Enhanced thermal fatigue endurance and lifetime prediction of lead‐free LGA joints in LTCC modules

Soldering & Surface Mount Technology ◽

10.1108/09540911111120177 ◽

2011 ◽

Vol 23 (2) ◽

pp. 104-114 ◽

Author(s):

O. Nousiainen ◽

O. Salmela ◽

J. Putaala ◽

T. Kangasvieri

Keyword(s):

Thermal Fatigue ◽

Lead Free ◽

Lifetime Prediction ◽

Fatigue Endurance

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Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

Journal of Electronic Materials ◽

10.1007/s11664-009-0772-9 ◽

2009 ◽

Vol 38 (6) ◽

pp. 843-851 ◽

Author(s):

Olli Nousiainen ◽

Tero Kangasvieri ◽

Risto Rautioaho ◽

Jouko Vähäkangas

Keyword(s):

Thermal Fatigue ◽

Composite Solder ◽

Solder Joints ◽

Lead Free ◽

Temperature Range ◽

Fatigue Endurance

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Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

MATERIALS TRANSACTIONS ◽

10.2320/matertrans.42.809 ◽

2001 ◽

Vol 42 (5) ◽

pp. 809-813 ◽

Author(s):

Young-Eui Shin ◽

Kyung-Woo Lee ◽

Kyong-Ho Chang ◽

Seung-Boo Jung ◽

Jae Pil Jung

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Fatigue Life ◽

Thermal Fatigue ◽

Solder Joints ◽

Lead Free ◽

Element Analysis ◽

Thermal Fatigue Life

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Lifetime prediction of viscoplastic lead-free solder: A new solder material, SACQ

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936754 ◽

2017 ◽

Author(s):

Tung Ching Lui

Keyword(s):

Lead Free ◽

Lifetime Prediction ◽

Lead Free Solder ◽

Solder Material ◽

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Lifetime prediction for thermal fatigue: development of a stochastic model

Low Cycle Fatigue and Elasto-Plastic Behaviour of Materials—3 ◽

10.1007/978-94-011-2860-5_131 ◽

1992 ◽

pp. 829-834

Author(s):

E. Kullig ◽

H. Riesch-Oppermann ◽

T. Winkler ◽

A. Brückner-Foit

Keyword(s):

Stochastic Model ◽

Thermal Fatigue ◽

Lifetime Prediction ◽

Fatigue Development

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Effect of Ag content on microstructure and fatigue crack of SAC lead-free solder balls under rapid thermal fatigue

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202979 ◽

2020 ◽

Author(s):

Huadong Cao ◽

Guisheng Gan ◽

Mizhe Tian ◽

Liujie Jiang ◽

Cong Liu ◽

...

Keyword(s):

Fatigue Crack ◽

Thermal Fatigue ◽

Lead Free ◽

Lead Free Solder ◽

Solder Balls ◽

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A strain-energy-density-based lifetime prediction model for notched specimens: Polycarbonate under thermal fatigue

Strength of Materials ◽

10.1007/bf02523162 ◽

1998 ◽

Vol 30 (6) ◽

pp. 582-590

Author(s):

D. Dossou ◽

Z. Azari ◽

G. Pluvinage

Keyword(s):

Energy Density ◽

Prediction Model ◽

Thermal Fatigue ◽

Strain Energy Density ◽

Strain Energy ◽

Lifetime Prediction ◽

Notched Specimens

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Investigation of the Effect of PCB Base Materials and Pad Surface Finish on the Thermal Fatigue Life of Lead-free Solder Joints of PBGA and Passive Resistors

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430585 ◽

2006 ◽

Author(s):

Fubin Song ◽

S. W. Ricky Lee ◽

Michael Osterman ◽

Michael Pecht

Keyword(s):

Fatigue Life ◽

Thermal Fatigue ◽

Surface Finish ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Base Materials ◽

Thermal Fatigue Life ◽

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The Effect of Inter-metallic Compound on Thermal Fatigue Reliability of Lead-Free Solder Joints(Electronic Devices)

Proceedings of the Asian Pacific Conference on Fracture and Strength and International Conference on Advanced Technology in Experimental Mechanics ◽

10.1299/jsmeatemapcfs.2.01.03.0_935 ◽

2001 ◽

Vol 2.01.03 (0) ◽

pp. 935-940

Author(s):

Masaki SHIRATORI ◽

Qiang YU ◽

Do-Seop KIM

Keyword(s):

Thermal Fatigue ◽

Solder Joints ◽

Electronic Devices ◽

Lead Free ◽

Lead Free Solder ◽

Fatigue Reliability ◽

Inter Metallic Compound ◽

Metallic Compound ◽

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Thermal Fatigue Life Estimation of Lead-Free Solder Using Inelastic Constitutive Model

The proceedings of the JSME annual meeting ◽

10.1299/jsmemecjo.2002.6.0_283 ◽

2002 ◽

Vol 2002.6 (0) ◽

pp. 283-284

Author(s):

Hiroyuki TAKAHASHI ◽

Takashi KAWAKAMI ◽

Minoru MUKAI ◽

Mineo KOBAYASHI ◽

Nobutada OHNO ◽

...

Keyword(s):

Fatigue Life ◽

Constitutive Model ◽

Thermal Fatigue ◽

Lead Free ◽

Lead Free Solder ◽

Life Estimation ◽

Thermal Fatigue Life ◽

Fatigue Life Estimation ◽

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J0601-5-5 Application of Synchrotron Radiation X-ray Micro-tomography to Nondestructive Observation of Thermal Fatigue Cracks in Lead-free Chip Resistor Interconnects

The proceedings of the JSME annual meeting ◽

10.1299/jsmemecjo.2010.7.0_291 ◽

2010 ◽

Vol 2010.7 (0) ◽

pp. 291-292

Author(s):

Hiroyuki Tsuritani ◽

Toshihiko Sayama ◽

Yoshiyuki Okamoto ◽

Takeshi Takayanagi ◽

Kentaro Uesugi ◽

...

Keyword(s):

Synchrotron Radiation ◽

Thermal Fatigue ◽

Fatigue Cracks ◽

Lead Free ◽

X Ray ◽

Micro Tomography ◽

Thermal Fatigue Cracks

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