Enhanced Light Output of InGaN-Based Light Emitting Diodes with Roughed p-Type GaN Surface by Using Ni Nanoporous Template

Fabricating GaN-based light-emitting diodes (LEDs) on a silicon (Si) substrate, which is compatible with the widely employed complementary metal–oxide–semiconductor (CMOS) circuits, is extremely important for next-generation high-performance electroluminescence devices. We conducted a systematic investigation of the optical properties of vertical LEDs, to reveal the impacts of the manufacturing process on their optical characteristics. Here, we fabricated and characterized high-efficiency GaN-based LEDs with integrated surface textures including micro-scale periodic hemispherical dimples and nano-scale random hexagonal pyramids on a 4 inch p-type Si substrate. The highly reflective Ag/TiW metallization scheme was performed to decrease downward-absorbing light. We demonstrated the influence of transferring LED epilayers from a sapphire substrate onto the Si substrate on the emission characteristics of the vertical LEDs. The removal of the sapphire substrate reduced the adverse impacts of the quantum-confined Stark effect (QCSE). The influence of integrated surface textures on the light extraction efficiency (LEE) of the vertical LEDs was studied. With the injection current of 350 mA, vertical LEDs with integrated surface textures demonstrated an excellent light output power of 468.9 mW with an emission peak wavelength of 456 nm. This work contributes to the integration of GaN-based vertical LEDs into Si-based integrated circuits.

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Low-Temperature Operation of Green, Blue and UV InGaN/GaN Multiple-Quantum-Well Light-Emitting Diodes

MRS Proceedings ◽

10.1557/proc-764-c5.5 ◽

2003 ◽

Vol 764 ◽

Author(s):

X. A. Cao ◽

S. F. LeBoeuf ◽

J. L. Garrett ◽

A. Ebong ◽

L. B. Rowland ◽

...

Keyword(s):

Quantum Well ◽

Light Emitting Diodes ◽

Multiple Quantum Well ◽

Light Output ◽

Localized States ◽

Multiple Quantum ◽

Nonradiative Recombination ◽

Light Emitting ◽

Temperature Range ◽

Green Leds

Absract:Temperature-dependent electroluminescence (EL) of InGaN/GaN multiple-quantum-well light-emitting diodes (LEDs) with peak emission energies ranging from 2.3 eV (green) to 3.3 eV (UV) has been studied over a wide temperature range (5-300 K). As the temperature is decreased from 300 K to 150 K, the EL intensity increases in all devices due to reduced nonradiative recombination and improved carrier confinement. However, LED operation at lower temperatures (150-5 K) is a strong function of In ratio in the active layer. For the green LEDs, emission intensity increases monotonically in the whole temperature range, while for the blue and UV LEDs, a remarkable decrease of the light output was observed, accompanied by a large redshift of the peak energy. The discrepancy can be attributed to various amounts of localization states caused by In composition fluctuation in the QW active regions. Based on a rate equation analysis, we find that the densities of the localized states in the green LEDs are more than two orders of magnitude higher than that in the UV LED. The large number of localized states in the green LEDs are crucial to maintain high-efficiency carrier capture at low temperatures.

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Improved Performance of GaN-Based Light-Emitting Diodes Grown on Si (111) Substrates with NH3 Growth Interruption

Micromachines ◽

10.3390/mi12040399 ◽

2021 ◽

Vol 12 (4) ◽

pp. 399

Author(s):

Sang-Jo Kim ◽

Semi Oh ◽

Kwang-Jae Lee ◽

Sohyeon Kim ◽

Kyoung-Kook Kim

Keyword(s):

Buffer Layer ◽

Light Emitting Diodes ◽

Defect Density ◽

Strain Relaxation ◽

Multiple Quantum Well ◽

Light Output ◽

Multiple Quantum ◽

Light Emitting ◽

Growth Interruption ◽

Aln Buffer

We demonstrate the highly efficient, GaN-based, multiple-quantum-well light-emitting diodes (LEDs) grown on Si (111) substrates embedded with the AlN buffer layer using NH3 growth interruption. Analysis of the materials by the X-ray diffraction omega scan and transmission electron microscopy revealed a remarkable improvement in the crystalline quality of the GaN layer with the AlN buffer layer using NH3 growth interruption. This improvement originated from the decreased dislocation densities and coalescence-related defects of the GaN layer that arose from the increased Al migration time. The photoluminescence peak positions and Raman spectra indicate that the internal tensile strain of the GaN layer is effectively relaxed without generating cracks. The LEDs embedded with an AlN buffer layer using NH3 growth interruption at 300 mA exhibited 40.9% higher light output power than that of the reference LED embedded with the AlN buffer layer without NH3 growth interruption. These high performances are attributed to an increased radiative recombination rate owing to the low defect density and strain relaxation in the GaN epilayer.

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