Morphology and Intermetallic Study of (Sn-8Zn-3Bi)-1Ni Solder under Liquid State Aging

2015 ◽  
Vol 1087 ◽  
pp. 162-166
Author(s):  
Nor Aishah Jasli ◽  
Hamidi Abd Hamid ◽  
Ramani Mayappan
Keyword(s):  
Liquid State ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reflow Time ◽  
Intermetallic Formation ◽  
X Ray ◽  
Ni Addition ◽  
Free Solder ◽  
Scanning Electron

This study investigated the effect of Ni addition on intermetallic formation in the Sn-8Zn-3Bi solder under liquid state aging. The intermetallic compounds were formed by reacting the solder alloy with copper substrate. Different reflow time was used at temperature 220°C. Morphology of the phases formed was observed using scanning electron microscope (SEM) and in order to determine elemental compositions of the phases, energy dispersive x-ray (EDX) was used. The formation of the reaction layer led by Cu5Zn8 intermetallic and then followed by Cu6Sn5 and Cu3Sn when reflow time increases. Keywords: lead free solder, intermetallic, Cu5Zn8, Cu6Sn5, liquid state aging.

Growth of Cu-Zn5 and Cu5Zn8 Intermetallic Compounds in the Sn-9Zn/Cu Joint during Liquid State Aging

2010 ◽  
Vol 173 ◽  
pp. 90-95 ◽  
Author(s):  
Ramani Mayappan ◽  
Rosyaini A. Zaman ◽  
Zalina Z. Abidin ◽  
Fatinnajihah Alias Asmawati ◽  
Mohd Nazree Derman
Keyword(s):  
Liquid State ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
X Ray ◽  
Soldering Temperature ◽  
Soldering Time ◽  
Free Solder ◽  
Thickness Measurements ◽  
Scanning Electron

The phase and intermetallic thickness of Cu-Zn5 and Cu5Zn8 has been investigated under liquid state aging using reflow method. Both intermetallics were formed by reacting Sn-9Zn lead free solder with copper substrate. Scanning electron microscope (SEM) was used to see the morphology of the phases and energy dispersive x-ray (EDX) was used to estimate the elemental compositions of the phases. The morphology of the Cu5Zn8 phase was rather flat but when the soldering temperature and time increases, the morphology becomes scallop. Intermetallic thickness measurements show that the thickness of Cu-Zn5 decreases with increasing soldering time and temperature. Whereas, the thickness of Cu5Zn8 intermetallic increases with soldering time and temperature.

Wettability and Bond Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate

2015 ◽  
Vol 830-831 ◽  
pp. 215-218 ◽  
Author(s):  
Sanjay Tikale ◽  
Mrunali Sona ◽  
K.N. Prabhu
Keyword(s):  
Shear Strength ◽  
Solder Alloy ◽  
Copper Substrate ◽  
Bulk Solder ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reflow Time ◽  
Bond Shear Strength ◽  
Lead Free Solder Alloy ◽  
Free Solder

Lead-free solders are environment friendly and are in great demand for microelectronic applications. In the present study, Sn-9Zn lead free solder alloy was solidified on Cu substrate for different reflow times from 10 to 1000s. The influence of reflow time on wetting, formation of intermetallic compounds (IMCs) and bond shear strength was studied using dynamic contact angle analyzer, bond tester and scanning electron microscopy. The results indicate that, the wettability of the solder alloy increased with increase in reflow time. Microstructure study revealed the presence of Cu5Zn8 and CuZn5 IMCs at the interface. The thickness of an IMC increased with increase in the reflow time. The mean thickness of about 11μm for Cu5Zn8 IMC layer was observed for the reflow time of 1000s. The thickness of CuZn5 layer increased up to a reflow time of 100s and decreases thereafter. The bond shear strength increased up to 100s and decreased with increase in reflow time. The decrement in shear strength at higher reflow time is mainly due to excessive thickness of Cu5Zn8 IMC layer and diffusion of Sn from bulk solder towards the substrate. The excessive thick IMC layer exhibited pre micro-cracks led to the brittle failure of bond under the influence of shear stress.

Intermetallic Evolution of Sn-3.5Ag-1.0Cu-0.1Zn/Cu Interface under Thermal Aging

2012 ◽  
Vol 620 ◽  
pp. 142-146 ◽  
Author(s):  
Iziana Yahya ◽  
Noor Asikin Ab Ghani ◽  
Nur Nadiah Zainal Abiddin ◽  
Hamidi Abd Hamid ◽  
Ramani Mayappan
Keyword(s):  
Powder Metallurgy ◽  
Lead Free ◽  
Environmental Concerns ◽  
Lead Free Solder ◽  
Intermetallic Formation ◽  
X Ray ◽  
Zn Addition ◽  
Free Solder ◽  
Lead Free Solders ◽  
Powder Metallurgy Route

Due to environmental concerns, lead-free solders were introduced in replacing the lead-based solders in microelectronics devices technology. Although there are many lead-free solder available, the Sn-Ag-Cu is considered the best choice. But the solder has its draw backs in terms of melting temperature and intermetallic formations. To improve the solder, a fourth element Zn was added into the solder. The new composite solders were synthesized via powder metallurgy route. This research studies the effect of 0.1wt% Zn addition on the hardness and intermetallic formation on Cu substrate. For the hardness results, the micro Vickers values were reported. For intermetallic, the solders were melted at 250°C and aged at 150°C until 400 hours. The microhardness value for Zn based composites solder shows higher micro Vickers hardness compared to un-doped counterparts. The phases formed and its growth was studied under SEM and by energy dispensive x-ray (EDX). The SEM results show the presence of Cu6Sn5and Cu3Sn intermetallics and the Cu5Zn8intermetallic was not detected. The addition of 0.1wt% Zn has retarded the growth of the Cu3Sn intermetallic but not the total intermetallic thickness.

