Effective Thermal Conductivity of Composite Materials with 3-D Microstructures and Interfacial Thermal Resistance

2007 ◽  
Vol 53 (6) ◽  
pp. 577-604 ◽  
Author(s):  
Carlos F. Matt ◽  
Manuel E. Cruz
2021 ◽  
Author(s):  
Xiao-jian Wang ◽  
Liang-Bi Wang

Abstract The most common non-granular fillers are sheet and fiber. When they are distributed along the heat flux direction, the thermal conductivity of composite increases greatly. Meanwhile, the filler contact also has large effect on the thermal conductivity. However, the effect of filler contact on the thermal conductivity of composite with directional fillers has not been investigated. In this paper, the combined effects of filler contact, content and orientation are investigated. The results show that the effect of filler orientation on the thermal conductivity is greater than filler contact in low filler content, and exact opposite in high filler content. The effect of filler contact on fibrous and sheet fillers is far greater than cube and sphere fillers. This rule is affected by the filler contact. The filler content of 8% is the ideal percolation threshold of composite with fibrous and sheet filler. It is lower than cube filler and previous reports. The space for thermal conductivity growth of composite with directional filler is still very large. The effect of interfacial thermal resistance should be considered in predicting the thermal conductivity of composite under high Rc (>10-4).


2008 ◽  
Vol 75 (5) ◽  
Author(s):  
H. M. Yin ◽  
G. H. Paulino ◽  
W. G. Buttlar ◽  
L. Z. Sun

By means of a fundamental solution for a single inhomogeneity embedded in a functionally graded material matrix, a self-consistent model is proposed to investigate the effective thermal conductivity distribution in a functionally graded particulate nanocomposite. The “Kapitza thermal resistance” along the interface between a particle and the matrix is simulated with a perfect interface but a lower thermal conductivity of the particle. The results indicate that the effective thermal conductivity distribution greatly depends on Kapitza thermal resistance, particle size, and degree of material gradient.


2018 ◽  
Vol 12 ◽  
pp. 454-461 ◽  
Author(s):  
Ali Khodayari ◽  
Matteo Fasano ◽  
Masoud Bozorg Bigdeli ◽  
Shahin Mohammadnejad ◽  
Eliodoro Chiavazzo ◽  
...  

2016 ◽  
Vol 879 ◽  
pp. 1889-1894 ◽  
Author(s):  
Kenjiro Sugio ◽  
Rio Yamada ◽  
Yong Bum Choi ◽  
Gen Sasaki

Steady state thermal conductivity measuring device was designed to measure the effective thermal conductivity of composites. Computer simulations of thermal conduction revealed that the designed device over estimates the effective thermal conductivity, and the correction coefficient was suggested. With this designed device, the effective thermal conductivities of Al/SiC particle-dispersed composites were measured by changing the size of SiC particles from 0.3 μm to 3 μm. The critical element size which could determine the optimal size of reinforcements have been suggested, and validity of the critical element size for Al/SiC composites was confirmed. The thermal conductivity of the composites including small SiC particles was degraded by the interfacial thermal resistance between the matrix and the reinforcement. On the other hand, the thermal conductivity of the composites including large SiC particles was not affected by the interfacial thermal resistance. These results suggest that consideration of the critical element size is valid.


2018 ◽  
Vol 941 ◽  
pp. 1939-1943
Author(s):  
Kenjiro Sugio ◽  
Keisuke Kono ◽  
Yong Bum Choi ◽  
Gen Sasaki

Interfacial thermal resistance in Al-SiC composites was evaluated by comparing the measured thermal conductivity and the calculated thermal conductivity. Al-20vol.%SiC composites changing SiC particle size, 3 μm to 30 μm, was fabricated by spark plasma sintering and heat treatment. Effective thermal conductivity was measured with the steady state thermal conductivity measuring device. Effective thermal conductivity was also calculated by using SEM image and the measured relative density. Comparing the measured thermal conductivity and the calculated thermal conductivity, interfacial thermal resistance in Al-SiC composites was evaluated as about 1.0x10-8 (m2K)/W.


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