A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem

1994 ◽  
Vol 116 (4) ◽  
pp. 282-289 ◽  
Author(s):  
Yu-Wen Huang ◽  
K. Srihari ◽  
Jim Adriance ◽  
George Westby

The placement of surface mount components is a time consuming and critical task in the assembly of surface mount Printed Circuit Boards (PCBs). The focus of this research was the identification of “near optimal” solutions for the placement sequence identification problem. The factors considered include the placement machine and the specific PCB, the feeder space available, the need for tooling and nozzle changes, and the actual traveling path of the placement head. Expert (or knowledge based) systems were used as the solution method for this problem. The system developed can cope with single PCBs, panels, 180 deg offset boards (panels), and multiple PCB batches. The prototype knowledge based system developed in this research identifies solutions in (almost) realtime.

Circuit World ◽  
1988 ◽  
Vol 14 (2) ◽  
pp. 11-15 ◽  
Author(s):  
M.M.F. Verguld ◽  
M.H.W. Leenaerts

Author(s):  
Vincent Charles ◽  
Mukesh Kumar ◽  
Irene Kavitha Charles

The Printed Circuit Board (PCB) assembling production process is generally optimized to ensure very low levels of production errors (defects) so as to assure a higher quality product. In view of the number of components and solder joints in the products, and the very high demands placed on quality, the operation of this process is critical to the success of the products that are manufactured. A special class of the efficiency identification problem considered in this case relates to the occurrence of different kinds of production errors during the assembling process of the PCBs. However, the process of assembling often gets influenced by certain factors, which make some of the assembled PCBs to be defective. This chapter addresses the efficiency identification problem of a teleprinter-manufacturing company that assembles PCBs. The technique of Data Envelopment Analysis (DEA) is used to assess the efficiency of different types of PCBs.


Author(s):  
A A West ◽  
D J Williams ◽  
C J Hinde

The application of conventional and intelligent control paradigms to the dispensing of adhesive in the manufacture of mixed technology printed circuit boards, a real process with real time constraints and error conditions, is outlined in this paper. A description of the process and its various operation and error states is followed by a brief discussion of the application of conventional (system identification and incremental proportional control) and intelligent (knowledge-based, fuzzy logic and neural network) controllers to the system. Comments on the control and timing performance of each paradigm are given.


Media-N ◽  
2019 ◽  
Vol 15 (2) ◽  
pp. 1-4
Author(s):  
Taylor Hokanson ◽  
Nick Bontrager

In this workshop, Professors Nick Bontrager and Taylor Hokanson introduce the tools and services required to fabricate printed circuit boards, or PCBs. The process is more accessible than ever before, and is cheap enough to allow individuals to obtain functional prototypes, in small quantities, that are indistinguishable from similar PCBs that might be produced in the hundreds of thousands for industry or commercial applications. Using an “unpopulated” demonstration board designed by the workshop co-chairs, participants walk through all the steps needed to assemble and solder surface-mount components, finishing the event with a battery-operated, wearable, LED light display.


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