Microstructure Evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu System Lead Free Solder under Long Term Thermal Aging

2012 ◽  
Vol 620 ◽  
pp. 263-267 ◽  
Author(s):  
Noor Asikin Ab Ghani ◽  
Iziana Yahya ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Shamsuddin Saidatulakmar ◽  
Zainal Arifin Ahmad ◽  
...  
Keyword(s):  
Copper Substrate ◽  
Lead Free ◽  
Environmental Concerns ◽  
Lead Free Solder ◽  
Melting Temperatures ◽  
Ni Addition ◽  
Free Solder ◽  
Lead Free Solders ◽  
Powder Metallurgy Route

Due to environmental concerns, lead-free solders were introduced in replacing the lead-based solders in microelectronics devices technology. Although there are many lead-free solder available, the Sn-Ag-Cu solder was considered the best choice. But the solder has its draw backs in terms of melting temperature and intermetallic formations. In this study, the effect of 0.5wt% Ni addition on the microstructure of the Sn-3.5Ag-1.0Cu solder was investigated. The solder was synthesized via powder metallurgy route which includes blending, compacting and sintering. The solders were characterized for its densities and melting temperatures. SEM was used to observe the microstructure of intermetallic phases. The solders were melted on copper substrate at 250°C for one minute and aged at 150°C from 0 to 400 hours. The phases formed were studied under SEM. The SEM results showed the presence of Cu6Sn5, Cu3Sn, Ag3Sn and (Cu,Ni)6Sn5 intermetallics.

Quantitative Evaluation of Voids in Lead Free Solder Joints

2015 ◽  
Vol 772 ◽  
pp. 284-289 ◽  
Author(s):  
Sabuj Mallik ◽  
Jude Njoku ◽  
Gabriel Takyi
Keyword(s):  
Solder Bump ◽  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
X Ray ◽  
Size And Shape ◽  
Solder Bumps ◽  
Free Solder

Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections. Experiments were designed to investigate how void formation is affected by solder bump size and shape, differences in reflow time and temperature, and differences in solder paste formulation. Four different lead-free solder paste samples were used to produce solder bumps on a number of test boards, using surface mount reflow soldering process. Using an advanced X-ray inspection system void percentages were measured for three different size and shape solder bumps. Results indicate that the voiding in solder joint is strongly influenced by solder bump size and shape, with voids found to have increased when bump size decreased. A longer soaking period during reflow stage has negatively affectedsolder voids. Voiding was also accelerated with smaller solder particles in solder paste.

scholarly journals Effect of the bismuth content on the interface reactions between copper substrate and Sn-Zn-Al-Bi lead-free solder

2005 ◽  
Vol 41 (Extra) ◽  
pp. 208-212
Author(s):  
D. Soares ◽  
C. Vilarinho ◽  
J. Barbosa ◽  
R. Silva ◽  
F. Castro
Keyword(s):  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Bismuth Content ◽  
Interface Reactions ◽  
Free Solder

SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly

2018 ◽  
Vol 30 (1) ◽  
pp. 1-13 ◽  
Author(s):  
Fakhrozi Che Ani ◽  
Azman Jalar ◽  
Abdullah Aziz Saad ◽  
Chu Yee Khor ◽  
Roslina Ismail ◽  
...  
Keyword(s):  
Electron Microscope ◽  
Solder Joint ◽  
Solder Joints ◽  
Ion Beam ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Content Type ◽  
X Ray ◽  
Free Solder

Purpose This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO2 nanoparticles in an electronic assembly. Design/methodology/approach This study focused on the microstructure and quality of solder joints. Various percentages of TiO2 nanoparticles were mixed with a lead-free Sn-3.5Ag-0.7Cu solder paste. This new form of nano-reinforced lead-free solder paste was used to assemble a miniature package consisting of an ultra-fine capacitor on a printed circuit board by means of a reflow soldering process. The microstructure and the fillet height were investigated using a focused ion beam, a high-resolution transmission electron microscope system equipped with an energy dispersive X-ray spectrometer (EDS), and a field emission scanning electron microscope coupled with an EDS and X-ray diffraction machine. Findings The experimental results revealed that the intermetallic compound with the lowest thickness was produced by the nano-reinforced solder with a TiO2 content of 0.05 Wt.%. Increasing the TiO2 content to 0.15 Wt.% led to an improvement in the fillet height. The characteristics of the solder joint fulfilled the reliability requirements of the IPC standards. Practical implications This study provides engineers with a profound understanding of the characteristics of ultra-fine nano-reinforced solder joint packages in the microelectronics industry. Originality/value The findings are expected to provide proper guidelines and references with regard to the manufacture of miniaturized electronic packages. This study also explored the effects of TiO2 on the microstructure and the fillet height of ultra-fine capacitors.

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