ◽  
Heat Conduction Problem ◽  
Adomian Decomposition Method ◽  
Laser Source ◽  
Temperature Dependent ◽  
Conduction Model ◽  
Non Linear Equation ◽  
Adomian Decomposition ◽  
Non Linear ◽  
Fourier Heat Conduction

Abstract The effect of laser, as a heat source, on a one-dimensional finite body was studied in this paper. The Cattaneo-Vernotte non-Fourier heat conduction model was used for thermal analysis. The thermal conductivity was assumed temperature-dependent which resulted in a non-linear equation. The obtained equations were solved using the approximate-analytical Adomian Decomposition Method (ADM). It was concluded that the non-linear analysis is important in non-Fourier heat conduction problems. Significant differences were observed between the Fourier and non-Fourier solutions which stresses the importance of non-Fourier solutions in the similar problems.

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