Improvement of thickness deposition uniformity in nickel electroforming for micro mold inserts

2016 ◽  
Vol 23 (10) ◽  
pp. 2536-2541 ◽  
Author(s):  
Bing-yan Jiang ◽  
Can Weng ◽  
Ming-yong Zhou ◽  
Hui Lv ◽  
Dietmar Drummer
Keyword(s):  
Nickel Electroforming ◽  
Deposition Uniformity

Optimization of deposition uniformity during silicon epitaxy in deep trenches

2019 ◽  
Vol 34 (2) ◽  
pp. 024001 ◽  
Author(s):  
Alexander Segal ◽  
Eugene Yakovlev ◽  
Denis Bazarevskiy ◽  
Roman Talalaev ◽  
Hocine Ziad ◽  
...  
Keyword(s):  
Silicon Epitaxy ◽  
Deposition Uniformity

scholarly journals Электрохимическое осаждение контактных материалов в постростовой технологии фотоэлектрических преобразователей

2022 ◽  
Vol 56 (3) ◽  
pp. 376
Author(s):  
А.В. Малевская ◽  
Н.Д. Ильинская ◽  
Д.А. Малевский ◽  
П.В. Покровский
Keyword(s):  
Electrochemical Deposition ◽  
Ohmic Contacts ◽  
Deposition Process ◽  
Contact System ◽  
Horizontal Position ◽  
Deposition Uniformity ◽  
Galvanic Deposition

Investigations and modeling of ohmic contacts electrochemical deposition process in postgrowth technology of photovoltaic converters fabrication have been carried out. The technology of Ag/Au contact system galvanic deposition at vertical and horizontal position of heterostructure and anode in the electrolyte has been developed. The increase of contact system deposition uniformity up to ∼ 95% at the thickness of contact bus-bars ∼ 5 µm on the heterostructure area with 4 inch diameter has been archived.

Electrolytic Solder Deposition for IC-Substrates: From Deposition Uniformity to Solder Ball Geometry

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 002424-002464
Author(s):  
Bernd Roelfs ◽  
Kai Matejat
Keyword(s):  
Solder Ball ◽  
Electrolytic Deposition ◽  
Tin Alloys ◽  
Joint Reliability ◽  
Future Production ◽  
Main Emphasis ◽  
Solder Balls ◽  
Ball Diameter ◽  
Reverse Pulse ◽  
Deposition Uniformity

The current screen printing process for solder deposition on IC substrates is coming to a technology boundary due to the continuous down sizing of the solder structures. This will require soon new methods of solder transfer to the substrate. This paper describes an alternative process based on electrolytic deposition of Tin and Tin alloys for sub 100 μm solder balls. A suitable process sequence is evaluated and described in detail. Uniformity of the electroplated deposits both in terms of solder thickness and chemical composition is of vital importance for the process. Thickness determines the solder ball diameter after reflow and elemental composition influences the reflow performance and solder joint reliability. We will present in this paper results from an investigation program to identify main parameters for the distribution of the plated solder. Main emphasis is here on difference between direct plated (DC) and reverse pulse plated (RPP)deposits. We want to clarify if reverse pulse plated layers exhibit a better distribution than dc plated deposits as known from other applications. As a 2nd very important parameter electrolyte flow is identified. We will show how variations in these parameters itself are translated first in variations of the plated layer and then – after reflow- into different solder ball geometries. Understanding these influences will help introducing this technology into future production scenarios.

DEPOSITION UNIFORMITY OF PULSED VACUUM ARC ION SOURCE

2005 ◽  
pp. 39-43
Author(s):  
Cai Changlong ◽  
Mi Qian ◽  
Ma Weihong ◽  
Wu Lingling ◽  
Yan Yixin ◽  
...  
Keyword(s):  
Ion Source ◽  
Vacuum Arc ◽  
Deposition Uniformity

Design and Fabrication of Micro Hot Embossing Mold for Microfluidic Chip Used in Flow Cytometry

