Reactivity of no-clean pastes and fluxes for the surface mount technology process—part II: Corrosion risk measurements for printed circuit boards and solder joints

1995 ◽  
Vol 24 (4) ◽  
pp. 371-378
Author(s):  
P. L. Cavallotti ◽  
G. Zangari ◽  
V. Sirtori ◽  
A. Manara
Keyword(s):  
Printed Circuit Boards ◽  
Solder Joints ◽  
Surface Mount Technology ◽  
Circuit Boards ◽  
Surface Mount ◽  
Printed Circuit ◽  
Technology Process ◽  
Corrosion Risk ◽  
Risk Measurements

PCB Related Failures in Electronic Assemblies

2011 ◽  
Vol 341-342 ◽  
pp. 411-415
Author(s):  
Ping Liu ◽  
Xiao Long Gu ◽  
Xin Bing Zhao ◽  
Xiao Gang Liu
Keyword(s):  
Printed Circuit Boards ◽  
Surface Mount Technology ◽  
Circuit Boards ◽  
Surface Mount ◽  
Printed Circuit ◽  
Process Procedures ◽  
Manufacture Process ◽  
Black Pad ◽  
Conductive Anodic Filament ◽  
Electronic Assemblies

The complexity of Printed Circuit Boards (PCBs) has increased dramatically over the last three decades with the development of surface mount technology (SMT). The typical manufacture of rigid multilayer PCB contains many process procedures, which makes manufacture and application much more challenges. This paper focuses on some typical PCB related failures. Recommendations are provided on optimizing PCB manufacture process and material application. Microvia crack, black pad, galvanic attack, pad design, conductive anodic filament and pad crater are presented in detail.

A study of the strength and shape of surface mount technology leadless chip solder joints

1997 ◽  
Vol 211 (1) ◽  
pp. 29-41 ◽  
Author(s):  
I. K. Hui ◽  
B Ralph
Keyword(s):  
Printed Circuit Boards ◽  
Failure Modes ◽  
Solder Joints ◽  
Circuit Board ◽  
Surface Mount Technology ◽  
Surface Mount ◽  
Printed Circuit ◽  
Wave Soldering ◽  
Infra Red

A method that directly pulled the components off printed circuit boards was used as a means for testing the bond quality of surface mount technology leadless chip solder joints. Components D7243, CC1206, RC1206, RC1210 and CC1812 were selected for the study. It was found that the ultimate tensile force that breaks a component off the printed circuit board has the potential to be used as a parameter for measuring the quality of the solder joint. The failure modes of the joints were recorded and are discussed. The effect of solder thickness on the strength of a joint has also been investigated. The shape of joints soldered by two methods, wave soldering and infra-red reflow, were compared. Joints at the two ends of a component produced by infra-red reflow were found to be more uniform than the ones produced by wave soldering. A recommendation is made here for the wave soldering approach in achieving uniform solder joints. The effects of solder shape on the joint strength were further investigated by finite element analysis. A convex joint was found to be marginally more robust than a concave joint.

scholarly journals Model for Improvement of Fluxing Process on Selective Soldering Machines (model 6747)

2015 ◽  
Vol 1 (1) ◽  
pp. 269-273
Author(s):  
Goran Tasevski ◽  
Elena Papazoska
Keyword(s):  
Associated Factors ◽  
Printed Circuit Boards ◽  
Surface Mount Technology ◽  
Circuit Boards ◽  
High Quality ◽  
Printed Circuit ◽  
Soldering Process ◽  
Technology Process ◽  
Gain Reduction ◽  
Set Up

AbstractSelective soldering is the process of soldering components to printed circuit boards that could not be treated in a reflow oven in a traditional surface-mount technology process due to thermal shock and damaging. Process of flux appliance as a first step of the selective soldering process sets the baseline for achieving high quality and robustness of the soldered joints.Purpose of this research is to identify the factors that directly influence the effectiveness of the fluxing process in selective soldering machines, using the design of experiment methodology with associated factors and levels used in the experiment. Final findings gives directions for set up of the optimal fluxing parameters that will enable appropriate flux appliance and to gain reduction of soldering quality issues which foundations are from this process.

Intelligent detection of solder joints on printed circuit boards

2011 ◽  
Vol 19 (9) ◽  
pp. 2154-2162 ◽  
Author(s):  
谢宏威 XIE Hong-wei ◽  
张宪民 ZHANG Xian-min ◽  
邝泳聪 KUANG Yong-cong ◽  
欧阳高飞 OUYANG Gao-fei
Keyword(s):  
Printed Circuit Boards ◽  
Solder Joints ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Intelligent Detection

A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem

1994 ◽  
Vol 116 (4) ◽  
pp. 282-289 ◽  
Author(s):  
Yu-Wen Huang ◽  
K. Srihari ◽  
Jim Adriance ◽  
George Westby
Keyword(s):  
Printed Circuit Boards ◽  
Solution Method ◽  
Identification Problem ◽  
Circuit Boards ◽  
Surface Mount ◽  
Printed Circuit ◽  
Knowledge Based ◽  
Sequence Identification ◽  
Placement Machine ◽  
Solution Methodology

The placement of surface mount components is a time consuming and critical task in the assembly of surface mount Printed Circuit Boards (PCBs). The focus of this research was the identification of “near optimal” solutions for the placement sequence identification problem. The factors considered include the placement machine and the specific PCB, the feeder space available, the need for tooling and nozzle changes, and the actual traveling path of the placement head. Expert (or knowledge based) systems were used as the solution method for this problem. The system developed can cope with single PCBs, panels, 180 deg offset boards (panels), and multiple PCB batches. The prototype knowledge based system developed in this research identifies solutions in (almost) realtime.

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