Study of the effect of the demagnetizing field in Epstein strips of grain-oriented electrical steels through 3D finite element analysis

Author(s):  
Leysmir Adriana Millan Mirabal ◽  
Oualid Messal ◽  
Abdelkader Benabou ◽  
Yvonnick Le Menach ◽  
Loic Chevallier ◽  
...  

Purpose The purpose of this study is to explore the effect of the demagnetizing field in the Epstein characterization of grain-oriented electrical steels through a finite element method (FEM) simulations. Design/methodology/approach A 3D finite element simulation has been realized to represent the parallel and X-stacking configurations in the Epstein frame. The numerical results have been compared with experimental measures. Findings In a parallel configuration, the measured induction is actually the one in the material, whereas the resulting magnetic field differs from the applied one (in magnitude and angle) due to the shape anisotropy (demagnetizing field). In X-stacking configuration, the resulting magnetic field is close to the applied magnetic field (and then the supposed excitation field in the Epstein frame), whereas the magnetic induction has deviated from the axis of the strips. Originality/value Both stacking configurations (parallel and cross) of the Epstein frame are analyzed by three-dimensional finite element simulation.

2017 ◽  
Vol 29 (3) ◽  
pp. 151-155 ◽  
Author(s):  
Liang Zhang ◽  
Zhi-quan Liu ◽  
Fan Yang ◽  
Su-juan Zhong

Purpose This paper aims to investigate Cu/SnAgCu/Cu transient liquid phase (TLP) bonding with different thicknesses for three-dimensional (3D) integrated circuit (IC). Design/methodology/approach This paper includes experiments and finite element simulation. Findings The growth rate of the intermetallic compound layer during TLP soldering was calculated to be 0.6 μm/s, and the small scallop-type morphology Cu6Sn5 grains can be observed. With the decrease in thickness in solder joint, the thickness of intermetallic compounds represents the same size and morphology, but the size of eutectic particles (Ag3Sn, Cu6Sn5) in the matrix microstructure decrease obviously. It is found that with the increase in thickness, the tensile strength drops obviously. Based on finite element simulation, the smaller value of von Mises demonstrated that the more reliability of lead-free solder joints in 3D IC. Originality/value The Cu/SnAgCu/CuTLPbondingwithdifferentthicknessesfor3D IC was investigated.


2018 ◽  
Vol 24 (6) ◽  
pp. 1003-1011 ◽  
Author(s):  
Gregory Taylor ◽  
Xin Wang ◽  
Leah Mason ◽  
Ming C. Leu ◽  
K. Chandrashekhara ◽  
...  

Purpose The purpose of this paper is to study the flexural behavior of additively manufacture Ultem 1010 parts. Fused deposition modeling (FDM) process has become one of most widely used additive manufacturing methods. The process provides the capability of fabricating complicated shapes through the extrusion of plastics onto a print surface in a layer-by-layer structure to build three-dimensional parts. The flexural behavior of FDM parts are critical for the evaluation and optimization of both material and process. Design/methodology/approach This study focuses on the performance of FDM solid and sparse-build Ultem 1010 specimens. Flexure tests (three-point bend) are performed on solid-build coupons with varying build orientation and raster angle. These parameters are investigated through a full-factorial design of experiments (DOE) to determine optimal build parameters. Air gap, raster width and contour width are held constant. A three-dimensional nonlinear finite element model is built to simulate the flexural behavior of the FDM parts. Findings Experimental results include flexure properties such as yield strength and modulus, as well as analysis of the effect of change in build parameters on material properties. The sparse-build FDM parts chosen from the experimental tests are simulated based on this developed model. Thermo-mechanical simulation results show that the finite element simulation and experimental tests are in good agreement. The simulation can be further extended to other complicated FDM parts. Originality/value From the DOE study, sparse-build coupons with specific build parameters are fabricated and tested for the validation of a finite element simulation.


2019 ◽  
Vol 13 (2) ◽  
pp. 181-188
Author(s):  
Meng Liu ◽  
Guohe Li ◽  
Xueli Zhao ◽  
Xiaole Qi ◽  
Shanshan Zhao

Background: Finite element simulation has become an important method for the mechanism research of metal machining in recent years. Objective: To study the cutting mechanism of hardened 45 steel (45HRC), and improve the processing efficiency and quality. Methods: A 3D oblique finite element model of traditional turning of hardened 45 steel based on ABAQUS was established in this paper. The feasibility of the finite element model was verified by experiment, and the influence of cutting parameters on cutting force was predicted by single factor experiment and orthogonal experiment based on simulation. Finally, the empirical formula of cutting force was fitted by MATLAB. Besides, a lot of patents on 3D finite element simulation for metal machining were studied. Results: The results show that the 3D oblique finite element model can predict three direction cutting force, the 3D chip shape, and other variables of metal machining and the prediction errors of three direction cutting force are 5%, 9.02%, and 8.56%. The results of single factor experiment and orthogonal experiment are in good agreement with similar research, which shows that the model can meet the needs for engineering application. Besides, the empirical formula and the prediction results of cutting force are helpful for the parameters optimization and tool design. Conclusion: A 3D oblique finite element model of traditional turning of hardened 45 steel is established, based on ABAQUS, and the validation is carried out by comparing with experiment.


2014 ◽  
Vol 891-892 ◽  
pp. 1675-1680
Author(s):  
Seok Jae Chu ◽  
Cong Hao Liu

Finite element simulation of stable fatigue crack growth using critical crack tip opening displacement (CTOD) was done. In the preliminary finite element simulation without crack growth, the critical CTOD was determined by monitoring the ratio between the displacement increments at the nodes above the crack tip and behind the crack tip in the neighborhood of the crack tip. The critical CTOD was determined as the vertical displacement at the node on the crack surface just behind the crack tip at the maximum ratio. In the main finite element simulation with crack growth, the crack growth rate with respect to the effective stress intensity factor range considering crack closure yielded more consistent result. The exponents m in the Paris law were determined.


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