Effect of low-temperature plasma on the degradation of omethoate residue and quality of apple and spinach

2018 ◽  
Vol 20 (4) ◽  
pp. 044004 ◽  
Author(s):  
Xingmin SHI ◽  
Jinren LIU ◽  
Guimin XU ◽  
Yueming WU ◽  
Lingge GAO ◽  
...  
2018 ◽  
Vol 2018 (1) ◽  
pp. 000728-000733
Author(s):  
Piotr Mackowiak ◽  
Rachid Abdallah ◽  
Martin Wilke ◽  
Jash Patel ◽  
Huma Ashraf ◽  
...  

Abstract In the present work we investigate the quality of low temperature Plasma Enhanced Chemical Vapor Deposition (PECVD) and plasma treated Tetraethyl orthosilicate (TEOS)-based TSV-liner films. Different designs of Trough Silicon Via (TSV) Test structures with 10μm and 20μm width and a depth of 100μm have been fabricated. Two differently doped silicon substrates have been used – highly p-doped and moderately doped. The results for break-through, resistivity and capacitance for the 20μm structures show a better performance compared to the 10μm structures. This is mainly due to increased liner thickness in the reduced aspect ratio case. Lower interface traps and oxide charge densities have been observed in the C-V measurements results for the 10μm structures.


2014 ◽  
Vol 567 ◽  
pp. 012034 ◽  
Author(s):  
Ruz R Saubanov ◽  
V V Zvezdin ◽  
I H Israfilov ◽  
I I Haybullin ◽  
R R Rakhimov

2011 ◽  
Vol 39 (7) ◽  
pp. 1591-1597 ◽  
Author(s):  
Xing-Min Shi ◽  
Guan-Jun Zhang ◽  
Xi-Li Wu ◽  
Ya-Xi Li ◽  
Yue Ma ◽  
...  

2019 ◽  
Vol 23 (3) ◽  
pp. 746-754
Author(s):  
Dinar Dilshatovich Fazullin ◽  
Gennady Vitalievich Mavrin ◽  
Vladislav Olegovich Dryakhlov ◽  
Ildar Gilmanovich Shaikhiev ◽  
Irek Rashatovich Nizameyev

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