2007 ◽  
Vol 339 ◽  
pp. 246-251
Author(s):  
L.Q. Du ◽  
C. Liu ◽  
H.J. Liu ◽  
J. Qin ◽  
N. Li ◽  
...  
Keyword(s):  
Flow Cytometry ◽  
Microfluidic Chip ◽  
Low Cost ◽  
Hot Embossing ◽  
Microfluidic Chips ◽  
Metal Mold ◽  
Nickel Electroforming ◽  
Thick Photoresist ◽  
Nickel Base ◽  
Microfabrication Technology

Micro hot embossing mold of microfluidic chip used in flow cytometry is designed and microfabricated. After some kinds of microfabrication processes are tried, this paper presents a novel microfabrication technology of micro hot embossing metal mold. Micro metal mold is fabricated by low-cost UV-LIGA surface micro fabrication process using negative thick photoresist, SU-8. Different from other micro hot embossing molds, the micro mold with vertical sidewalls is fabricated by micro nickel electroforming directly on Nickel base. Based on the micro Nickel mold and automation fabrication system, high precision and mass-producing microfluidic chips have been fabricated and they have been used in flow cytometry

Improvement of deposition uniformity in alloy electroforming for revolving parts

2008 ◽  
Vol 48 (3-4) ◽  
pp. 329-337 ◽  
Author(s):  
Jian-Ming Yang ◽  
Dong-Hyun Kim ◽  
Di Zhu ◽  
Kun Wang
Keyword(s):  
Deposition Uniformity

Design and Fabrication of the Piezoelectrically Actuated Micropump with Implanted Check Valves

2013 ◽  
Vol 284-287 ◽  
pp. 2032-2036
Author(s):  
Chiang Ho Cheng ◽  
Yi Pin Tseng
Keyword(s):  
Stainless Steel ◽  
Flow Rate ◽  
Steel Substrate ◽  
Check Valve ◽  
Maximum Flow ◽  
Mems Fabrication ◽  
Sinusoidal Waveform ◽  
Nickel Electroforming ◽  
Bridge Type ◽  
Type Check

This paper aims to present the design, fabrication and test of a novel piezoelectrically actuated, check valve embedded micropump having the advantages of miniature size, light weight and low power consumption. The micropump consists of a piezoelectric actuator, a stainless steel chamber layer with membrane, two stainless steel channel layers with two valve seats, and a nickel check valve layer with two bridge-type check valves. The check valve layer was fabricated by nickel electroforming process on a stainless steel substrate. The chamber and the channel layer were made of the stainless steel manufactured using the lithography and etching process based on MEMS fabrication technology. The effects of check valve thickness, operating frequency and back pressure on the flow rate of the micropump are investigated. The micropump with check valve 20 μm in thickness obtained higher output values under the sinusoidal waveform of 120 Vpp and 160 Hz. The maximum flow rate and backpressure are 1.82 ml/min and 32 kPa, respectively.

Homogeneous and Heterogeneous Chemistry of Methane Deposition Plasmas

1986 ◽  
Vol 68 ◽  
Author(s):  
W. O. Partlow ◽  
L. E. Kline
Keyword(s):  
Plug Flow ◽  
Ionization Rate ◽  
Rate Coefficients ◽  
Diffusive Transport ◽  
Heterogeneous Chemical Reaction ◽  
Surface Reflection ◽  
Heterogeneous Chemical ◽  
Variable Surface ◽  
Mass Flow Rates ◽  
Deposition Uniformity

AbstractExperimental measurements and theoretical modeling of methane deposition plasmas have made it possible to determine the most likely homogeneous and heterogeneous chemical reaction paths leading to deposition of hydrogenated carbon from the fragments of electron dissociated methane.The methane plasma was modeled as a plug-flow reactor.Gas phase reactions, diffusive transport, variable surface reflection coefficients, and surface chemical reactions are included in the model which follows a “plug” of gas as it flows through the reactor.Boltzmann equation and Monte Carlo calculations were used to determine the electron energy distribution and the resulting dissociation and ionization rate coefficients averaged over space and time.Experimental measurements of the time dependent electrical properties of the plasma are used as input to the model.Deposition rates, deposition uniformity, downstream mass spectroscopy, and the dependences of these quantities on power and mass flow rates are compared to the model to arrive at a consistent representation of the deposition chemistry.

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