The Feasibility of Ultrasonically Bonding Surface Mount Components to Printed Circuit Boards

Circuit World ◽  
1989 ◽  
Vol 15 (3) ◽  
pp. 33-39 ◽  
Author(s):  
E. Goold
1994 ◽  
Vol 116 (4) ◽  
pp. 282-289 ◽  
Author(s):  
Yu-Wen Huang ◽  
K. Srihari ◽  
Jim Adriance ◽  
George Westby

The placement of surface mount components is a time consuming and critical task in the assembly of surface mount Printed Circuit Boards (PCBs). The focus of this research was the identification of “near optimal” solutions for the placement sequence identification problem. The factors considered include the placement machine and the specific PCB, the feeder space available, the need for tooling and nozzle changes, and the actual traveling path of the placement head. Expert (or knowledge based) systems were used as the solution method for this problem. The system developed can cope with single PCBs, panels, 180 deg offset boards (panels), and multiple PCB batches. The prototype knowledge based system developed in this research identifies solutions in (almost) realtime.


Circuit World ◽  
1988 ◽  
Vol 14 (2) ◽  
pp. 11-15 ◽  
Author(s):  
M.M.F. Verguld ◽  
M.H.W. Leenaerts

Media-N ◽  
2019 ◽  
Vol 15 (2) ◽  
pp. 1-4
Author(s):  
Taylor Hokanson ◽  
Nick Bontrager

In this workshop, Professors Nick Bontrager and Taylor Hokanson introduce the tools and services required to fabricate printed circuit boards, or PCBs. The process is more accessible than ever before, and is cheap enough to allow individuals to obtain functional prototypes, in small quantities, that are indistinguishable from similar PCBs that might be produced in the hundreds of thousands for industry or commercial applications. Using an “unpopulated” demonstration board designed by the workshop co-chairs, participants walk through all the steps needed to assemble and solder surface-mount components, finishing the event with a battery-operated, wearable, LED light display.


2011 ◽  
Vol 341-342 ◽  
pp. 411-415
Author(s):  
Ping Liu ◽  
Xiao Long Gu ◽  
Xin Bing Zhao ◽  
Xiao Gang Liu

The complexity of Printed Circuit Boards (PCBs) has increased dramatically over the last three decades with the development of surface mount technology (SMT). The typical manufacture of rigid multilayer PCB contains many process procedures, which makes manufacture and application much more challenges. This paper focuses on some typical PCB related failures. Recommendations are provided on optimizing PCB manufacture process and material application. Microvia crack, black pad, galvanic attack, pad design, conductive anodic filament and pad crater are presented in detail.


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