Infrared solder joint inspection on surface mount printed circuit boards

Author(s):  
R.Z. Liu ◽  
Y.Q. Shi ◽  
W.F. Kosonocky ◽  
F.P. Higgins
1994 ◽  
Vol 116 (4) ◽  
pp. 282-289 ◽  
Author(s):  
Yu-Wen Huang ◽  
K. Srihari ◽  
Jim Adriance ◽  
George Westby

The placement of surface mount components is a time consuming and critical task in the assembly of surface mount Printed Circuit Boards (PCBs). The focus of this research was the identification of “near optimal” solutions for the placement sequence identification problem. The factors considered include the placement machine and the specific PCB, the feeder space available, the need for tooling and nozzle changes, and the actual traveling path of the placement head. Expert (or knowledge based) systems were used as the solution method for this problem. The system developed can cope with single PCBs, panels, 180 deg offset boards (panels), and multiple PCB batches. The prototype knowledge based system developed in this research identifies solutions in (almost) realtime.


2010 ◽  
Vol 97-101 ◽  
pp. 2940-2943 ◽  
Author(s):  
Nang Seng Siri Mar ◽  
Clinton Fookes ◽  
K.D.V. Yarlagadda Prasad

This paper proposes the validity of a Gabor filter bank for feature extraction of solder joint images on Printed Circuit Boards (PCBs). A distance measure based on the Mahalanobis Cosine metric is also presented for classification of five different types of solder joints. From the experimental results, this methodology achieved high accuracy and a well generalised performance. This can be an effective method to reduce cost and improve quality in the production of PCBs in the manufacturing industry.


Circuit World ◽  
1988 ◽  
Vol 14 (2) ◽  
pp. 11-15 ◽  
Author(s):  
M.M.F. Verguld ◽  
M.H.W. Leenaerts

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