scholarly journals Transient Thermal Analysis of a Hybrid Energy Harvester

2021 ◽  
Vol 850 (1) ◽  
pp. 012015
Author(s):  
Varun Gopalakrishnan ◽  
Swetha S Manian ◽  
A Karen ◽  
H Niranjan ◽  
T Venugopal ◽  
...  

Abstract The seasonal nature of solar panels and windmills has been a major challenge towards realizing sustainable energy. Over the years, several attempts have been made to perfect a device capable of harnessing the energy of wind and rain, titled as triboelectric and piezoelectric nano generators. Although such technologies yield promising results, a superior energy device can be achieved by addition of solar cells to wind and rain energy harvesting devices. Hybrid Nano generators are expected to be the future of commercially sustainable energy generation which are used to simultaneously harvest wind, rain, and solar energy. Though a substantial amount of work has been done with regard to such energy harvesting modules, studies that test their environmental capabilities are limited. In this study, a hybridized power panel comprising of dual-mode triboelectric nano generator and a solar cell have been tested under majorly solar, majorly windy, majorly rainy, and normal tropical conditions. Average temperature attained by the panel in such conditions have been studied through a transient thermal analysis done using Ansys Fluent. The results obtained are used to calculate thermal strain in the panel for different cases. The proposed model is an innovative way to make use of energy.

1993 ◽  
Vol 103 (1) ◽  
pp. 19-33
Author(s):  
Michael J. Gaeta ◽  
Frederick R. Best

2018 ◽  
Vol 2018 (HiTEC) ◽  
pp. 000028-000031 ◽  
Author(s):  
Fumiki Kato ◽  
Hiroki Takahashi ◽  
Hidekazu Tanisawa ◽  
Kenichi Koui ◽  
Shinji Sato ◽  
...  

Abstract In this paper, we demonstrate that the structural degradation of a silicon carbide (SiC) power module corresponding to thermal cycles can be detected and tracked non-destructively by transient thermal analysis method. The purpose of this evaluation is to analyze the distribution of the thermal resistance in the power module and to identify the structure deterioration part. The power module with SiC-MOSFET were assembled using ZnAl eutectic solder as device under test. The individual thermal resistance of each part such as the SiC-die, the die-attachment, the AMCs, and the baseplate was successfully evaluated by analyzing the structure function graph. A series of thermal cycle test between −40 and 250°C was conducted, and the power modules were evaluated their thermal resistance taken out from thermal cycle test machine at 100, 200, 500 and 1000 cycles. We confirmed the increase in thermal resistance between AMCs and base plate in each thermal cycle. The portion where the thermal resistance increased is in good agreement with the location of the structural defect observed by scanning acoustic tomography (SAT) observation.


Author(s):  
M T Anual ◽  
T R Sahroni ◽  
S Akmal ◽  
F A Nasution

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