Peltier coefficient measurement in a thermoelectric module

2013 ◽  
Vol 34 (5) ◽  
pp. 1255-1262 ◽  
Author(s):  
Javier Garrido ◽  
Alejandro Casanovas ◽  
José María Chimeno
2020 ◽  
pp. 59-63
Author(s):  
A.S. Bondarenko ◽  
A.S. Borovkov ◽  
I.M. Malay ◽  
V.A. Semyonov

The analysis of the current state of the reflection coefficient measurements in waveguides at millimeter waves is carried out. An approach for solving the problem of reproducing the reflection coefficient measurement scale is proposed. Mathematical equations, which are the basis of the reflection coefficient measurement equation are obtained. The method of determining the metrological performance of reflection coefficient unit’s reference standards is developed. The results of electrodynamic modeling and analytical calculations by the developed method are compared. It is shown that this method can be used for reproducing the reflection coefficient unit in the development of the State primary standard.


Author(s):  
Joachim S. Graff ◽  
Raphael Schuler ◽  
Xin Song ◽  
Gustavo Castillo-Hernandez ◽  
Gunstein Skomedal ◽  
...  

AbstractThermoelectric modules can be used in waste heat harvesting, sensing, and cooling applications. Here, we report on the fabrication and performance of a four-leg module based on abundant silicide materials. While previously optimized Mg2Si0.3Sn0.675Bi0.025 is used as the n-type leg, we employ a fractional factorial design based on the Taguchi methods mapping out a four-dimensional parameter space among Mnx-εMoεSi1.75−δGeδ higher manganese silicide compositions for the p-type material. The module is assembled using a scalable fabrication process, using a Cu metallization layer and a Pb-based soldering paste. The maximum power output density of 53 μW cm–2 is achieved at a hot-side temperature of 250 °C and a temperature difference of 100 °C. This low thermoelectric output is related to the high contact resistance between the thermoelectric materials and the metallic contacts, underlining the importance of improved metallization schemes for thermoelectric module assembly.


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