Experimental analyses of intra- and intersexual competition in red-winged blackbirds

This chapter discusses sex differences in intersexual competition and describes particularly the consequences of such competition for conflict between the sexes, as well as for sex differences in mate guarding and, relatedly, in the types of infidelity that evoke jealousy, including online infidelity. It also discusses individual differences in jealousy as related to attachment styles and describes the effects of height, hormones, and the menstrual cycle on jealousy. Next, the chapter moves on to intrasexual competition and discusses, among other topics, intrasexual competition among men and among women, the role of sex differences in rival characteristics in evoking jealousy, the role of attachment styles and hormones, and individual differences in intrasexual competitiveness.

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Crack detection in a rotary shaft analytical and experimental analyses: A review

Materials Today Proceedings ◽

10.1016/j.matpr.2021.05.536 ◽

2021 ◽

Author(s):

Vinod M. Bansode ◽

Manish Billore

Keyword(s):

Crack Detection ◽

Experimental Analyses

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Thermodynamic and Experimental Analyses of the Carbothermic Reduction of Tungsten Slag

JOM ◽

10.1007/s11837-021-04671-5 ◽

2021 ◽

Author(s):

Chunfa Liao ◽

Sui Xie ◽

Xu Wang ◽

Baojun Zhao ◽

Boqing Cai ◽

...

Keyword(s):

Carbothermic Reduction ◽

Experimental Analyses

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Theoretical and experimental analyses of the internal leakage in single-screw expanders

International Journal of Refrigeration ◽

10.1016/j.ijrefrig.2017.10.037 ◽

2018 ◽

Vol 86 ◽

pp. 273-281 ◽

Cited By ~ 14

Author(s):

Lili Shen ◽

Wei Wang ◽

Yuting Wu ◽

Liang Cheng ◽

Biao Lei ◽

...

Keyword(s):

Single Screw ◽

Experimental Analyses

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Achieving High Flatness of Workpiece Edge Shape by Considering Polishing Pressure

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.447-448.71 ◽

2010 ◽

Vol 447-448 ◽

pp. 71-75

Author(s):

Takahiro Miyake ◽

Toshiyuki Enomoto

Keyword(s):

Semiconductor Devices ◽

Silicon Wafers ◽

Polishing Process ◽

Model Based ◽

Polishing Pad ◽

Experimental Analyses ◽

Polishing Pads ◽

Polishing Pressure

In recent years, the achievement of further high flatness of workpiece edge shape is strongly required in mirror finishing. Especially, the edge roll off of silicon wafers as the substrates of semiconductor devices is demanded to decrease in the polishing process for raising the yield of IC chips. Many theoretical and experimental analyses for the edge roll off generation have been already done to meet the demand. The analyses, however, cannot fully account for the obtained edge shape in actual polishing. Concretely, the influence of the polishing pressure as one of the key polishing conditions on the edge roll off has not been clarified. In this study, the influence of the polishing pressure on the edge shape was investigated by the polishing experiments and the edge roll off generation analyses using the model based on the viscoelasticity of the polishing pad, which was proposed in the previous study. And it was revealed that an appropriate polishing pressure is needed to be set for achieving high flatness of workpiece edge shape with the consideration of the properties of applied polishing pads.

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