Cu-Ag core–shell nanoparticles with enhanced oxidation stability for printed electronics

2015 ◽  
Vol 26 (45) ◽  
pp. 455601 ◽  
Author(s):  
Changsoo Lee ◽  
Na Rae Kim ◽  
Jahyun Koo ◽  
Yung Jong Lee ◽  
Hyuck Mo Lee
Keyword(s):  
Printed Electronics ◽  
Oxidation Stability ◽  
Core Shell ◽  
Shell Nanoparticles ◽  
Enhanced Oxidation ◽  
Core Shell Nanoparticles

Laser sintering of Cu@Ag core-shell nanoparticles for printed electronics applications

2020 ◽  
Vol 25 ◽  
pp. 447-450
Author(s):  
Alexander I. Titkov ◽  
Olga A. Logutenko ◽  
Alexander M. Vorobyev ◽  
Tatyana A. Borisenko ◽  
Natalia V. Bulina ◽  
...  
Keyword(s):  
Printed Electronics ◽  
Laser Sintering ◽  
Core Shell ◽  
Shell Nanoparticles ◽  
Core Shell Nanoparticles

Enhanced Oxidation-Resistant Cu@Ni Core–Shell Nanoparticles for Printed Flexible Electrodes

2017 ◽  
Vol 10 (1) ◽  
pp. 1059-1066 ◽  
Author(s):  
Tae Gon Kim ◽  
Hye Jin Park ◽  
Kyoohee Woo ◽  
Sunho Jeong ◽  
Youngmin Choi ◽  
...  
Keyword(s):  
Core Shell ◽  
Shell Nanoparticles ◽  
Flexible Electrodes ◽  
Oxidation Resistant ◽  
Enhanced Oxidation ◽  
Core Shell Nanoparticles

scholarly journals Effect of Oxalic Acid Treatment on Conductive Coatings Formed by Ni@Ag Core–Shell Nanoparticles

Materials ◽  
2022 ◽  
Vol 15 (1) ◽  
pp. 305
Author(s):  
Anna Pajor-Świerzy ◽  
Radosław Pawłowski ◽  
Piotr Sobik ◽  
Alexander Kamyshny ◽  
Krzysztof Szczepanowicz
Keyword(s):  
Oxalic Acid ◽  
Printed Electronics ◽  
Sintering Temperature ◽  
Low Cost ◽  
Future Application ◽  
Core Shell ◽  
Metallic Coatings ◽  
Ag Nps ◽  
Shell Nanoparticles ◽  
Core Shell Nanoparticles

Low-cost metallic nanoink based on nickel–silver core–shell nanoparticles (Ni@Ag NPs) was used for the formation of conductive metallic coatings with low sintering temperature, which can be successfully applied for replacement of currently used silver-based nanoinks in printed electronics. The effect of oxalic acid (OA) on the sintering temperature and conductivity of coatings formed by Ni@Ag NPs was evaluated. It was found that the addition of OA to the ink formulation and post-printing treatment of deposited films with this acid provided a noticeable decrease in the sintering temperature required for obtaining conductive patterns that is especially important for utilizing the polymeric substrates. The obtained resistivity of metallic coatings after sintering at temperature as low as 100 °C was found to be 30 µΩ·cm, only ~4 times higher compared to the resistivity of bulk Ni that is promising for future application of such materials for fabrication of low-cost flexible printed patterns.

Cu@Ni core–shell nanoparticles prepared via an injection approach with enhanced oxidation resistance for the fabrication of conductive films

2020 ◽  
Vol 31 (35) ◽  
pp. 355601
Author(s):  
Yanping Fang ◽  
Xiangzhe Zeng ◽  
Yuanzhi Chen ◽  
Mingwei Ji ◽  
Hongfei Zheng ◽  
...  
Keyword(s):  
Oxidation Resistance ◽  
Core Shell ◽  
Shell Nanoparticles ◽  
Conductive Films ◽  
Enhanced Oxidation ◽  
Core Shell Nanoparticles
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