scholarly journals The Influence Of Process Parameters On The Surface Roughness Of The 3d Printed Part In FDM Process

Author(s):  
Pulla Sammaiah ◽  
K. Rushmamanisha ◽  
N. Praveenadevi ◽  
I. Rajasri Reddy
2004 ◽  
Vol 471-472 ◽  
pp. 790-794 ◽  
Author(s):  
Li Fa Han ◽  
Wei Xia ◽  
Yuan Yuan Li ◽  
Wei Ping Chen

This paper presents an investigation on the surface roughness of burnished hypereutectic Al-Si alloy ¾ a widely used light-weight and wear resistant material in automobile, electric and aircraft industries. Based on the techniques of Taguchi, an orthogonal experiment plan with the analysis of variance (ANOVA) is performed and a second-order regressive mathematical model is established. Meanwhile, the influence of process parameters on surface roughness and its mechanism are discussed. From the experiments, it is found that burnishing process is effective to decrease surface roughness of hypereutectic Al-Si alloy components, in which, all input parameters have a significant effect on the surface roughness. To achieve a small surface roughness, the optimum process parameters are recommended.


2017 ◽  
Vol 31 (07) ◽  
pp. 1750059 ◽  
Author(s):  
Zhengguo Shang ◽  
Dongling Li ◽  
She Yin ◽  
Shengqiang Wang

Since molybdenum (Mo) thin film has been used widely recently, it attracts plenty of attention, like it is a good candidate of back contact material for CuIn[Formula: see text]Ga[Formula: see text]Se[Formula: see text]S[Formula: see text] (CIGSeS) solar cells development; thanks to its more conductive and higher adhesive property. Besides, molybdenum thin film is an ideal material for aluminum nitride (AlN) thin film preparation and attributes to the tiny (−1.0%) lattice mismatch between Mo and AlN. As we know that the quality of Mo thin film is mainly dependent on process conditions, it brings a practical significance to study the influence of process parameters on Mo thin film properties. In this work, various sputtering conditions are employed to explore the feasibility of depositing a layer of molybdenum film with good quality by DC reactive magnetron sputtering. The influence of process parameters such as power, gas flow, substrate temperature and process time on the crystallinity and crystal orientation of Mo thin films is investigated. X-ray diffraction (XRD) measurements and atomic force microscope (AFM) are used to characterize the properties and surface roughness, respectively. According to comparative analysis on the results, process parameters are optimized. The full width at half maximum (FWHM) of the rocking curves of the (110) Mo is decreased to 2.7[Formula: see text], and the (110) Mo peaks reached [Formula: see text] counts. The grain size and the surface roughness have been measured as 20 Å and 3.8 nm, respectively, at 200[Formula: see text]C.


2013 ◽  
Vol 325-326 ◽  
pp. 1357-1361 ◽  
Author(s):  
Yan Hua Huang ◽  
Dong Xi Lv ◽  
Yong Jian Tang ◽  
Hong Xiang Wang ◽  
Hai Jun Zhang

Experiments were carried out to study the effect of ultrasonic vibration on the surface roughness and subsurface damage (SSD) in rotary ultrasonic machining (RUM) of glass BK7. As a comparison, some conventional grinding (CG) experiments were also performed under the same process parameters with there of the RUM ones. The surface roughness of the RUM/CG samples was measured with a surface profilometer. The SSD of these specimens was assessed and characterized by a measuring microscope with the help of the taper polishing method. Also, the influence of process parameters (cutting depth, feed speed, and spindle speed) on the surface/subsurface quality was discussed. As a result, both the surface roughness and the SSD depth of the RUM/CG specimens were reduced with the increased spindle speed, while increased with the increasing of feed speed and cutting depth of the diamond tool. Compared with the CG process, the introduction of ultrasonic vibration resulted in the higher surface roughness and SSD depth, due to the fact that the max cutting depth of the abrasive in the RUM process increased by an amplitude compared with that in the CG process.


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