scholarly journals Effect of auxiliary friction on nickel electroforming deposits

Author(s):  
Yong Zhang ◽  
Jian Zhang
2007 ◽  
Vol 339 ◽  
pp. 246-251
Author(s):  
L.Q. Du ◽  
C. Liu ◽  
H.J. Liu ◽  
J. Qin ◽  
N. Li ◽  
...  

Micro hot embossing mold of microfluidic chip used in flow cytometry is designed and microfabricated. After some kinds of microfabrication processes are tried, this paper presents a novel microfabrication technology of micro hot embossing metal mold. Micro metal mold is fabricated by low-cost UV-LIGA surface micro fabrication process using negative thick photoresist, SU-8. Different from other micro hot embossing molds, the micro mold with vertical sidewalls is fabricated by micro nickel electroforming directly on Nickel base. Based on the micro Nickel mold and automation fabrication system, high precision and mass-producing microfluidic chips have been fabricated and they have been used in flow cytometry


2013 ◽  
Vol 284-287 ◽  
pp. 2032-2036
Author(s):  
Chiang Ho Cheng ◽  
Yi Pin Tseng

This paper aims to present the design, fabrication and test of a novel piezoelectrically actuated, check valve embedded micropump having the advantages of miniature size, light weight and low power consumption. The micropump consists of a piezoelectric actuator, a stainless steel chamber layer with membrane, two stainless steel channel layers with two valve seats, and a nickel check valve layer with two bridge-type check valves. The check valve layer was fabricated by nickel electroforming process on a stainless steel substrate. The chamber and the channel layer were made of the stainless steel manufactured using the lithography and etching process based on MEMS fabrication technology. The effects of check valve thickness, operating frequency and back pressure on the flow rate of the micropump are investigated. The micropump with check valve 20 μm in thickness obtained higher output values under the sinusoidal waveform of 120 Vpp and 160 Hz. The maximum flow rate and backpressure are 1.82 ml/min and 32 kPa, respectively.


2001 ◽  
Vol 111 (1-3) ◽  
pp. 286-294 ◽  
Author(s):  
Prasad K.D.V. Yarlagadda ◽  
Ismet P. Ilyas ◽  
Periklis Christodoulou

2016 ◽  
Vol 23 (10) ◽  
pp. 2536-2541 ◽  
Author(s):  
Bing-yan Jiang ◽  
Can Weng ◽  
Ming-yong Zhou ◽  
Hui Lv ◽  
Dietmar Drummer

2010 ◽  
Vol 58 (676) ◽  
pp. 146-151
Author(s):  
Kazuyuki HIGASHINO ◽  
Shinichi KOMAZAKI ◽  
Yousuke SASAYAMA ◽  
Kenichi KIMOTO ◽  
Hiroyuki SAKAGUCHI ◽  
...  

Author(s):  
Yoshitaka SAWA ◽  
Takeshi KITADANI ◽  
Teppei KIMURA ◽  
Kenji YAMASHITA ◽  
Tadashi HATTORI

CIRP Annals ◽  
2006 ◽  
Vol 55 (1) ◽  
pp. 193-196 ◽  
Author(s):  
D. Zhu ◽  
Z.W. Zhu ◽  
N.S. Qu

2013 ◽  
Vol 770 ◽  
pp. 145-149 ◽  
Author(s):  
Zeng Wei Zhu ◽  
Dong Wang ◽  
Jian Hua Ren

Spherical abrasives were employed to polish the growing deposited layer during nickel electroforming process. On a translational flat cathode, nickel deposits with distinct polishing mark were obtained. It was found that the abrasive polishing can help to improve the microstructure and increase the mechanical properties of the nickel deposits. Compared with the deposits prepared with traditional method, the microstructure became more homogeneous and the microhardness increased nearly two times. The increase of current density led to coarse structure and lower microhardness.


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